Method of forming high performance lateral PNP transistor with buried
base contact
    52.
    发明授权
    Method of forming high performance lateral PNP transistor with buried base contact 失效
    形成具有埋地基接触的高性能横向PNP晶体管的方法

    公开(公告)号:US5198376A

    公开(公告)日:1993-03-30

    申请号:US909938

    申请日:1992-07-07

    IPC分类号: H01L21/331

    CPC分类号: H01L29/6625 Y10S148/096

    摘要: A high performance PNP lateral bipolar transistor is described, incorporating at least two trenches extending from the upper P.sup.- surface of a semiconductor substrate almost to a buried N.sup.+ layer. The floor of one trench is heavily N-doped to establish a connection between the buried N.sup.+ layer and an N.sup.- diffusion in the walls of the trench. When the trenches are backfilled with P.sup.+ polysilicon a lateral PNP is formed having a buried base contact.

    摘要翻译: 描述了一种高性能PNP横向双极晶体管,其包括从半导体衬底的上P-表面几乎延伸到掩埋的N +层的至少两个沟槽。 一个沟槽的底部被大量N掺杂以在掩埋的N +层和沟槽的壁中的N-扩散之间建立连接。 当沟槽用P +多晶硅回填时,形成具有掩埋基底接触的横向PNP。

    Memory devices with isolation structures
    54.
    发明授权
    Memory devices with isolation structures 有权
    具有隔离结构的存储器件

    公开(公告)号:US08654592B2

    公开(公告)日:2014-02-18

    申请号:US11811702

    申请日:2007-06-12

    IPC分类号: G11C11/34 G11C16/04

    摘要: Memory devices and methods of programming and forming the same are disclosed. In one embodiment, a memory device has memory cells contained within dielectric isolation structures to isolate them from at least those memory cells in communication with other bit lines, such as to facilitate forward-bias write operations. The dielectric isolation structures contain an upper well having a first conductivity type and a buried well having a second conductivity type. By forward biasing the junction from the buried well to the upper well, electrons can be injected into charge-storage nodes of memory cells that are contained within the dielectric isolation structures.

    摘要翻译: 公开了存储器件及其编程和形成方法。 在一个实施例中,存储器件具有包含在介质隔离结构内的存储器单元,以将它们与至少与其它位线通信的那些存储器单元隔离,以便于正向偏置写入操作。 电介质隔离结构包含具有第一导电类型的上阱和具有第二导电类型的掩埋阱。 通过将接头从掩埋阱向上偏置到上阱,电子可以被注入到包含在介质隔离结构内的存储器单元的电荷存储节点中。

    Buried decoupling capacitors, devices and systems including same, and methods of fabrication
    55.
    发明授权
    Buried decoupling capacitors, devices and systems including same, and methods of fabrication 有权
    掩埋去耦电容器,包括其的器件和系统以及制造方法

    公开(公告)号:US08114753B2

    公开(公告)日:2012-02-14

    申请号:US12975761

    申请日:2010-12-22

    申请人: Badih El-Kareh

    发明人: Badih El-Kareh

    IPC分类号: H01L21/20

    摘要: A buried decoupling capacitor apparatus and method are provided. According to various embodiments, a buried decoupling capacitor apparatus includes a semiconductor-on-insulator substrate having a buried insulator region and top semiconductor region on the buried insulator region. The apparatus embodiment also includes a first capacitor plate having a doped region in the top semiconductor region in the semiconductor-on-insulator substrate. The apparatus embodiment further includes a dielectric material on the first capacitor plate, and a second capacitor plate on the dielectric material. According to various embodiments, the first capacitor plate, the dielectric material and the second capacitor plate form a decoupling capacitor for use in an integrated circuit.

    摘要翻译: 提供了一种埋地去耦电容器装置和方法。 根据各种实施例,掩埋去耦电容器装置包括在绝缘体区域上具有掩埋绝缘体区域和顶部半导体区域的绝缘体上半导体衬底。 该装置实施例还包括在绝缘体上半导体衬底中的顶部半导体区域中具有掺杂区域的第一电容器板。 该装置实施例还包括在第一电容器板上的电介质材料和介电材料上的第二电容器板。 根据各种实施例,第一电容器板,电介质材料和第二电容器板形成用于集成电路的去耦电容器。

    BURIED DECOUPLING CAPACITORS, DEVICES AND SYSTEMS INCLUDING SAME, AND METHODS OF FABRICATION
    57.
    发明申请
    BURIED DECOUPLING CAPACITORS, DEVICES AND SYSTEMS INCLUDING SAME, AND METHODS OF FABRICATION 有权
    打包的解除电容器,包括其的装置和系统以及制造方法

    公开(公告)号:US20110092045A1

    公开(公告)日:2011-04-21

    申请号:US12975761

    申请日:2010-12-22

    申请人: Badih El-Kareh

    发明人: Badih El-Kareh

    IPC分类号: H01L21/20

    摘要: A buried decoupling capacitor apparatus and method are provided. According to various embodiments, a buried decoupling capacitor apparatus includes a semiconductor-on-insulator substrate having a buried insulator region and top semiconductor region on the buried insulator region. The apparatus embodiment also includes a first capacitor plate having a doped region in the top semiconductor region in the semiconductor-on-insulator substrate. The apparatus embodiment further includes a dielectric material on the first capacitor plate, and a second capacitor plate on the dielectric material. According to various embodiments, the first capacitor plate, the dielectric material and the second capacitor plate form a decoupling capacitor for use in an integrated circuit.

    摘要翻译: 提供了一种埋地去耦电容器装置和方法。 根据各种实施例,掩埋去耦电容器装置包括在绝缘体区域上具有掩埋绝缘体区域和顶部半导体区域的绝缘体上半导体衬底。 该装置实施例还包括在绝缘体上半导体衬底中的顶部半导体区域中具有掺杂区域的第一电容器板。 该装置实施例还包括在第一电容器板上的电介质材料和介电材料上的第二电容器板。 根据各种实施例,第一电容器板,电介质材料和第二电容器板形成用于集成电路的去耦电容器。

    Buried decoupling capacitors, devices and systems including same, and methods of fabrication
    58.
    发明授权
    Buried decoupling capacitors, devices and systems including same, and methods of fabrication 有权
    掩埋去耦电容器,包括其的器件和系统以及制造方法

    公开(公告)号:US07880267B2

    公开(公告)日:2011-02-01

    申请号:US11510945

    申请日:2006-08-28

    申请人: Badih El-Kareh

    发明人: Badih El-Kareh

    IPC分类号: H01L21/02

    摘要: A buried decoupling capacitor apparatus and method are provided. According to various embodiments, a buried decoupling capacitor apparatus includes a semiconductor-on-insulator substrate having a buried insulator region and top semiconductor region on the buried insulator region. The apparatus embodiment also includes a first capacitor plate having a doped region in the top semiconductor region in the semiconductor-on-insulator substrate. The apparatus embodiment further includes a dielectric material on the first capacitor plate, and a second capacitor plate on the dielectric material. According to various embodiments, the first capacitor plate, the dielectric material and the second capacitor plate form a decoupling capacitor for use in an integrated circuit.

    摘要翻译: 提供了一种埋地去耦电容器装置和方法。 根据各种实施例,掩埋去耦电容器装置包括在绝缘体区域上具有掩埋绝缘体区域和顶部半导体区域的绝缘体上半导体衬底。 该装置实施例还包括在绝缘体上半导体衬底中的顶部半导体区域中具有掺杂区域的第一电容器板。 该装置实施例还包括在第一电容器板上的电介质材料和介电材料上的第二电容器板。 根据各种实施例,第一电容器板,电介质材料和第二电容器板形成用于集成电路的去耦电容器。

    HIGH VOLTAGE BIPOLAR TRANSISTOR AND METHOD OF FABRICATION
    60.
    发明申请
    HIGH VOLTAGE BIPOLAR TRANSISTOR AND METHOD OF FABRICATION 有权
    高压双极晶体管及制造方法

    公开(公告)号:US20100032804A1

    公开(公告)日:2010-02-11

    申请号:US12537246

    申请日:2009-08-06

    IPC分类号: H01L21/331 H01L29/73

    摘要: High voltage bipolar transistors built with a BiCMOS process sequence exhibit reduced gain at high current densities due to the Kirk effect. Threshold current density for the onset of the Kirk effect is reduced by the lower doping density required for high voltage operation. The widened base region at high collector current densities due to the Kirk effect extends laterally into a region with a high density of recombination sites, resulting in an increase in base current and drop in the gain. The instant invention provides a bipolar transistor in an IC with an extended unsilicided base extrinsic region in a configuration that does not significantly increase a base-emitter capacitance. Lateral extension of the base extrinsic region may be accomplished using a silicide block layer, or an extended region of the emitter-base dielectric layer. A method of fabricating an IC with the inventive bipolar transistor is also disclosed.

    摘要翻译: 由于Kirk效应,用BiCMOS工艺制造的高电压双极型晶体管在高电流密度下表现出减小的增益。 Kirk效应开始的阈值电流密度由于高电压操作所需的较低掺杂密度而降低。 由于Kirk效应,在高集电极电流密度下扩大的基极区域横向扩展到具有高密度复合位点的区域,导致基极电流增加和增益下降。 本发明在IC中提供了具有不显着增加基极 - 发射极电容的构造中的扩展的非硅化基极外部区域的双极晶体管。 可以使用硅化物阻挡层或发射极 - 基极介电层的延伸区域来实现基极外部区域的横向延伸。 还公开了利用本发明的双极晶体管制造IC的方法。