利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

114 条记录 (耗时 0.019 秒)

    SOLID SORPTION REFRIGERATION
    1.
    发明申请
    SOLID SORPTION REFRIGERATION 审中-公开
    固体制冷

    公开(公告)号：US20130340253A1

    公开(公告)日：2013-12-26

    申请号：US13975869

    申请日：2013-08-26

    申请人： Bruno Michel ,  Patrick Ruch

    发明人： Bruno Michel ,  Patrick Ruch

    IPC分类号： B21D53/02

    CPC分类号： B21D53/02 ,  F25B15/00 ,  F25B17/08 ,  F25B35/04 ,  F28F13/185 ,  Y02A30/276 ,  Y02A30/278 ,  Y02B30/64 ,  Y10T29/4935 ,  Y10T29/49359

    摘要： A method of making integrated adsorption and heat exchanger devices for solid sorption refrigeration systems (1). An integrated adsorption and heat exchanger device comprises a solid material having formed therein both a porous adsorption structure, which is pervious to an adsorbate of said system, and a heat exchanger structure, which is impervious to said adsorbate, for heat exchange with the porous adsorption structure in operation of the system.

    摘要翻译： 一种用于固体吸附制冷系统的集成吸附和热交换器装置的方法（1）。 集成的吸附和热交换器装置包括其中形成有可渗透所述系统的被吸附物的多孔吸附结构的固体材料和不透过所述被吸附物的热交换器结构，用于与多孔吸附物进行热交换 系统运行结构。

    Solid sorption refrigeration
    2.
    发明授权
    Solid sorption refrigeration 有权

    公开(公告)号：US10688553B2

    公开(公告)日：2020-06-23

    申请号：US13975869

    申请日：2013-08-26

    申请人： Bruno Michel ,  Patrick Ruch

    发明人： Bruno Michel ,  Patrick Ruch

    IPC分类号： B21D53/02 ,  F25B17/08 ,  F25B35/04 ,  F28F13/18 ,  F25B15/00

    摘要： A method of making integrated adsorption and heat exchanger devices for solid sorption refrigeration systems (1). An integrated adsorption and heat exchanger device comprises a solid material having formed therein both a porous adsorption structure, which is pervious to an adsorbate of said system, and a heat exchanger structure, which is impervious to said adsorbate, for heat exchange with the porous adsorption structure in operation of the system.

    SOLID SORPTION REFRIGERATION
    5.
    发明申请
    SOLID SORPTION REFRIGERATION 有权
    固体制冷

    公开(公告)号：US20130298595A1

    公开(公告)日：2013-11-14

    申请号：US13996996

    申请日：2011-11-30

    申请人： Bruno Michel ,  Patrick Ruch

    发明人： Bruno Michel ,  Patrick Ruch

    IPC分类号： F25B15/00 ,  B21D53/02

    CPC分类号： B21D53/02 ,  F25B15/00 ,  F25B17/08 ,  F25B35/04 ,  F28F13/185 ,  Y02A30/276 ,  Y02A30/278 ,  Y02B30/64 ,  Y10T29/4935 ,  Y10T29/49359

    摘要： Integrated adsorption and heat exchanger devices are provided for solid sorption refrigeration systems (1), together with methods for making such devices. An integrated adsorption and heat exchanger device (20, 30, 45, 52) comprises a solid material having formed therein both a porous adsorption structure (21, 31, 44, 53), which is pervious to an adsorbate of said system (1), and a heat exchanger structure (22, 32), which is impervious to said adsorbate, for heat exchange with the porous adsorption structure in operation of the system (1).

    摘要翻译： 为固体吸附制冷系统（1）提供集成吸附和热交换器装置，以及制造这种装置的方法。 集成吸附和热交换器装置（20,30,45,52）包括其中形成有可渗透所述系统（1）的被吸附物的多孔吸附结构（21,31,44,53）的固体材料， ，以及在所述系统（1）的操作中不透过所述被吸附物质的热交换器结构（22,32），用于与所述多孔吸附结构进行热交换。

    Adsorption heat exchanger devices
    6.
    发明授权
    Adsorption heat exchanger devices 有权

    公开(公告)号：US10533779B2

    公开(公告)日：2020-01-14

    申请号：US14128723

    申请日：2012-06-08

    申请人： Javier V. Goicochea ,  Bruno Michel ,  Patrick Ruch

    发明人： Javier V. Goicochea ,  Bruno Michel ,  Patrick Ruch

    IPC分类号： F25B17/08 ,  F25B37/00 ,  F28F3/02 ,  B82Y30/00

    摘要： Adsorption heat exchanger devices (11, 30) are provided for solid sorption refrigeration systems (1). Such a device includes a heat exchanger (12) having a plurality of projections (17) arranged for extending into an adsorbate of the system (1) in use. An adsorption structure (13, 31) is formed on the heat exchanger (12) for adsorption of said adsorbate. The adsorption structure (13, 31) comprises a plurality of elongate adsorption elements (20) extending outwardly from each of said projections (17) of the heat exchanger (12).

    Surface treatment
    7.
    发明授权
    Surface treatment 有权
    表面处理

    公开(公告)号：US09110056B2

    公开(公告)日：2015-08-18

    申请号：US12540526

    申请日：2009-08-13

    申请人： Sergey Amontov ,  Emmanuel Delamarche ,  Bruno Michel

    发明人： Sergey Amontov ,  Emmanuel Delamarche ,  Bruno Michel

    IPC分类号： C12M3/00 ,  G01N33/543

    CPC分类号： G01N33/54366

    摘要： A biosensor comprising surface treated with a method for producing a monolayer of molecules on a surface, the method comprising loading a stamp with seed molecules, transferring seed molecules from the stamp to the surface, wherein transferring comprises transferring a fraction of the seed molecules loaded on the stamp to the surface and adsorbing the seed molecules to the stamp and adsorbing the seed molecules to the surface, the adsorption of the seed molecules to the stamp being stronger than the adsorption of the seed molecules to the surface, self-completing amplification of the seed molecules via an amplifying reaction to produce the monolayer on a flat surface, wherein self-completing amplification comprises producing a homogeneous area, wherein the homogeneous area comprises a monolayer of molecules on the surface, and wherein the monolayer of molecules on the surface has no diffusive component that can relocate and destroy amplification accuracy.

    摘要翻译： 一种生物传感器，包括用在表面上产生单层分子的方法进行表面处理的方法，所述方法包括用种子分子加载印模，将种子分子从印模转移到表面，其中转印包括转移一部分加载的种子分子 将表面吸附并将种子分子吸附到印模上并将种子分子吸附到表面，种子分子对印模的吸附比种子分子吸附到表面更强，自我完成的扩增 种子分子通过扩增反应在平坦表面上产生单层，其中自我完成扩增包括产生均匀区域，其中均匀区域包括表面上的单分子层，并且其中表面上的单分子层没有 扩散成分可以重新定位并破坏放大精度。

    HEAT SPREADER
    9.
    发明申请
    HEAT SPREADER 审中-公开
    散热器

    公开(公告)号：US20130008632A1

    公开(公告)日：2013-01-10

    申请号：US13613881

    申请日：2012-09-13

    申请人： Thomas J. Brunschwiler ,  Urs Kloter ,  Ryan Joesph Linderman ,  Bruno Michel ,  Hugo E. Rothuizen

    发明人： Thomas J. Brunschwiler ,  Urs Kloter ,  Ryan Joesph Linderman ,  Bruno Michel ,  Hugo E. Rothuizen

    IPC分类号： F28D15/00

    CPC分类号： H01L23/427 ,  H01L23/4006 ,  H01L2224/73253

    摘要： A flexible, self-contained active multi-phase heat spreader apparatus for cooling electronic components, the heat spreader having fluid sealed between two plates and a pumping mechanism to actuate multi-phase flow of the fluid. Thermal energy from an electronic component in contact with the heat spreader is dissipated from a core region via the working fluid to the entire heat spreader, and then to a heat sink. Surface enhancement features located between the two plates aid transfer of thermal energy from a first metal plate into the fluid.

    摘要翻译： 一种用于冷却电子部件的灵活的，独立的主动多相散热装置，散热器具有密封在两个板之间的流体和泵送机构以致动流体的多相流动。 来自与散热器接触的电子部件的热能从核心区域经由工作流体散发到整个散热器，然后散热到散热器。 位于两个板之间的表面增强特征有助于将热能从第一金属板传递到流体中。

    Variable flow computer cooling system for a data center and method of operation
    10.
    发明授权
    Variable flow computer cooling system for a data center and method of operation 有权
    数据中心的可变流量计算机冷却系统和操作方法

    公开(公告)号：US08107234B2

    公开(公告)日：2012-01-31

    申请号：US12793896

    申请日：2010-06-04

    申请人： Thomas J. Brunschwiler ,  Ryan J. Linderman ,  Bruno Michel ,  Erich M. Ruetsche

    发明人： Thomas J. Brunschwiler ,  Ryan J. Linderman ,  Bruno Michel ,  Erich M. Ruetsche

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/20 ,  G06F2200/201 ,  H05K7/20772 ,  Y10S165/908

    摘要： Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.

    摘要翻译： 这里公开了具有多个液冷计算机系统的数据中心。 计算机系统各自包括与冷板相连的处理器，其允许直接液体冷却处理器。 冷板进一步布置成向处理器的不同部分提供适当的冷却流，从而较高的温度区域接收较大的冷却剂流速。 流量被可变地调整以反映不同的活动水平。 通过使离开计算机系统的冷却剂温度最大化，系统可以利用环境空气的自由冷却温度并且消除对冷却器的需要。 还提供了一个与区域供热系统相结合的数据中心，从计算机系统中提取热量用于抵消碳排放，降低数据中心的总体拥有成本。