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公开(公告)号:US10077517B2
公开(公告)日:2018-09-18
申请号:US13794135
申请日:2013-03-11
Applicant: Apple Inc.
Inventor: James C. Whitley , John J. Baker , Kathryn P. Crews , Yoji Hamada
CPC classification number: D04H1/74 , D04H1/62 , Y10T428/2481
Abstract: Embodiments described herein may take the form of a textile fabric, including: a first region defined by a first plurality of textile fibers; a second region adjacent the first region and being formed from a second plurality of textile fibers and a hot melt material adjacent the second plurality of textile fibers; wherein the first region is free of hot melt material. Other embodiments may take the form of a method for fabricating a textile product, including the operations of: applying heat to a textile having associated hot melt fibers, thereby melting the hot melt fibers; modifying a mechanical property of a portion of the textile by introducing a solvent to the textile; and stopping an action of the solvent on the textile when the mechanical property reaches a target.
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公开(公告)号:US20170254006A1
公开(公告)日:2017-09-07
申请号:US15598146
申请日:2017-05-17
Applicant: Apple Inc.
Inventor: John J. Baker , Michael B. Howes , Michael S. Nashner , Yoji Hamada
CPC classification number: D04H13/00 , D04H1/00 , Y10T428/13 , Y10T428/24992
Abstract: Embodiments described herein may take the form of a textile product having one or more regions of reduced density. These reduced density volumes may form one or more features in the product. For example, the reduced density volumes may have better acoustic transmission properties, optical transmission properties, flexibility, and the like. Sound transmission may be enhanced not only in terms of clarity, but also overall range. That is, certain audio frequencies that the textile may normally block when in an unaltered state may pass through a textile having reduced density or reduced density regions.
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公开(公告)号:US09730340B1
公开(公告)日:2017-08-08
申请号:US14720502
申请日:2015-05-22
Applicant: Apple Inc.
Inventor: Phillip Michael Hobson , Nathan P. Bosscher , John J. Baker , Craig M. Stanley , Brad G. Boozer
CPC classification number: G06F1/1656
Abstract: An array of electrical components may be mounted in openings in an electronic device housing. Gaskets may be used to seal the electrical components to a housing wall. The housing wall may be planar or may have a cylindrical shape or other curved shape. The electrical components may be mounted to the housing wall by rotating the electrical components so that portions of the components bear against an inner surface of the housing wall. Component mounting structures that receive the electrical components may be used in mounting the electrical components. Component cover structures with openings may overlap the components. Engagement features may help prevent relative rotational motion between the electrical components and the housing wall of the electronic device.
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54.
公开(公告)号:US09565773B2
公开(公告)日:2017-02-07
申请号:US14231454
申请日:2014-03-31
Applicant: Apple Inc.
Inventor: John J. Baker
CPC classification number: H05K3/284 , B05D3/0254 , B05D3/067 , B05D3/108 , C09J5/00 , C09J2203/326 , C09J2205/302 , C09J2205/31 , H01L21/563 , H01L2224/16225 , H01L2924/181 , H05K1/0284 , H05K3/288 , H05K2201/0251 , H05K2201/0254 , H05K2203/0126 , H05K2203/0285 , H05K2203/0292 , H05K2203/0783 , H05K2203/092 , H05K2203/102 , H05K2203/107 , H05K2203/1163 , H05K2203/1194 , H01L2924/00012
Abstract: An electronic device may have housing structures, electrical components, and other electronic device structures. Adhesive may be used to join electronic device structures. Adhesive may be dispensed as liquid adhesive and cured to form adhesive joints. Adhesive joints may be debonded. Chain reactions may be initiated by applying a localized initiator such as a chemical or localized energy to the adhesive. Once initiated, the chain reaction may spread throughout the adhesive to cure the adhesive, to globally change adhesive viscosity, or to weaken the adhesive to facilitate debonding. Local changes to adhesive may also be made such as local increases and decreases to adhesive viscosity. Chain reaction curing may be used to cure adhesive or debond adhesive that is hidden from view within gaps in the electronic device structures. Viscosity changes may be used to control where adhesive flows.
Abstract translation: 电子设备可以具有壳体结构,电气部件和其他电子设备结构。 粘合剂可用于连接电子器件结构。 粘合剂可以作为液体粘合剂分配并固化以形成粘合剂接合部。 粘合接头可能脱粘。 可以通过将局部引发剂例如化学或局部化的能量施加到粘合剂来引发连锁反应。 一旦开始,连锁反应可能会蔓延到整个粘合剂中以固化粘合剂,从而全局地改变粘合剂粘度,或者削弱粘合剂以促进剥离。 还可以对粘合剂进行局部变化,例如局部增加和降低粘合剂粘度。 链反应固化可用于固化在电子设备结构的间隙内隐藏的粘合剂或脱粘合剂。 粘度变化可用于控制粘合剂流动的位置。
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公开(公告)号:US20160295340A1
公开(公告)日:2016-10-06
申请号:US15037302
申请日:2014-09-25
Applicant: APPLE INC.
Inventor: John J. Baker , Martin E. Johnson , Afrooz Family , Michael B. Howes , Craig M. Stanley , Brad G. Boozer
CPC classification number: H04S7/302 , G10L17/04 , G10L17/06 , H04R1/08 , H04R1/403 , H04R2203/12 , H04R2430/23
Abstract: An audio system that adjusts one or more beam patterns emitted by one or more loudspeaker arrays based on the preferences of users/listeners is described. The audio system includes an audio receiver that contains a listener location estimator, a listener identifier, and a voice command processor. Inputs from the listener location estimator, the listener identifier, and the voice command processor are fed into an array processor. The array processor drives the one or more loudspeaker arrays to emit beam patterns into the listening area based on inputs from each of these devices. By examining the location, preferred usage settings, and voice commands from listeners, the generated beam patterns are customized to the explicit and implicit preferences of the listeners with minimal direct input. Other embodiments are also described.
Abstract translation: 描述了基于用户/听众的偏好来调整由一个或多个扬声器阵列发射的一个或多个波束图案的音频系统。 音频系统包括包含收听者位置估计器,听众标识符和语音命令处理器的音频接收器。 来自收听者位置估计器,收听者标识符和语音命令处理器的输入被馈送到阵列处理器。 阵列处理器驱动一个或多个扬声器阵列,以基于来自这些装置中的每一个的输入将波束图案发射到收听区域。 通过检查来自侦听器的位置,优选使用设置和语音命令,生成的波束模式根据最小的直接输入来定制听众的显式和隐含偏好。 还描述了其它实施例。
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公开(公告)号:US20150311741A1
公开(公告)日:2015-10-29
申请号:US14263949
申请日:2014-04-28
Applicant: Apple Inc.
Inventor: John J. Baker , Fletcher R. Rothkopf
CPC classification number: H02J50/10 , G04C3/00 , G04C3/08 , G04C5/005 , H02J7/0042 , H02J7/0044 , H02J7/32 , H02K49/108 , Y02B40/90
Abstract: A method and apparatus for charging an electronic device include rotating a magnetically attractable element, or element, within the electronic device. Rotating a magnet external to the electronic device simultaneously rotates the element. Rotating the element causes an electrically generating device, such as a generator, to create an electric charge in the electronic device. The electric charge may be used to power the electrically generating device, or the electric charge may be transmitted to an internal power supply in order to charge another component or components. In another embodiment, the external magnet may wind a spring inside a device.
Abstract translation: 用于对电子设备充电的方法和装置包括在电子设备内旋转磁性可吸引元件或元件。 旋转电子设备外部的磁体同时旋转元件。 旋转元件使诸如发电机的电气产生装置在电子设备中产生电荷。 可以使用电荷来为发电装置供电,或者电荷可以被传输到内部电源,以对另一个组件充电。 在另一个实施例中,外部磁体可以将弹簧缠绕在装置内。
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公开(公告)号:US08946566B2
公开(公告)日:2015-02-03
申请号:US13646610
申请日:2012-10-05
Applicant: Apple Inc.
Inventor: John J. Baker
IPC: H01L23/28
CPC classification number: H05K3/284 , H05K3/28 , H05K2201/09972 , H05K2201/10189 , H05K2201/10356 , H05K2201/10446 , H05K2203/1327 , H05K2203/1476 , Y10T29/49146
Abstract: An improved method for producing a PCB assembly requiring at least two different encapsulants is disclosed. The PCB assembly may have two or more separate regions in which electronic devices are attached. In each region, a unique encapsulant with different mechanical, electrical, physical and or chemical properties is used according to the particular requirements of the electronic devices in that region.
Abstract translation: 公开了一种用于生产需要至少两种不同密封剂的PCB组件的改进方法。 PCB组件可以具有两个或更多个独立的区域,其中电子设备被附接。 在每个区域中,根据该区域的电子设备的特殊要求,使用具有不同机械,电学,物理和/或化学性质的独特的密封剂。
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