Silicon interposer for MEMS scalable printing modules
    1.
    发明授权
    Silicon interposer for MEMS scalable printing modules 有权
    用于MEMS可伸缩打印模块的硅插入器

    公开(公告)号:US08567911B2

    公开(公告)日:2013-10-29

    申请号:US12763423

    申请日:2010-04-20

    IPC分类号: B41J2/14 B41J2/16 H01L21/00

    摘要: A print module and a method of forming the same, the print module including a substrate, an ink jet die, and an interposer between the substrate and the ink jet die. The substrate includes an ink channel and an air vent, and the die includes a plurality of ink apertures. The interposer includes etched openings therein of a truncated pyramid shape; the openings of the interposer reconfiguring the ink channel and air vent passages between the substrate and die to allow for greater tolerance in alignment and manufacture of the print head module.

    摘要翻译: 打印模块及其形成方法,所述打印模块包括基板,喷墨模头和所述基板与所述喷墨模具之间的插入件。 基板包括油墨通道和通气口,并且模具包括多个油墨孔。 插入器包括其中具有截头棱锥形状的蚀刻开口; 插入器的开口重新配置墨水通道和在基板和模具之间的排气通道,以允许在打印头模块的对准和制造中具有更大的公差。

    Printhead interposing maintenance apparatus and method and image producing machine having same
    5.
    发明授权
    Printhead interposing maintenance apparatus and method and image producing machine having same 失效
    打印头插入维护装置和方法以及具有该装置的图像生成机

    公开(公告)号:US06764160B1

    公开(公告)日:2004-07-20

    申请号:US10320826

    申请日:2002-12-16

    IPC分类号: B41J2165

    摘要: A printhead interposing maintenance method and apparatus are provided for maintaining a printhead assembly within a relatively tight space in an image producing machine. The printhead interposing maintenance apparatus for the method includes (a) at least a first home position adjacent a first side of four sides of an operating zone between a printhead assembly and an imaging surface in the image producing machine; (b) a first moving device for moving the printhead assembly from a printing first position adjacent the imaging surface to a maintaining second position spaced further away from the printing first position; (c) a maintenance apparatus movably supported for movement along an maintenance path interposed between the imaging surface and the printhead assembly; (d) a second moving device for moving the maintenance apparatus for contacting and maintaining the printhead assembly, and along the maintenance path from the at least first home position to a resting position adjacent a second side and opposite the first side of the four sides of the operating zone; and (e) a third moving device for moving the printhead assembly back from the maintaining second position to the printing first position.

    摘要翻译: 提供一种打印头插入维护方法和装置,用于将打印头组件保持在图像生成机器的相对紧密的空间内。 用于该方法的打印头插入维护装置包括:(a)至少第一起始位置,邻近图像生成机器中的打印头组件和成像表面之间的操作区域的四边的第一侧; (b)第一移动装置,用于将打印头组件从邻近成像表面的打印第一位置移动到距印刷第一位置更远的保持第二位置; (c)可移动地支撑的维护装置,用于沿着插入在所述成像表面和所述打印头组件之间的维护路径移动; (d)第二移动装置,用于移动用于接触和保持打印头组件的维护装置,并且沿着维护路径从至少第一起始位置到邻近第二侧的相对于第四侧的第二侧的第二侧的静止位置 操作区; 和(e)第三移动装置,用于将打印头组件从维持第二位置移动到打印第一位置。

    Adhesive-free edge butting for printhead elements
    6.
    发明授权
    Adhesive-free edge butting for printhead elements 失效
    用于打印头元件的无粘合剂边缘对接

    公开(公告)号:US5572244A

    公开(公告)日:1996-11-05

    申请号:US280973

    申请日:1994-07-27

    摘要: A large array or pagewidth printhead fabricated from printhead elements or subunits having adhesive-free butting edges. Each of the printhead elements includes a heater element and a channel element bonded together by an adhesive such as an epoxy. A space or adhesive-receiving aperture is formed between the channel element and the heater element before mating so that any adhesive forced from between the channel element and heater element by the pressure of mating does not flow onto the butting surfaces, but instead overflows into the space thereby maintaining an adhesive free butting edge. The channel element includes an etch trough which forms the space. The printhead elements are butted together to form a large array printhead. The absence of adhesive on the butting edges improves manufacturability of the large array printhead.

    摘要翻译: 由打印头元件或具有无粘合剂对接边缘的子单元制造的大阵列或页宽打印头。 每个打印头元件包括加热器元件和通过诸如环氧树脂的粘合剂粘合在一起的通道元件。 在配合之前,在通道元件和加热器元件之间形成空间或粘合剂接收孔,使得通过配合压力从通道元件和加热器元件之间强制的任何粘合剂不会流到对接表面上,而是溢流到 空间,从而保持无粘合剂的对接边缘。 通道元件包括形成空间的蚀刻槽。 打印头元件对接在一起以形成大阵列打印头。 对接边缘上没有粘合剂提高了大阵列打印头的可制造性。

    Ink jet printhead which avoids effects of unwanted formations developed
during fabrication
    7.
    发明授权
    Ink jet printhead which avoids effects of unwanted formations developed during fabrication 失效
    喷墨打印头避免了在制造过程中产生的不希望的结构的影响

    公开(公告)号:US5450108A

    公开(公告)日:1995-09-12

    申请号:US126962

    申请日:1993-09-27

    摘要: An improved thermal ink jet printhead is formed by the alignment and bonding of an anisotropically etched silicon wafer channel plate, containing a plurality of channel grooves, to a silicon wafer heater plate, containing a plurality of heating and addressing elements which are covered by a patterned thin and thick film insulating layer. The printhead enables better bonding of the two plates by sequentially patterning each layer of a two layer thick film layer to compensate for topographical features formed in the last thick film layer. The relative thickness and geometrical shapes of the recesses in the two layers are selected, so that topographic formations are varied to prevent standoff between bonded heater and channel plates, thereby insuring that the adhesive applied between the bonded plates will have the greatest propensity to bond.

    摘要翻译: 改进的热喷墨打印头通过将含有多个通道槽的各向异性蚀刻的硅晶片通道板对准和结合到硅晶片加热板上而形成,该硅晶片加热器板包含多个加热和寻址元件, 薄膜和厚膜绝缘层。 打印头通过顺序地图案化两层厚膜层的每一层以补偿在最后的厚膜层中形成的形貌特征,从而能够更好地粘结两块板。 选择两层中的凹部的相对厚度和几何形状,使得地形结构变化以防止结合的加热器和通道板之间的间隔,从而确保施加在粘合板之间的粘合剂将具有最大的粘结倾向。

    Liquid deagassing apparatus
    8.
    发明授权
    Liquid deagassing apparatus 失效
    液体脱气装置

    公开(公告)号:US5341162A

    公开(公告)日:1994-08-23

    申请号:US933560

    申请日:1992-08-24

    IPC分类号: B41J2/175 B41J2/19 B41J2/01

    CPC分类号: B41J2/175 B41J2/19

    摘要: Disclosed is an apparatus for degassing a liquid, comprising: a liquid supply and an outlet communicating with the liquid supply via a flow path; a degassing tank, disposed in the flow path between the liquid supply and the outlet, the degassing tank incorporating a gas-permeable vent; a means for moving the liquid along the flow path; and a heater, disposed in the flow path between the degassing tank and the outlet, for heating the liquid and thereby removing gas therefrom. The apparatus is particularly suited to the ink supply system of a thermal ink jet printer where the removal of gases dissolved in the ink improves print quality.

    摘要翻译: 公开了一种用于对液体进行脱气的设备,包括:液体供应源和经由流路与液体供应连通的出口; 设置在液体供应和出口之间的流动路径中的脱气罐,排气罐结合有透气孔; 用于沿着流动路径移动液体的装置; 以及设置在脱气罐和出口之间的流路中的加热器,用于加热液体,从而从中除去气体。 该设备特别适用于热喷墨打印机的墨水供应系统,其中溶解在墨水中的气体的去除改善了打印质量。

    Fabricating method for silicon structures
    9.
    发明授权
    Fabricating method for silicon structures 失效
    硅结构的制造方法

    公开(公告)号:US5201987A

    公开(公告)日:1993-04-13

    申请号:US899597

    申请日:1992-06-18

    IPC分类号: H01L21/308

    CPC分类号: H01L21/3081

    摘要: A precision etched, three dimensional device is fabricated from a silicon wafer by etching from one side of the wafer. A chemical masking layer, such as silicon nitride, is first deposited on all sides of the wafer, followed by the deposition of a robust mechanical layer, such as polycrystalline silicon, over the masking layer on all sides of the wafer. The two layers are sequentially patterned on one side of the wafer and then the wafer is placed into an etchant bath which etches the exposed surface of the wafer and concurrently removes the protective layer, leaving a defect-free masking layer that prevents unintentional etching that would reduce yields of fabricated devices.

    摘要翻译: 通过从晶片的一侧进行蚀刻从硅晶片制造精密蚀刻的三维器件。 首先在晶片的所有侧面上沉积诸如氮化硅的化学掩蔽层,然后在晶片的所有侧面上的掩模层上沉积坚固的机械层,例如多晶硅。 这两层在晶片的一侧依次构图,然后将晶片放入蚀刻液中,蚀刻晶片的暴露表面并同时去除保护层,留下无缺陷的掩模层,防止无意蚀刻, 降低制造装置的产量。

    Alignment of pagewidth bars
    10.
    发明授权
    Alignment of pagewidth bars 失效
    页宽栏的对齐方式

    公开(公告)号:US5192959A

    公开(公告)日:1993-03-09

    申请号:US709255

    申请日:1991-06-03

    IPC分类号: B41J2/01 B41J2/155

    CPC分类号: B41J2/155 B41J2202/20

    摘要: A mechanism for accurately mounting a large area semiconductive device within a larger system is disclosed. The semiconductive device, formed by the linear abutment of semiconductive sub-units divided from a larger semiconductive wafer must be accurately positioned to enable the operation of which it was intended. In one embodiment, the sub-units are thermal ink jet arrays which are abutted to form a pagewidth printhead. The semiconductive device includes a reference plate or substrate having a generally planar surface for mounting an array of functional sub-units thereon. The semiconductive device further includes two or more individual sub-units which are also affixed to the planar surface, thereby forming alignment pads for the assembled semiconductive device. When incorporated into the system, the alignment pads are received by frame members or alignment points to provide positive alignment of the reference plate, and the attached array of sub-units, within the system.

    摘要翻译: 公开了一种用于在较大系统内精确地安装大面积半导体装置的机构。 通过由较大的半导体晶片划分的半导体子单元的线性邻接形成的半导体器件必须被精确地定位以使其能够被操作。 在一个实施例中,子单元是热喷墨阵列,其被邻接以形成页宽打印头。 半导体器件包括具有大致平坦表面的参考板或衬底,用于在其上安装功能子单元阵列。 半导体器件还包括两个或多个单独的子单元,其也固定到平面表面,由此形成用于组装的半导体器件的对准焊盘。 当结合到系统中时,对准焊盘由框架构件或对准点接收,以在系统内提供参考板和附接的子单元阵列的正对准。