摘要:
An operating method of a memory is provided. The memory includes a memory cell array composed of a plurality of memory cells, a plurality of bit lines, and a plurality of word lines. During programming the memory, a column of memory cells is selected. A voltage difference is respectively occurred between a bit line corresponding to first source/drain regions of the memory cells in the selected column and adjacent two bit lines, and a bias is respectively applied to a word line corresponding to a control gate of each memory cell in the selected column so as to allow a data bit of the memory cell at a plurality of predetermined programmed states and an unusable bit of each memory cell in an adjacent column which shares the same bit line with the selected column at an unusable state.
摘要:
A method of identifying logical information in a cell, particularly in a programming by hot hole injection nitride electron storage (PHINES) cell by one-side reading scheme is disclosed. The method comprise steps of: erasing the first region and the second region of PHINES cell by increasing a local threshold voltage (Vt) to a certain value; programming at least one of the first region and the second region of the PHINES cell by hot hole injection; and reading a logical state of the PHINES cell by measuring an output current of one of the first region and the second region; wherein different quantity of the output current is caused by interaction between different quantity of the hot hole stored in the first region and the second region, so as to determine the logical state of the PHINES cell by one-side reading scheme.
摘要:
A method of identifying logical information in a cell, particularly in a programming by hot hole injection nitride electron storage (PHINES) cell by one-side reading scheme is disclosed. The method comprise steps of: erasing the first region and the second region of PHINES cell by increasing a local threshold voltage (Vt) to a certain value; programming at least one of the first region and the second region of the PHINES cell by hot hole injection; and reading a logical state of the PHINES cell by measuring an output current of one of the first region and the second region; wherein different quantity of the output current is caused by interaction between different quantity of the hot hole stored in the first region and the second region, so as to determine the logical state of the PHINES cell by one-side reading scheme.
摘要:
A semiconductor process test structure comprises an electrode, a charge-trapping layer, and a diffusion region. The test structure is a capacitor-like structure in which the charge-trapping layer will trap charges during various processing steps. Gate-induced drain leakage (GIDL) measurement techniques can then be used to characterize the charging status of the test structure.
摘要:
A memory includes a phase change element having a first side and a second side and a first line coupled to the first side of the element. The memory includes an access device coupled to the second side of the element and a second line coupled to the access device for controlling the access device. The memory includes a circuit for precharging the first line to a first voltage and for applying a voltage pulse to the second line such that a current pulse is generated through the access device to the element to program the element to a selected one of more than two states. The voltage pulse has an amplitude based on the selected state.
摘要:
A semiconductor process test structure comprises a gate electrode, a charge-trapping layer, and a diffusion region. The test structure is a capacitor-like structure in which the charge-trapping layer will trap charges during various processing steps. A CV measurement can then be used to detect whether a Vfb shift has occurred. If the process step resulted in a charge effect, then the induced charge will not be uniform. If the charging of the test structure is not uniform, then there will not be a Vfb shift. A delayed inversion point technique can then be used to monitor the charging status.
摘要:
A memory array comprising vertical memory cells does not require any isolation layers between cells. Thus, a very compact, high density memory array can be achieved. Each memory cell in the memory array is configured to store 4 bits of data per cell. Multi-level charge techniques can be used to increase the number of bit per cell and achieve further increased density for the memory array.
摘要:
The present invention provides an adaptive Y/C separation circuit for video signal processing that is capable of correcting previous color discrepancy in separating the luminance (Y) and chrominance (C) signals from the color video signals. In the process, the correlation of video signals on referencing scanning lines is analyzed by transposing the chrominance signals onto a two-dimensional UV plane. A correlation coefficient is obtained through the analysis for adjusting the video signals in the direction of the actual chrominance level, thus separating the luminance and chrominance signals with relatively low cost circuit implementation.
摘要:
A method for controlling current fluctuations during read and program operations in a memory structure is provided. The method includes applying a first voltage to a first gate of a word line decoder transistor. The method further includes applying a second voltage to a second gate of a bit line decoder transistor such that the first voltage is greater than the second voltage. The method also includes maintaining the source voltage of the bit line decoder transistor at about zero.
摘要:
An electrically erasable programmable read only memory cell has a stacking layer, a gate conductive layer, a first source/drain region, a second source/drain region, a first pocket implant doping region, and a second pocket implant doping region. The stacking layer is disposed over a substrate. The gate conductive layer is located on the stacking layer. The first source/drain region and the second source/drain region are respectively disposed over the substrate on two sides of the gate conductive layer. The first pocket implant doping region is disposed over the substrate under the stacking layer, and adjacent to the first source/drain region. The second pocket implant doping region is disposed over the substrate under the stacking layer, and adjacent to the second source/drain region, wherein the doping concentration of the first pocket implant region is different from that of the second pocket implant region.