公开(公告)号：US10937594B2

公开(公告)日：2021-03-02

申请号：US16606130

申请日：2017-06-27

Applicant: Intel Corporation

Inventor： Thomas L. Sounart ,  Aleksandar Aleksov ,  Feras Eid ,  Georgios C. Dogiamis ,  Johanna M. Swan ,  Kristof Darmawikarta

IPC: H01G4/14 ,  H05K1/02 ,  H05K1/03

Abstract: Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers and a capacitor formed in-situ with at least one organic dielectric layer of the plurality of organic dielectric layers. The capacitor includes first and second conductive electrodes and an ultra-high-k dielectric layer that is positioned between the first and second conductive electrodes.

公开(公告)号：US10593636B2

公开(公告)日：2020-03-17

申请号：US16127820

申请日：2018-09-11

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Brandon M. Rawlings ,  Feras Eid

IPC: H01L23/36 ,  H01L23/66 ,  H01L23/498 ,  H01L23/367 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065

Abstract: Embodiments of the invention may include a packaged device that includes thermally stable radio frequency integrated circuits (RFICs). In one embodiment the packaged device may include an integrated circuit chip mounted to a package substrate. According to an embodiment, the package substrate may have conductive lines that communicatively couple the integrated circuit chip to one or more external components. One of the external components may be an RFIC module. The RFIC module may comprise an RFIC and an antenna. Additional embodiments may also include a packaged device that includes a plurality of cooling spots formed into the package substrate. In an embodiment the cooling spots may be formed proximate to interconnect lines the communicatively couple the integrated circuit chip to the RFIC.

公开(公告)号：US10573608B2

公开(公告)日：2020-02-25

申请号：US15776021

申请日：2015-12-22

Applicant: INTEL CORPORATION

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Eric J. Li ,  Javier A. Falcon ,  Yoshihiro Tomita ,  Vijay K. Nair ,  Shawna M. Liff

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L25/16

Abstract: Embodiments of the invention include a microelectronic device that includes a first die having a silicon based substrate and a second die coupled to the first die. In one example, the second die is formed with compound semiconductor materials. The microelectronic device includes a substrate that is coupled to the first die with a plurality of electrical connections. The substrate including an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US10546835B2

公开(公告)日：2020-01-28

申请号：US15777040

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Georgios C. Dogiamis ,  Telesphor Kamgaing

IPC: H01L25/065 ,  H01L23/66 ,  H01L25/10 ,  H01L23/00

Abstract: Embodiments of the invention include a microelectronic device that includes a transceiver coupled to a first substrate and a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. An interposer substrate can provide a spacing between the first and second substrates.

公开(公告)号：US20190103932A1

公开(公告)日：2019-04-04

申请号：US15721868

申请日：2017-09-30

Applicant: Intel Corporation

Inventor： Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Erich N. Ewy

IPC: H04J14/02 ,  G02B6/12 ,  H01S5/024 ,  H04B10/50 ,  H04B10/572

CPC classification number: H04J14/02 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12033 ,  H01S5/02415 ,  H04B10/506 ,  H04B10/572 ,  H04B10/90

Abstract: Embodiments include a wavelength selective communication system for use in vehicles. In an embodiment, the communication system may include a primary dielectric waveguide having a first cross-sectional area. In an embodiment, a coupling arm dielectric waveguide may be communicatively coupled to the primary dielectric waveguide. In an embodiment, the coupling arm has a second cross-sectional area that is smaller than or equal to the cross-sectional area of the first cross-sectional area. According to an embodiment, the coupling arm is communicatively coupled to the primary dielectric waveguide by a waveguide connector.

公开(公告)号：US20190013924A1

公开(公告)日：2019-01-10

申请号：US16127800

申请日：2018-09-11

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Emanuel Cohen ,  Sasha N. Oster

IPC: H04L5/14 ,  H04W72/04 ,  H04B1/44

Abstract: Embodiments of the present disclosure may relate to a transceiver to transmit and receive concurrently radio frequency (RF) signals via a dielectric waveguide. In embodiments, the transceiver may include a transmitter to transmit to a paired transceiver a channelized radio frequency (RF) transmit signal via the dielectric waveguide. A receiver may receive from the paired transceiver a channelized RF receive signal via the dielectric waveguide. In embodiments, the channelized RF receive signal may include an echo of the channelized RF transmit signal. The transceiver may further include an echo suppression circuit to suppress from the channelized RF receive signal the echo of the channelized RF transmit signal. In some embodiments, the channelized RF transmit signal and the channelized RF receive signal may be within a frequency range of approximately 30 gigahertz (GHz) to approximately 1 terahertz (THz), and the transceiver may provide full-duplex millimeter-wave communication.

公开(公告)号：US20180324530A1

公开(公告)日：2018-11-08

申请号：US15589203

申请日：2017-05-08

Applicant: Intel Corporation

Inventor： Kevin R. Hoskins ,  Arun P. Jose ,  David Harkness ,  Georgios C. Dogiamis ,  Rajashree Raji Baskaran

IPC: H04R17/02 ,  H04R1/46

CPC classification number: H04R17/02 ,  H04R1/265 ,  H04R1/46 ,  H04R2410/07 ,  H04R2499/11

Abstract: A piezoelectric contact microphone with a mechanical vibration conduction interface provides an improved mobile electronic device microphone. In an embodiment, the mechanical vibration conduction interface is placed on a bone structure and conducts vibration from the bone structure to the piezoelectric contact microphone. Because of the direct contact, this use of piezoelectric contact microphone reduces or eliminates interferences effects due to wind and other airflow over the microphone. The mechanical vibration conduction interface materials and structure are selected to provide effective transmission of vibration from the bone structure to the piezoelectric element within the piezoelectric contact microphone. This piezoelectric contact microphone enables mobile electronic devices to provide improved voice communication, voice transcription, and voice command recognition in the presence of wind noise and other noise.

公开(公告)号：US10116504B2

公开(公告)日：2018-10-30

申请号：US15283129

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Shawna M. Liff ,  Adel A. Elsherbini ,  Sasha N. Oster ,  Feras Eid ,  Georgios C. Dogiamis ,  Thomas L. Sounart ,  Johanna M. Swan

IPC: H01L41/047 ,  H01L41/09 ,  H04L12/24 ,  H01H57/00 ,  H01L41/187 ,  A61B5/0205 ,  A61B5/00 ,  A61B5/024 ,  A61B5/021 ,  A61B5/08 ,  A61B5/145

Abstract: Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.

公开(公告)号：US10079668B2

公开(公告)日：2018-09-18

申请号：US15388204

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Emanuel Cohen ,  Sasha N. Oster

IPC: H04L5/14 ,  H04B1/44 ,  H04W72/04

Abstract: Embodiments of the present disclosure may relate to a transceiver to transmit and receive concurrently radio frequency (RF) signals via a dielectric waveguide. In embodiments, the transceiver may include a transmitter to transmit to a paired transceiver a channelized radio frequency (RF) transmit signal via the dielectric waveguide. A receiver may receive from the paired transceiver a channelized RF receive signal via the dielectric waveguide. In embodiments, the channelized RF receive signal may include an echo of the channelized RF transmit signal. The transceiver may further include an echo suppression circuit to suppress from the channelized RF receive signal the echo of the channelized RF transmit signal. In some embodiments, the channelized RF transmit signal and the channelized RF receive signal may be within a frequency range of approximately 30 gigahertz (GHz) to approximately 1 terahertz (THz), and the transceiver may provide full-duplex millimeter-wave communication.

公开(公告)号：US10032052B2

公开(公告)日：2018-07-24

申请号：US15586820

申请日：2017-05-04

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Telesphor Kamgaing ,  Feras Eid ,  Vijay K. Nair ,  Georgios C. Dogiamis ,  Johanna M. Swan ,  Valluri R. Rao

IPC: G06K19/06 ,  G06K7/10 ,  H03H9/30 ,  G06K19/067

Abstract: Embodiments of the invention include delay line circuitry that is integrated with an organic substrate. Organic dielectric material and a plurality of conductive layers form the organic substrate. The delay line circuitry includes a piezoelectric transducer to receive a guided electromagnetic wave signal and to generate an acoustic wave signal to be transmitted with an acoustic transmission medium. An acoustic reflector is communicatively coupled to the acoustic transmission medium. The acoustic reflector receives a plurality of acoustic wave signals from the acoustic transmission medium and reflects acoustic wave signals to the piezoelectric transducer using the acoustic transmission medium. The transducer converts the reflected acoustic signals into electromagnetic waves which are then transmitted back through the antenna and decoded by the reader.