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    MZM LINEAR DRIVER FOR SILICON PHOTONICS DEVICE CHARACTERIZED AS TWO-CHANNEL WAVELENGTH COMBINER AND LOCKER
    51.
    发明申请
    MZM LINEAR DRIVER FOR SILICON PHOTONICS DEVICE CHARACTERIZED AS TWO-CHANNEL WAVELENGTH COMBINER AND LOCKER 有权
    用于硅光电子器件的MZM线性驱动器表征为两个通道波长组合器和锁定器

    公开(公告)号：US20160363835A1

    公开(公告)日：2016-12-15

    申请号：US15247091

    申请日：2016-08-25

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. NAGARAJAN

    IPC: G02F1/225

    CPC classification number: G02F1/2257 ,  G02F1/0121 ,  G02F1/0123 ,  G02F1/025 ,  G02F1/225 ,  G02F2001/212

    Abstract: The present invention includes a Mach-Zehnder modulator (MZM) linear driver configured in a differential form with two waveguides carrying two traveling waves which supports a two-channel spectral combiner integrated with a wavelength locker. By coupling a DC current source supplied with a modulation voltage with each segment thereof for providing electrical modulation signal overlapping with each of the two traveling waves. The modulated traveling waves in the two waveguides then are combined in one output signal by a multimode interference coupler. Two optical signals at ITU grid channels are separately modulated by two MZMs and combined into a silicon waveguide-based delayed-line interferometer built on a SOI substrate to produce an output signal having a free spectral range equal to twice of the spacing of the two ITU grid channels. Two dither signals can be added respectively to the two optical signals for identifying and locking corresponding two channel wavelengths.

    Abstract translation: 本发明包括以差分形式配置的马赫 - 曾德尔调制器（MZM）线性驱动器，其中两个波导携带两个支持与波长锁存器集成的双通道频谱组合器的行波。 通过将提供有调制电压的DC电流源与其每个段耦合以提供与两个行波中的每一个重叠的电调制信号。 然后，两个波导中的调制行波由多模干涉耦合器组合在一个输出信号中。 国际电联电网信道上的两个光信号由两个MZM单独调制，并组合成一个内置在SOI衬底上的基于硅波导的延迟线干涉仪，以产生一个自由频谱范围等于两个ITU的间隔的两倍的输出信号 电网通道。 可以将两个抖动信号分别添加到两个光信号中，以识别和锁定相应的两个信道波长。

    CO-PACKAGED LIGHT ENGINE CHIPLETS ON SWITCH SUBSTRATE
    53.
    发明申请
    CO-PACKAGED LIGHT ENGINE CHIPLETS ON SWITCH SUBSTRATE 有权

    公开(公告)号：US20210385560A1

    公开(公告)日：2021-12-09

    申请号：US16894611

    申请日：2020-06-05

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. NAGARAJAN ,  Liang DING ,  Mark PATTERSON ,  Roberto COCCIOLI ,  Steve ABOAGYE

    IPC: H04Q11/00 ,  G02B6/42

    Abstract: A co-packaged optical-electrical module includes a module substrate with a minimum lateral dimension no greater than 100 mm. The co-packaged optical-electrical module further includes a main die with a processor chip disposed at a central region of the module substrate, the processor chip being configured to operate with a digital-signal processing (DSP) interface for extra-short-reach data interconnect. Additionally, the co-packaged optical-electrical module includes a plurality of chiplet dies disposed densely along a peripheral region of the module substrate. Each chiplet die is configured to be self-packaged light engine on a sub-module substrate with a minimum lateral dimension to allow a maximum number of chiplet dies on the module substrate with a distance of any chiplet die from the main die smaller than 50 mm for extra-short-reach interconnect operation.

    INTEGRATED COMPACT IN-PACKAGE LIGHT ENGINE
    54.
    发明申请
    INTEGRATED COMPACT IN-PACKAGE LIGHT ENGINE 有权

    公开(公告)号：US20210175973A1

    公开(公告)日：2021-06-10

    申请号：US17116737

    申请日：2020-12-09

    Applicant: INPHI CORPORATION

    Inventor： Ding LIANG ,  Mark PATTERSON ,  Roberto COCCIOLI ,  Radhakrishnan L. NAGARAJAN

    IPC: H04B10/40 ,  G02B6/42 ,  H01S5/02 ,  H01S5/0234

    Abstract: An integrated compact light engine configured in a on-board in-package optics assembly. The compact light engine includes a single substrate to integrate multiple optical-electrical modules. Each optical-electrical module includes an integrated optical transceiver based on silicon-photonics platform, in which a transmit path configured to output four light signals centered at four CWDM wavelengths and from four laser devices and to modulate the four light signals respectively by four modulators driven by a driver chip and to deliver a multiplexed transmission light. A receive path includes a photodetector to detect four input signals demultiplexed from an incoming light and a trans-impedance amplifier chip to process electrical signals converted from the four input signals detected. A multi-channel light engine is formed by co-integrating or co-mounting a switch device with multiple compact light engines on a common substrate member to provide up to 51.2 Tbit/s total capacity of data communication with median-or-short-reach electrical interconnect.

    INTEGRATED COHERENT OPTICAL TRANSCEIVER, LIGHT ENGINE
    55.
    发明申请
    INTEGRATED COHERENT OPTICAL TRANSCEIVER, LIGHT ENGINE 审中-公开

    公开(公告)号：US20200301070A1

    公开(公告)日：2020-09-24

    申请号：US16842115

    申请日：2020-04-07

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. NAGARAJAN

    IPC: G02B6/12 ,  H01S5/022 ,  H01S5/00 ,  G02B6/42 ,  G02B6/126 ,  G02B6/122 ,  H04B10/40

    Abstract: An coherent transceiver includes a single silicon photonics substrate configured to integrate a laser diode chip flip-mounted and coupled with a wavelength tuning section to provide a laser output with tuned wavelengths which is split in X:Y ratio partly into a coherent receiver block as local-oscillator signals and partly into a coherent transmitter block as a light source. The coherent receiver includes a polarization-beam-splitter-rotator to split a coherent input signal to a TE-mode signal and a TM*-mode signal respectively detected by two 90-deg hybrid receivers and a flip-mounted TIA chip assisted by two local-oscillator signals from the tunable laser device. The coherent transmitter includes a driver chip flip-mounted on the silicon photonics substrate to drive a pair of Mach-Zehnder modulators with 90-degree shift in quadrature-phase branches to modulate the laser output to two polarized signals with I/Q modulation and uses a polarization-beam-rotator-combiner to combine them as a coherent output signal.

    SILICON PHOTONICS BASED TUNABLE LASER
    57.
    发明申请
    SILICON PHOTONICS BASED TUNABLE LASER 审中-公开

    公开(公告)号：US20200212651A1

    公开(公告)日：2020-07-02

    申请号：US16818801

    申请日：2020-03-13

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. NAGARAJAN ,  Masaki KATO ,  Nourhan EID ,  Kenneth Ling WONG

    IPC: H01S5/0687 ,  H01S5/10 ,  H01S5/14 ,  H01S5/40 ,  H01S5/022 ,  H01S5/343 ,  H01S5/02 ,  H01S5/026 ,  H01S5/028 ,  H01S5/06

    Abstract: A tunable laser device based on silicon photonics includes a substrate configured with a patterned region comprising one or more vertical stoppers, an edge stopper facing a first direction, a first alignment feature structure formed in the patterned region along the first direction, and a bond pad disposed between the vertical stoppers. Additionally, the tunable laser includes an integrated coupler built in the substrate located at the edge stopper and a laser diode chip including a gain region covered by a P-type electrode and a second alignment feature structure formed beyond the P-type electrode. The laser diode chip is flipped to rest against the one or more vertical stoppers with the P-type electrode attached to the bond pad and the gain region coupled to the integrated coupler. Moreover, the tunable laser includes a tuning filter fabricated in the substrate and coupled via a wire waveguide to the integrated coupler.

    PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE
    58.
    发明申请
    PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE 审中-公开

    公开(公告)号：US20200018912A1

    公开(公告)日：2020-01-16

    申请号：US16579671

    申请日：2019-09-23

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. NAGARAJAN ,  Peng-Chih LI ,  Masaki KATO

    IPC: G02B6/42 ,  H04B10/40 ,  H04B10/516

    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

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