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    Spot size noise to minimize stitch error perception
    53.
    发明授权
    Spot size noise to minimize stitch error perception 失效
    斑点尺寸噪音，以尽量减少针迹错误感知

    公开(公告)号：US06698861B1

    公开(公告)日：2004-03-02

    申请号：US10462443

    申请日：2003-06-16

    申请人： Donald J. Drake

    发明人： Donald J. Drake

    IPC分类号： B41J2205

    CPC分类号： B41J2/2135 ,  B41J2/2128 ,  B41J11/42

    摘要： In a technique for obscuring the stitch error perceived the eye of a viewer, a first plurality of drops of fluid are ejected in a first firing sequence at a medium in a first swath from a print head including at least one die having a plurality of nozzles while moving in a first direction relative to the medium. Thereafter, the medium is advanced in a second direction substantially perpendicular to the first direction. The print head is again moved in the first direction and a second plurality of drops of the fluid are fired at the medium in a second swath adjacent the first swath. A controller randomly modulates the spot size resulting from the drops of the fluid. The stitch error may be a misplacement of the second swath relative to the first swath and the second plurality of drops includes a random variety of drop sizes.

    摘要翻译： 在用于遮蔽观察者的眼睛的针迹错误的技术中，第一多个液滴在第一条纹中的介质中以第一条纹的介质从包括至少一个具有多个喷嘴的模具的打印头排出 同时相对于介质沿第一方向移动。 此后，介质沿着基本上垂直于第一方向的第二方向前进。 打印头再次沿第一方向移动，并且第二多个液滴在介质上在与第一条相邻的第二条带中被点燃。 控制器随机调整由流体液滴引起的光斑尺寸。 针迹误差可能是相对于第一条带的第二条带的错位，并且第二多个液滴包括随机的各种液滴尺寸。

    Ink jet printhead having a flat surface heater plate
    55.
    发明授权
    Ink jet printhead having a flat surface heater plate 失效
    喷墨打印头具有平面加热板

    公开(公告)号：US5534901A

    公开(公告)日：1996-07-09

    申请号：US254793

    申请日：1994-06-06

    申请人： Donald J. Drake

    发明人： Donald J. Drake

    IPC分类号： B41J2/05 ,  B41J2/14 ,  B41J2/16 ,  B41J2/335

    CPC分类号： B41J2/14072 ,  B41J2/14129 ,  B41J2202/03 ,  B41J2202/11 ,  B41J2202/13

    摘要： An improved ink jet printhead including a channel plate and a heater plate having an improved flatness top bonding surface. The heater plate includes a silicon wafer base, a first insulating layer formed on the wafer base, and at least an intermediate component sublayer formed over the first insulating layer. The heater plate also includes a second insulating layer formed over the at least intermediate component sublayer, and having a top bonding surface for bonding the: heater plate to the channel plate. To substantially improve flatness of the top bonding surface of the second insulating layer, the component sublayer includes active thin film layer patterns in circuit areas of the thin sublayer, and non-active relief compensating patterns in non-circuit areas thereof. The non-active relief-compensating patterns each have a thickness substantially equal to the thickness of the active thin film patterns in the circuit areas of the sublayer.

    摘要翻译： 一种改进的喷墨打印头，其包括通道板和具有改进的平坦度顶部粘结表面的加热板。 加热板包括硅晶片基底，形成在晶片基底上的第一绝缘层，以及至少形成在第一绝缘层上的中间部件子层。 加热板还包括形成在至少中间部件子层上的第二绝缘层，并且具有用于将加热器板接合到通道板的顶部接合表面。 为了显着提高第二绝缘层的顶部接合表面的平坦度，元件子层包括在薄子层的电路区域中的有源薄膜层图案，以及非电路区域中的非有效的消除补偿图案。 非有效的补偿补偿图案各自具有基本上等于子层的电路区域中的有源薄膜图案的厚度的厚度。

    Full width array read or write bars having low induced thermal stress
    56.
    发明授权
    Full width array read or write bars having low induced thermal stress 失效
    具有低感应热应力的全宽阵列读或写条

    公开(公告)号：US5528272A

    公开(公告)日：1996-06-18

    申请号：US166855

    申请日：1993-12-15

    申请人： Kraig A. Quinn ,  Mark A. Cellura ,  Jeffrey D. Barner ,  Donald J. Drake

    发明人： Kraig A. Quinn ,  Mark A. Cellura ,  Jeffrey D. Barner ,  Donald J. Drake

    IPC分类号： B41J2/14 ,  B41J2/155

    CPC分类号： B41J2/155 ,  B41J2/14072 ,  B41J2202/20

    摘要： A full width read and/or write assemblies, such as a full width thermal ink jet printbar, is disclosed, having materials with both a high thermal coefficient of expansion and a low thermal coefficient of expansion. A suitable adhesive which provides lateral give while firmly holding the respective components together provides dimensional stability to the printbar element having a low thermal coefficient of expansion when components having high thermal coefficient of expansion are assembled thereto. The flexible or floating mounting enabled by lateral give of the adhesive allows for the application of cost effective materials with a high thermal coefficient of expansion to be used for support functions such as, for example, circuit boards and ink manifolds. The flexible or floating mounting relieves shear stress cased by a differential in the expansion or contraction of materials having a different thermal coefficient of expansion. Since the thermal expansion of the various components expand and contract from a center location thereof, this center location is bonded by an adhesive which does not provide lateral give, so that alignment between parts are maintained while the remainder of the respective components float relative to each other and prevent thermally induced stresses which tend to cause warpage.

    摘要翻译： 公开了一种全宽度读/写组件，例如全宽度热喷墨印刷棒，其具有高热膨胀系数和低热膨胀系数的材料。 当将具有高热膨胀系数的部件组装在一起时，提供侧向赋予的合适的粘合剂同时牢固地保持各个部件一起为具有低热膨胀系数的打印头元件提供尺寸稳定性。 通过侧面给予粘合剂的柔性或浮动安装允许将具有高热膨胀系数的成本有效的材料应用于诸如电路板和油墨歧管的支撑功能。 柔性或浮动式安装可减轻由不同热膨胀系数的材料的膨胀或收缩差异引起的剪切应力。 由于各种部件的热膨胀从其中心位置膨胀和收缩，所以该中心位置通过不提供横向给定的粘合剂粘结，从而保持部件之间的对准，同时各部件的其余部分相对于每个部件浮动 另一种并防止易引起翘曲的热致应力。

    Integrated circuit fan-in for semiconductor transducer devices
    57.
    发明授权
    Integrated circuit fan-in for semiconductor transducer devices 失效
    用于半导体传感器器件的集成电路引入

    公开(公告)号：US5457311A

    公开(公告)日：1995-10-10

    申请号：US092640

    申请日：1993-07-16

    申请人： Donald J. Drake ,  William G. Hawkins ,  Thomas A. Tellier

    发明人： Donald J. Drake ,  William G. Hawkins ,  Thomas A. Tellier

    IPC分类号： B41J2/45 ,  H01L27/146 ,  H01J40/14 ,  H01L27/14

    CPC分类号： B41J2/45 ,  H01L27/146

    摘要： A wide semiconductor transducer device comprises a linear array of semiconductor chips. Each of the semiconductor chips has a plurality of transducer elements arranged on it along a front edge at a constant spacing, the constant spacing being maintained across the semiconductor chip boundaries. Each of the semiconductor chips also includes associated transducer circuits which are each connected one of the plurality of transducer elements formed on the semiconductor chip. While the requirement that the transducer elements maintain the constant spacing requires them to be located within a damage zone created during the dicing and/or thermally induced compression of the semiconductor chip, the associated transducer circuits can be located within an interior portion of the semiconductor chip. The interior portion of the semiconductor chip is located a sufficient distance from the edges of the semiconductor chip such that it does not encroach on the damage zone.

    摘要翻译： 宽的半导体传感器装置包括半导体芯片的线性阵列。 每个半导体芯片具有沿着前边缘以恒定间隔布置在其上的多个换能器元件，恒定间隔保持在半导体芯片边界两边。 每个半导体芯片还包括相关联的换能器电路，它们各自连接形成在半导体芯片上的多个换能器元件中的一个。 虽然传感器元件保持恒定间隔的要求要求它们位于在半导体芯片的切割和/或热诱导压缩期间产生的损伤区域内，但是相关联的换能器电路可以位于半导体芯片的内部部分内 。 半导体芯片的内部部分位于与半导体芯片的边缘足够的距离处，使得它不会侵入损伤区域。

    Multi-resolution roofshooter printheads
    58.
    发明授权
    Multi-resolution roofshooter printheads 失效
    多分辨率屋顶拍摄头

    公开(公告)号：US5208605A

    公开(公告)日：1993-05-04

    申请号：US770272

    申请日：1991-10-03

    申请人： Donald J. Drake

    发明人： Donald J. Drake

    IPC分类号： B41J2/05 ,  B41J2/14 ,  B41J2/155 ,  B41J2/505

    CPC分类号： B41J2/5056 ,  B41J2/14016 ,  B41J2/1433 ,  B41J2/155 ,  B41J2002/14387 ,  B41J2002/14475

    摘要： A printhead for a thermal ink jet printer, preferably a roofshooter type printer, includes at least two arrays of linear spaced apart nozzles and heating elements, each array having a different resolution to produce printed pages at a draft print using a low resolution array, at a letter quality print using a high resolution array, or a combination of both arrays to provide enhanced grey scale reproduction. The high resolution array allows for accurate reproduction at a reduced throughput while the low resolution array allows for moderate reproduction at a higher throughput. Alternatively, the two arrays could be used simultaneously to provide a fast, broad, coarse stroke and a slower, fine detail stroke.

    摘要翻译： 用于热喷墨打印机的打印头，优选屋顶拍照型打印机，包括至少两个直线间隔开的喷嘴和加热元件的阵列，每个阵列具有不同的分辨率，以使用低分辨率阵列在草稿打印页面上产生打印页面， 使用高分辨率阵列的字母质量打印，或两个阵列的组合以提供增强的灰度级再现。 高分辨率阵列允许以较低的吞吐量精确地再现，而低分辨率阵列允许以更高的吞吐量适度再现。 或者，两个阵列可以同时使用以提供快速，宽泛，粗略的行程和较慢的精细细节行程。

    Precision diced aligning surfaces for devices such as ink jet printheads
    60.
    发明授权
    Precision diced aligning surfaces for devices such as ink jet printheads 失效
    用于诸如喷墨打印头的设备的精密切割对准表面

    公开(公告)号：US5160403A

    公开(公告)日：1992-11-03

    申请号：US742802

    申请日：1991-08-09

    申请人： Almon P. Fisher ,  Donald J. Drake

    发明人： Almon P. Fisher ,  Donald J. Drake

    IPC分类号： B41J2/16 ,  H01L21/301

    CPC分类号： B41J2/1604 ,  B41J2/1623 ,  B41J2/1635 ,  B41J2202/21 ,  Y10S438/975 ,  Y10T156/1064 ,  Y10T156/1066 ,  Y10T156/1075

    摘要： A method of fabricating a semiconductor device having a buttable edge from a first wafer having first and second opposite planar surfaces and a second wafer having first and second opposite planar surfaces is disclosed. A first component is formed on the first planar surface of the first wafer. A precision dice cut is placed in the first planar surface of the first wafer closely adjacent to the first component. The precision dice cut extends partially through the first surface of the first wafer and defines the buttable edge. The first surface of the first wafer is bonded to the first surface of the second wafer, the first surface of the second wafer containing a second component and being aligned with and bonded to the first wafer so that the first and second components cooperate to form the semiconductor device. Portions of the first and second wafers surrounding the first and second components, respectively, are then removed to define the semiconductor device. The step of removing can include placing a second dice cut entirely through the first and second wafers parallel to and slightly offset from the precision dice cut. The second dice cut being located slightly further away from the first component than the precision dice cut and intersects a portion of the precision dice cut so that a side of the semiconductor device which includes the buttable edge is defined by the precision dice cut and the second dice cut.

    摘要翻译： 公开了一种制造半导体器件的方法，该半导体器件具有具有第一和第二相对平坦表面的第一晶片的具有可平行边缘的半导体器件，以及具有第一和第二相对平面的第二晶片。 第一部件形成在第一晶片的第一平面上。 将精密切割切割放置在与第一部件紧密相邻的第一晶片的第一平面表面中。 精密骰子切割部分延伸穿过第一晶片的第一表面并且限定了可展开的边缘。 第一晶片的第一表面被结合到第二晶片的第一表面，第二晶片的第一表面包含第二元件并且与第一晶片对准并且结合到第一晶片，使得第一和第二元件协作形成 半导体器件。 然后分别围绕第一和第二部件的第一和第二晶片的部分被移除以限定半导体器件。 去除步骤可以包括将第一和第二晶片完全切割的第二骰子平行于并且稍微偏离精密骰子切割。 所述第二骰子切割位置比所述第一部件稍微远离所述精密骰子切割并与所述精密骰子切割的一部分相交，使得包括所述可裁剪边缘的所述半导体器件的一侧由所述精密骰子切割限定，并且所述第二骰子切割 骰子切。