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    Probe head and probe card having same
    53.
    发明授权
    Probe head and probe card having same 有权

    公开(公告)号：US11852656B2

    公开(公告)日：2023-12-26

    申请号：US17214785

    申请日：2021-03-26

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

    IPC: G01R1/073

    CPC classification number: G01R1/07342

    Abstract: Proposed is a probe head having a probe card for performing a circuit inspection of a wafer. More particularly, proposed are a probe head and a probe card having the probe head, the probe head having a guide plate. The guide plate has a guide hole and a shield portion composed of a metal material positioned at the periphery of the guide hole, thereby blocking signal interference that may be occurred between adjacent probes.

    ELECTRICALLY CONDUCTIVE CONTACT PIN, INSPECTION APPARATUS, AND MOLDED PRODUCT
    54.
    发明公开
    ELECTRICALLY CONDUCTIVE CONTACT PIN, INSPECTION APPARATUS, AND MOLDED PRODUCT 审中-公开

    公开(公告)号：US20230384346A1

    公开(公告)日：2023-11-30

    申请号：US18031607

    申请日：2021-10-07

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

    IPC: G01R1/04 ,  H01R13/24 ,  H01R43/16

    CPC classification number: G01R1/0408 ,  H01R13/2407 ,  H01R43/16

    Abstract: Proposed are an electrically conductive contact pin, a method for manufacturing the same, an inspection apparatus, a method for manufacturing a molded product, and a molded product manufactured thereby. More specifically, proposed are: a method for manufacturing an electrically conductive contact pin, the method including the steps of providing an anodic aluminum oxide mold made of an anodic aluminum oxide film and having openings formed by etching at least partial regions of the anodic aluminum oxide mold to correspond to a shape of electrically conductive contact pins, forming a metal filler in each of the openings, and removing the anodic aluminum oxide mold; an electrically conductive contact pin including at least one micro-convex portion and a plurality of fine trenches; an inspection apparatus; a method for manufacturing a molded product; and a molded product manufactured thereby.

    Multilayer ceramic substrate and probe card including same
    56.
    发明授权
    Multilayer ceramic substrate and probe card including same 有权

    公开(公告)号：US11651904B2

    公开(公告)日：2023-05-16

    申请号：US17873020

    申请日：2022-07-25

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: H01G4/40 ,  H01G4/12

    CPC classification number: H01G4/40 ,  H01G4/12

    Abstract: A multilayer structure includes a first insulating layer including a first body of an anodized oxide material, a first via conductor penetrating through the first body, and a first internal wiring layer electrically connected to the first via conductor, a second insulating layer including a second body of the anodized oxide material, a second via conductor penetrating through the second body, and a second connection pad electrically connected to the second via conductor, and a solder hump provided on one of the first internal wiring layer and the second connection pad and between the first insulating layer and the second insulating layer. The first via conductor, the first internal wiring layer, the second connection pad, and the second via conductor are electrically connected to each other through the solder bump.

    Multilayer ceramic substrate and probe card including same
    59.
    发明授权
    Multilayer ceramic substrate and probe card including same 有权

    公开(公告)号：US11437196B2

    公开(公告)日：2022-09-06

    申请号：US16776134

    申请日：2020-01-29

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: H01G4/40 ,  H01G4/12

    Abstract: A multilayer ceramic substrate includes a first insulating portion including a body of a ceramic material, a first via conductor penetrating through the body, and a first internal wiring layer and a first connection pad connected to the first via conductor, and a second insulating portion including a body of an anodized oxide material, a second via conductor penetrating through the body, and a second internal wiring layer and a second connection pad connected to the second via conductor.

    System for transferring micro LED
    60.
    发明授权
    System for transferring micro LED 有权

    公开(公告)号：US11337347B2

    公开(公告)日：2022-05-17

    申请号：US16414521

    申请日：2019-05-16

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: H05K13/04 ,  H01L27/32 ,  H01L33/00 ,  H01L33/08 ,  H01L33/36

    Abstract: A system for transferring a micro LED includes a micro LED dropped into a solution. The system further includes a micro LED grip body immersed in the solution, the micro LED grip body including a porous member having pores, and gripping the micro LED with a grip surface where the pores are provided. An upper surface of the porous member is configured with a seating recess having a guide inclined portion on which the micro LED is mounted and a shielding portion provided around the seating recess.

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