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公开(公告)号:US10530614B2
公开(公告)日:2020-01-07
申请号:US16230974
申请日:2018-12-21
Applicant: Intel Corporation
Inventor: Hsinho Wu , Masashi Shimanouchi , Peng Li
Abstract: Systems and methods for electronic devices including two or more semiconductor devices coupled via an interconnect. The interconnect includes multiple lanes each having a link between the first and second semiconductor devices. One or more lanes of the multiple lanes each include clock and data recovery circuitry to perform full clock and data recovery. One or more other lanes of the multiple lanes each do not include clock and data recovery circuitry and instead includes a phase adjustment and clock multiplier circuit that is slave to clock and data recovery circuitry of the one or more lanes.
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公开(公告)号:US10409500B2
公开(公告)日:2019-09-10
申请号:US15699930
申请日:2017-09-08
Applicant: Intel Corporation
Inventor: Sanjeev N. Trika , Peng Li , Jawad B. Khan
IPC: G06F3/06 , H03M13/29 , G06F11/10 , G11C29/52 , G06F12/1009
Abstract: One embodiment provides a memory controller. The memory controller includes logical block address (LBA) section defining logic to define a plurality of LBA sections for a memory device circuitry, each section including a range of LBAs, and each section including a unique indirection-unit (IU) granularity; wherein the IU granularity defines a physical region size of the memory device. The LBA section defining logic also to generate a plurality of logical-to-physical (L2P) tables to map a plurality of LBAs to physical locations of the memory device, each L2P table corresponding to an LBA section. The memory controller also includes LBA section notification logic to notify a file system of the plurality of LBA sections to enable the file system to issue a read and/or write command having an LBA based on an IU granularity associated with an LBA section.
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公开(公告)号:US10365844B2
公开(公告)日:2019-07-30
申请号:US15394453
申请日:2016-12-29
Applicant: INTEL CORPORATION
Inventor: Peng Li , Sanjeev N. Trika
Abstract: Provided are an apparatus, method, and system for logical block address to physical block address (L2P) compression. In response to a physical block address (PBA) of a first indirection unit (IU) among a plurality of IUs in a compression unit being updated, it is determined whether IU data of the plurality of IUs is compressible. In response to determining that the IU data is compressible, one or more contiguous IU groups in the compression unit that are compressible are identified based on corresponding PBAs and, then, a compression unit descriptor and PBAs for unique IUs of the plurality of IUs are written into the compression unit. In response to determining that the IU data is incompressible, a flag indicating that IU data is incompressible, PBAs for some of the IUs, and a pointer to PBAs of remaining IUs are written into the compression unit.
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54.
公开(公告)号:US10296224B2
公开(公告)日:2019-05-21
申请号:US15387600
申请日:2016-12-21
Applicant: INTEL CORPORATION
Inventor: Peng Li , William K. Lui , Sanjeev N. Trika
Abstract: Provided are an apparatus, system and method for using a validity table indicating whether physical addresses have valid data to optimize write and defragmentation operations. A non-volatile memory storage device has non-volatile memory and a main memory. A memory controller reads and writes to the non-volatile memory and maintains in the main memory a logical-to-physical address table indicating, for each logical address of a plurality of logical addresses, a physical address in the non-volatile memory having data for the logical address. The main memory maintains a validity table indicating for each physical address of a plurality of physical addresses in the non-volatile memory whether the physical address has valid data.
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公开(公告)号:US20190138468A1
公开(公告)日:2019-05-09
申请号:US16242471
申请日:2019-01-08
Applicant: Intel Corporation
Inventor: Peng Li , David J. Pelster , William Harper
Abstract: An embodiment of a semiconductor apparatus may include technology to detect a collision for a read request of an electronic storage device, and read data for the read request directly from a transfer buffer if the collision is detected. Other embodiments are disclosed and claimed.
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公开(公告)号:US20190042113A1
公开(公告)日:2019-02-07
申请号:US15939432
申请日:2018-03-29
Applicant: Intel Corporation
Inventor: Peng Li , Sanjeev Trika , Jawad Khan , Myron Loewen
Abstract: An embodiment of a semiconductor apparatus may include technology to determine a persistent region and a non-persistent region of a volatile media based on an amount of power available from one or more backup power sources, and periodically backup only the non-persistent region of the volatile media to a non-volatile media. Other embodiments are disclosed and claimed.
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公开(公告)号:US20180089076A1
公开(公告)日:2018-03-29
申请号:US15278837
申请日:2016-09-28
Applicant: Intel Corporation
Inventor: Peng Li , Anand S. Ramalingam , William K. Lui , Sanjeev N. Trika
CPC classification number: G06F12/0246 , G06F3/0616 , G06F3/0631 , G06F3/0644 , G06F3/0656 , G06F3/0659 , G06F3/0665 , G06F3/0679 , G06F2212/1036 , G06F2212/152 , G06F2212/214 , G06F2212/651 , G06F2212/7201 , G06F2212/7202 , G06F2212/7203 , G11C14/0009
Abstract: Technologies for combining logical-to-physical address updates include a data storage device. The data storage device includes a non-volatile memory to store data and a logical to physical (L2P) table indicative of logical addresses and associated physical addresses of the data. Additionally, the data storage device includes a volatile memory to store one or more bins. Each bin is indicative of a subset of entries in the L2P table. Further, the data storage device includes a controller to allocate a bin in the volatile memory, write a plurality of updates to a subset of entries of the L2P table to the bin, and write the bin to the L2P table in a single write operation. Other embodiments are also described and claimed.
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公开(公告)号:US20240418951A1
公开(公告)日:2024-12-19
申请号:US18795148
申请日:2024-08-05
Applicant: Intel Corporation
Inventor: Peng Li , Joel Martinez , Jon Long
IPC: G02B6/43 , H01L23/00 , H01L23/498 , H01L23/538 , H01L25/065 , H04B10/40
Abstract: A multichip package may include at least a package substrate, a main die mounted on the package substrate, a transceiver die mounted on the package substrate, and an optical engine die mounted on the package substrate. The main die may communicate with the transceiver die via a first high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die may communicate with the optical engine die via a second high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die has physical-layer circuits that directly drive the optical engine. An optical cable can be connected directly to the optical engine of the multichip package.
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公开(公告)号:US12166004B2
公开(公告)日:2024-12-10
申请号:US16406593
申请日:2019-05-08
Applicant: Intel Corporation
Inventor: Susmriti Das Mahapatra , Bamidele Daniel Falola , Amitesh Saha , Peng Li
IPC: H01L23/00 , H01L23/373
Abstract: Embodiments may relate to a microelectronic package comprising that includes a solder thermal interface material (STIM). The STIM may include indium and a dopant material which may provide a number of benefits to the STIM. The STIM may physically and thermally couple a die and an integrated heat spreader (IHS). Other embodiments may be described or claimed.
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公开(公告)号:US12055777B2
公开(公告)日:2024-08-06
申请号:US17723174
申请日:2022-04-18
Applicant: Intel Corporation
Inventor: Peng Li , Joel Martinez , Jon Long
IPC: G02B6/43 , H01L23/00 , H01L23/498 , H01L23/538 , H01L25/065 , H04B10/40
CPC classification number: G02B6/43 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/5385 , H01L24/14 , H01L24/48 , H01L24/81 , H01L25/0655 , H04B10/40 , H01L24/13 , H01L24/16 , H01L2224/13101 , H01L2224/1403 , H01L2224/16225 , H01L2924/10253 , H01L2924/15311 , H01L2924/3511 , H01L2924/3511 , H01L2924/00 , H01L2224/13101 , H01L2924/014 , H01L2924/00014 , H01L2924/10253 , H01L2924/00012
Abstract: A multichip package may include at least a package substrate, a main die mounted on the package substrate, a transceiver die mounted on the package substrate, and an optical engine die mounted on the package substrate. The main die may communicate with the transceiver die via a first high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die may communicate with the optical engine die via a second high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die has physical-layer circuits that directly drive the optical engine. An optical cable can be connected directly to the optical engine of the multichip package.
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