公开(公告)号：US20240269921A1

公开(公告)日：2024-08-15

申请号：US18290309

申请日：2021-06-03

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Karsten N. Wilson ,  Emre Hiro Discekici ,  Vladek Kasperchik ,  Timothy L. Weber ,  Sterling Chaffins ,  Devin Alexander Mourey

IPC: B29C64/165 ,  B29C64/188 ,  B29C64/264 ,  B29K221/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/20

CPC classification number: B29C64/165 ,  B29C64/188 ,  B29C64/264 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/20 ,  B29K2221/00

Abstract: Methods of three-dimensional printing can include iteratively applying a polymer build material as individual layers to a powder bed, where the polymer build material includes from about 80 wt % to 100 wt % polymer build particles, and based on a three-dimensional object model, selectively applying a binder agent including an aqueous liquid vehicle and polymer binder particles onto the individual layers of the polymer build material. The polymer binder particles have or are capable of having a melting temperature lower than a melting temperature of the polymer build particles. The methods can include exposing the powder bed to heat at a temperature less than a melting point of the polymer build particles but greater than a melting temperature of the polymer binder particles. The heat causes the polymer binder particles to melt to adhere the polymer build particles together to form a three-dimensional object.

公开(公告)号：US11911825B2

公开(公告)日：2024-02-27

申请号：US16606310

申请日：2018-03-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kristopher J. Erickson ,  David George ,  Sterling Chaffins ,  Lihua Zhao

IPC: B29C64/165 ,  B22F7/08 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B29C64/194 ,  B29C64/112 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  H05K3/46 ,  B29K105/16 ,  B29L31/34

CPC classification number: B22F7/08 ,  B29C64/112 ,  B29C64/165 ,  B29C64/194 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  H05K1/186 ,  H05K3/284 ,  H05K3/32 ,  H05K3/4664 ,  B29K2105/162 ,  B29K2995/0005 ,  B29L2031/3425 ,  H05K2201/10022 ,  H05K2201/10628 ,  H05K2203/1131 ,  B22F2999/00 ,  B22F1/10 ,  B22F10/20

Abstract: In an example, a method is described that includes building a first layer of a three-dimensional heterogeneous object in a first plurality of passes of an additive manufacturing system. An electronic component is inserted directly into the first layer. The electronic component is then fused to the first layer in a second plurality of passes of the additive manufacturing system.

公开(公告)号：US11795338B2

公开(公告)日：2023-10-24

申请号：US16603342

申请日：2018-01-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Sterling Chaffins ,  Anthony P. Holden ,  Katrina Donovan ,  Garry Hinch

IPC: B29C64/165 ,  C09D11/38 ,  B33Y70/00 ,  C09D11/102 ,  B33Y10/00 ,  B29K75/00 ,  B29K105/00 ,  C08K3/34

CPC classification number: C09D11/38 ,  B29C64/165 ,  B33Y70/00 ,  C09D11/102 ,  B29K2075/00 ,  B29K2105/005 ,  B33Y10/00 ,  C08K3/346 ,  C08K2201/005 ,  C08K2201/011

Abstract: An example of a build material composition for three-dimensional (3D) printing includes a polymeric or polymeric composite build material and a wetting modifying agent. The wetting modifying agent is: (i) incorporated into the polymeric component of the polymeric or polymeric composite build material and changes the wetting behavior of the polymeric component; or (ii) selected from the group consisting of: a fluorotelomer; a C8-C20 alcohol; a methyltrialkyl ammonium chloride; docusate sodium salt; a polymer having a chemical structure of the polymeric component of the polymeric or polymeric composite build material modified to include a hydrophobic group or a hydrophilic group; and a combination thereof.

公开(公告)号：US11738508B2

公开(公告)日：2023-08-29

申请号：US16756364

申请日：2017-11-17

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Sterling Chaffins ,  Kevin P DeKam ,  Kristopher J Erickson ,  Cory J Ruud ,  Jami Ryan Barone ,  Ruhua Cai ,  Anthony J Galvan

IPC: B29C64/165 ,  C08K3/08 ,  C08L77/02 ,  B33Y10/00 ,  B33Y70/00 ,  C08K3/04

CPC classification number: B29C64/165 ,  C08K3/08 ,  C08L77/02 ,  B33Y10/00 ,  B33Y70/00 ,  C08K3/042 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/005

Abstract: In an example, a composition for three-dimensional (3D) printing includes a polymer build material and a non-conductive fusing agent dispensable onto the polymer build material to form a polymer-fusing agent composite portion when heated to a sintering temperature, a conductive agent dispensable onto on the polymer build material to form a polymer-conductive agent composite portion when heated at least to the sintering temperature, the conductive agent comprising: at least one conductive particulate present in an amount of from about 10% to about 60% of a total weight of the conductive agent; at least one co-solvent present in an amount of from about 10% to about 50% of a total weight of the conductive agent; and an additive present in an amount of from about 0% to about 10% of a total weight of the conductive agent.

公开(公告)号：US11733020B2

公开(公告)日：2023-08-22

申请号：US17086933

申请日：2020-11-02

Applicant: NANYANG TECHNOLOGICAL UNIVERSITY ,  HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： William J. Allen ,  Quang Cuong Pham ,  Dinh Huy Nguyen ,  Sterling Chaffins

IPC: G01B7/00 ,  H02J50/20 ,  H02J50/00

CPC classification number: G01B7/003 ,  H02J50/001 ,  H02J50/20

Abstract: A first object for assembly with a second object, the first object comprising: a body having a first mating portion; and a first electronic element fabricated on the body; wherein the first electronic element is provided to establish an electrical coupling with a second electronic element fabricated on one of: the body and the second object, wherein a second mating portion is provided on the second object, and wherein the electrical coupling is configured to provide a measurable output for positioning the first mating portion at a desired position relative to the second mating portion according to an analysis of the measurable output against a predetermined reference output.

公开(公告)号：US11292189B2

公开(公告)日：2022-04-05

申请号：US16488715

申请日：2017-11-17

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Andrew Van Brocklin ,  Kevin P. DeKam ,  Vladek Kasperchik ,  Johnathon Holroyd ,  Douglas Pederson ,  Sterling Chaffins

IPC: B29C64/165 ,  B33Y10/00 ,  B33Y70/00

Abstract: In an example of a method for three-dimensional (3D) printing, a polymeric or polymeric composite build material is applied. A dielectric agent is selectively applied on at least a portion of the polymeric or polymeric composite build material. The dielectric agent includes a dielectric material having an effective relative permittivity (εr) value ranging from 1.1 to about 10,000. A fusing agent is selectively applied on the at least the portion of the polymeric or polymeric composite build material, and the polymeric or polymeric composite build material is exposed to radiation to fuse the at least the portion of the polymeric or polymeric composite build material to form a region of a layer of a 3D part. The region exhibits a dielectric property, a piezoelectric property, or a combination thereof.

公开(公告)号：US11167482B2

公开(公告)日：2021-11-09

申请号：US17047455

申请日：2018-10-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Sterling Chaffins ,  David Tucker ,  Kevin P. DeKam ,  David C. Woodlock ,  Lee Dockstader

IPC: B29C64/188 ,  B29C64/165 ,  B33Y40/20 ,  C25D5/56 ,  B33Y10/00 ,  B33Y70/00 ,  B29C64/153 ,  B33Y30/00 ,  B29K105/00

Abstract: The present disclosure is drawn to 3D printing kits and methods of making 3D printed articles. In one example, a 3D printing kit can include a powder bed material, a fusible fluid, and an activator fluid. The powder bed material can include polymer particles. The fusible fluid can include a radiation absorber. The fusible fluid can be to selectively apply to the powder bed material. The activator fluid can include a non-conductive electroless metal plating activator. The activator fluid can also be to selectively apply to the powder bed material.

公开(公告)号：US11090862B2

公开(公告)日：2021-08-17

申请号：US16066809

申请日：2016-04-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Sterling Chaffins ,  Kevin P. DeKam ,  Cassady Sparks Roop

IPC: B29C64/153 ,  G01B1/00 ,  G01B7/16 ,  B29C64/307 ,  B29C64/295 ,  G01L1/22

Abstract: A strain sensor can include a resistor, a first electrical contact at a first end of the resistor, and a second electrical contact at a second end of the resistor. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles.

公开(公告)号：US20210229358A1

公开(公告)日：2021-07-29

申请号：US17233020

申请日：2021-04-16

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Sterling Chaffins ,  Kevin P. DeKam

IPC: B29C64/30 ,  B33Y80/00 ,  B29C64/165 ,  B33Y40/10 ,  B28B1/00 ,  B33Y10/00 ,  B33Y70/00 ,  B29C64/153 ,  H05K1/09 ,  H05K3/10

Abstract: In a three-dimensional printing method example, a pre-treatment coating is formed on a part precursor by applying and drying, alternatingly: a polycation solution including a chloride ion and a polyanion solution including a sodium ion to form at least two layers. An ink is selectively deposited on the pre-treatment coating.

公开(公告)号：US20210197456A1

公开(公告)日：2021-07-01

申请号：US17043740

申请日：2018-05-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Sterling Chaffins ,  Anthony P. Holden

IPC: B29C64/165 ,  B29C64/268 ,  B33Y10/00 ,  B33Y70/00

Abstract: In an example of a method for reducing oxidation of a build material during three-dimensional printing, a portion of a layer of a polymeric build material is patterned by selectively applying a fusing agent on the portion. A detailing agent selectively applied on a non-patterned portion of the layer. The detailing agent includes a stabilizer to reduce oxidation of the polymeric build material. The layer is exposed to electromagnetic radiation to fuse the portion to form a 3D object layer. The stabilizer at least minimizes discoloration of the non-patterned portion.