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114 条记录 (耗时 0.019 秒)

    Selective etching of substrates with control of the etch profile
    51.
    发明授权
    Selective etching of substrates with control of the etch profile 失效
    通过控制蚀刻轮廓选择性蚀刻衬底

    公开(公告)号：US07041232B2

    公开(公告)日：2006-05-09

    申请号：US10081860

    申请日：2002-02-22

    申请人： Alexander Bietsch ,  Emmanuel Delamarche ,  Bruno Michel ,  Heinz Schmid ,  Matthias Geisler

    发明人： Alexander Bietsch ,  Emmanuel Delamarche ,  Bruno Michel ,  Heinz Schmid ,  Matthias Geisler

    IPC分类号： C09K13/00 ,  C09K13/06 ,  H01L21/306

    CPC分类号： H01L21/76838 ,  C23F1/02 ,  C23F1/34 ,  C23F1/40

    摘要： A wet etching system for selectively patterning substrates having regions covered with self-assembled monolayers (SAM) thereby controlling the etch profile. The system contains a) a liquid etching solution; and b) at least one additive to the liquid etching solution having a higher affinity to the regions of the substrate covered with the SAMs than to the other regions of the substrate. Also provided is a method of selectively patterning substrates having regions covered with self-assembled monolayers (SAMs), thereby controlling the etch profile, the method consisting of the steps of a) providing a liquid etching solution; b) adding at least one additive to said etching solution having a higher affinity to the regions of the substrate covered with the SAMs than to the other regions of the substrate; and c) etching said substrate with said liquid etching solution containing at least one additive.

    摘要翻译： 一种湿蚀刻系统，用于选择性地图案化具有被自组装单层（SAM）覆盖的区域的衬底，从而控制蚀刻轮廓。 该系统包含a）液体蚀刻溶液; 和b）液体蚀刻溶液中至少一种添加剂对于被SAM覆盖的衬底的区域比对衬底的其它区域具有更高的亲和力。 还提供了一种选择性地图案化具有被自组装单层（SAM）覆盖的区域的衬底的方法，从而控制蚀刻轮廓，该方法包括以下步骤：a）提供液体蚀刻溶液; b）向所述衬底覆盖的所述衬底的所述区域具有比所述衬底的其它区域更高亲和力的所述蚀刻溶液中的至少一种添加剂; 和c）用含有至少一种添加剂的液体蚀刻溶液蚀刻所述基材。

    Frame for fitting a smart card connector onto a panel
    52.
    发明申请
    Frame for fitting a smart card connector onto a panel 审中-公开
    将智能卡连接器安装到面板上的框架

    公开(公告)号：US20060059746A1

    公开(公告)日：2006-03-23

    申请号：US11178865

    申请日：2005-07-11

    申请人： Fabrice Valcher ,  Bruno Michel ,  Sylvain Rochon

    发明人： Fabrice Valcher ,  Bruno Michel ,  Sylvain Rochon

    IPC分类号： G09F21/04

    CPC分类号： G06K7/0021

    摘要： A frame (14) that includes a smart card connector (12), is mounted primarily behind a window (18) in a panel (16) so a smart card can be inserted rearwardly though the window and against contacts that read and/or write to the card. The panel has window edge portions that lie around the window, and the frame includes a pair of lugs (42) that are projected into the window and that are then raised so lug slots (45) receive an upper edge portion of the window. The frame also has a pair of fingers (60) that are resiliently biased forwardly, that press against the rear of the panel when the lugs are first projected into the window, and that snap forward and lie against window lower edge portions when the lugs are raised. The fingers lie at the ends of laterally extending beams that project from a main portion of the frame. The lugs and fingers form ramps (56, 78) that vertically guide the leading edge of a card being inserted, and the lugs form side guides (112).

    摘要翻译： 包括智能卡连接器（12）的框架（14）主要安装在面板（16）中的窗口（18）的后面，使得智能卡可以通过窗口向后插入并且抵靠读取和/或写入的接触件 到卡片 所述面板具有围绕所述窗口的窗口边缘部分，并且所述框架包括突出到所述窗口中并且然后被凸起的一对凸耳（42），所述凸耳槽（45）容纳所述窗口的上边缘部分。 框架还具有向前弹性偏压的一对手指（60），当凸耳首先突出到窗口中时，该指状物（60）被弹性地偏压在面板的后部，并且当凸起是 上调。 指状物位于从框架的主要部分突出的横向延伸的梁的端部。 凸耳和手指形成垂直引导插入卡的前缘的斜面（56,78），凸耳形成侧导板（112）。

    Patterning method
    54.
    发明申请
    Patterning method 有权
    图案化方法

    公开(公告)号：US20050124092A1

    公开(公告)日：2005-06-09

    申请号：US10485419

    申请日：2003-05-28

    申请人： Gian-Luca Bona ,  Bruno Michel ,  Hugo Rothuizen ,  Peter Vettiger ,  Han Biebuyck

    发明人： Gian-Luca Bona ,  Bruno Michel ,  Hugo Rothuizen ,  Peter Vettiger ,  Han Biebuyck

    IPC分类号： G02B5/18 ,  G03F7/00 ,  G03F9/00 ,  H01L21/48

    CPC分类号： B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/00 ,  Y10S438/975

    摘要： The invention relates to a method for creating a pattern on a substrate comprising a first alignment structure, using an elastomeric stamp comprising a patterning structure and a second alignment structure. The method comprises a moving step for moving the elastomeric stamp towards the substrate, and a deformation step for deforming the patterning structure with a tensile or compressive force generated by cooperation of the first alignment structure and the second alignment structure.

    摘要翻译： 本发明涉及一种用于在包括第一对准结构的基板上形成图案的方法，该方法使用包括图案化结构和第二对准结构的弹性印模。 该方法包括用于将弹性体印模移动到基板的移动步骤，以及用于通过第一对准结构和第二对准结构的协作产生的拉伸或压缩力使图案化结构变形的变形步骤。

    Method for forming patterns for semiconductor devices
    55.
    发明授权
    Method for forming patterns for semiconductor devices 有权
    用于形成半导体器件的图案的方法

    公开(公告)号：US06767828B2

    公开(公告)日：2004-07-27

    申请号：US09971953

    申请日：2001-10-05

    申请人： Paul S. Andry ,  John C. Flake ,  Bruno Michel ,  Takatoshi Tsujimura

    发明人： Paul S. Andry ,  John C. Flake ,  Bruno Michel ,  Takatoshi Tsujimura

    IPC分类号： H01L2144

    CPC分类号： H01L28/60 ,  H01L21/288 ,  H01L21/76841 ,  H01L28/55 ,  H01L2924/0002 ,  H05K3/182 ,  H05K3/389 ,  Y10T428/24926 ,  H01L2924/00

    摘要： A method for forming an electrically conductive layer having predetermined patterns for semiconductor devices includes providing a substrate, forming an insulation layer having OH functional groups on the substrate, forming a patterned polymer layer on the insulation layer, etching the insulation layer to create a patterned insulation layer which has the same patterns as the patterned polymer layer, stripping the patterned polymer layer to expose the patterned insulation layer, treating the patterned insulation layer with a coupling agent which reacts with the OH functional groups, treating the patterned insulation layer with a catalyst-containing solution in which the catalyst reacts with the coupling agent, and depositing electrically conductive material on the patterned insulation layer which is catalytically active.

    摘要翻译： 一种用于形成具有用于半导体器件的具有预定图案的导电层的方法包括提供衬底，在衬底上形成具有OH官能团的绝缘层，在绝缘层上形成图案化聚合物层，蚀刻绝缘层以产生图案绝缘 层，其具有与图案化聚合物层相同的图案，剥离图案化的聚合物层以暴露图案化绝缘层，用与OH官能团反应的偶联剂处理图案化绝缘层，用催化剂层处理图案化绝缘层， 其中催化剂与偶联剂反应，并且将导电材料沉积在具有催化活性的图案化绝缘层上。

    Current-to-voltage converter with low noise, wide bandwidth and high dynamic range
    56.
    发明授权
    Current-to-voltage converter with low noise, wide bandwidth and high dynamic range 失效
    具有低噪声，宽带宽和高动态范围的电流 - 电压转换器

    公开(公告)号：US5237493A

    公开(公告)日：1993-08-17

    申请号：US773053

    申请日：1991-10-08

    申请人： Urs T. Durig ,  Bruno Michel

    发明人： Urs T. Durig ,  Bruno Michel

    IPC分类号： G01R19/00 ,  G01R1/20 ,  G01R29/24 ,  H01J37/244 ,  H01J37/28 ,  H03F1/26 ,  H03F1/42

    CPC分类号： G01R1/203 ,  G01R29/24 ,  H03F1/26 ,  Y10S977/70 ,  Y10S977/861

    摘要： The design of a current-to-voltage converter with a uniform transfer function in its feedback loop (12) is proposed. It employs a very large, double-shielded measuring resistance (13) and a two-stage setup to perform a fully linear I/V conversion with a conversion factor of 10.sup.10 V/A and a bandwidth of 1 MHz. With the low noise level attained, and with the bandwidth and conversion factor mentioned, it will be possible to monitor events involving as few as 300 electrons. The current-to-voltage converter comprises a differential input amplifier (8), a current source (11) for supplying said differential amplifier (8), at least one operational amplifier (10, 14), and a high-valued measuring resistance (13) the voltage drop across which is being taken as a measure of the current to be detected. The measuring resistance (13) is arranged in a feedback loop (12) associated with said differential amplifier (8). The measuring resistance (13) is double-shielded from the remainder of the current/voltage converter circuitry through its arrangement inside a cylindrical capacitor C which acts as a first shield, and which is in turn connected to a casing (15, 25) surrounding the differential amplifier (8) and the feedback loop (12) and which constitutes a second shield.

    SOLID SORPTION REFRIGERATION
    60.
    发明申请
    SOLID SORPTION REFRIGERATION 有权
    固体制冷

    公开(公告)号：US20130298595A1

    公开(公告)日：2013-11-14

    申请号：US13996996

    申请日：2011-11-30

    申请人： Bruno Michel ,  Patrick Ruch

    发明人： Bruno Michel ,  Patrick Ruch

    IPC分类号： F25B15/00 ,  B21D53/02

    CPC分类号： B21D53/02 ,  F25B15/00 ,  F25B17/08 ,  F25B35/04 ,  F28F13/185 ,  Y02A30/276 ,  Y02A30/278 ,  Y02B30/64 ,  Y10T29/4935 ,  Y10T29/49359

    摘要： Integrated adsorption and heat exchanger devices are provided for solid sorption refrigeration systems (1), together with methods for making such devices. An integrated adsorption and heat exchanger device (20, 30, 45, 52) comprises a solid material having formed therein both a porous adsorption structure (21, 31, 44, 53), which is pervious to an adsorbate of said system (1), and a heat exchanger structure (22, 32), which is impervious to said adsorbate, for heat exchange with the porous adsorption structure in operation of the system (1).

    摘要翻译： 为固体吸附制冷系统（1）提供集成吸附和热交换器装置，以及制造这种装置的方法。 集成吸附和热交换器装置（20,30,45,52）包括其中形成有可渗透所述系统（1）的被吸附物的多孔吸附结构（21,31,44,53）的固体材料， ，以及在所述系统（1）的操作中不透过所述被吸附物质的热交换器结构（22,32），用于与所述多孔吸附结构进行热交换。