公开(公告)号：US10783084B2

公开(公告)日：2020-09-22

申请号：US16702073

申请日：2019-12-03

Applicant: Intel Corporation

Inventor： Abhishek R. Appu ,  Atlug Koker ,  Joydeep Ray ,  David Puffer ,  Prasoonkumar Surti ,  Lakshminarayanan Striramassarma ,  Vasanth Ranganathan ,  Kiran C. Veernapu ,  Balaji Vembu ,  Pattabhiraman K

IPC: G06F12/0877 ,  G06F12/0868 ,  G06F12/0846 ,  G06F12/0855 ,  G06F12/0802 ,  G06F12/0806 ,  G06F12/0893 ,  G06F12/126 ,  G06T1/60

Abstract: In an example, an apparatus comprises a plurality of execution units, and a cache memory communicatively coupled to the plurality of execution units, wherein the cache memory is structured into a plurality of sectors, wherein each sector in the plurality of sectors comprises at least two cache lines. Other embodiments are also disclosed and claimed.

公开(公告)号：US10719447B2

公开(公告)日：2020-07-21

申请号：US15275912

申请日：2016-09-26

Applicant: Intel Corporation

Inventor： Tomas G. Akenine-Moller ,  Prasoonkumar Surti ,  Altug Koker ,  David Puffer ,  Jim K. Nilsson

IPC: G06F12/00 ,  G06F13/00 ,  G06F13/28 ,  G06F12/0875 ,  G06F12/02 ,  G06T1/20 ,  G06T1/60 ,  G06T15/00 ,  G06F3/06 ,  G06F40/12 ,  G06F12/084 ,  G06F12/0842

Abstract: Described herein are several embodiments which provide for enhanced data caching in combination with adaptive and dynamic compression to increase the storage efficiency and reduce the transmission bandwidth of data during input and output from a GPU. The techniques described herein can reduce the need to access off-chip memory, resulting in improved performance and reduced power for GPU operations. One embodiment provides for a graphics processing apparatus comprising a shader engine; one or more cache memories; cache control logic to control at least one of the one or more cache memories; and a codec unit coupled with the one or more cache memories, the codec unit configurable to perform lossless compression of read-only surface data upon storage to or eviction from the one or more cache memories.

公开(公告)号：US10380039B2

公开(公告)日：2019-08-13

申请号：US15482690

申请日：2017-04-07

Applicant: Intel Corporation

Inventor： Niranjan L. Cooray ,  Satyeshwar Singh ,  Sameer KP ,  Ankur N. Shah ,  Kun Tian ,  Abhishek R. Appu ,  Altug Koker ,  Joydeep Ray ,  Balaji Vembu ,  Pattabhiraman K ,  David Puffer ,  David J. Cowperthwaite ,  Rajesh M. Sankaran

IPC: G06F12/109 ,  G06F11/07 ,  G06F13/16 ,  G06F12/1009 ,  G06F12/1027 ,  G06F12/1036 ,  G06F12/0802 ,  G06F13/40

Abstract: An apparatus and method are described for implementing memory management in a graphics processing system. For example, one embodiment of an apparatus comprises: a first plurality of graphics processing resources to execute graphics commands and process graphics data; a first memory management unit (MMU) to communicatively couple the first plurality of graphics processing resources to a system-level MMU to access a system memory; a second plurality of graphics processing resources to execute graphics commands and process graphics data; a second MMU to communicatively couple the second plurality of graphics processing resources to the first MMU; wherein the first MMU is configured as a master MMU having a direct connection to the system-level MMU and the second MMU comprises a slave MMU configured to send memory transactions to the first MMU, the first MMU either servicing a memory transaction or sending the memory transaction to the system-level MMU on behalf of the second MMU.

公开(公告)号：US10373285B2

公开(公告)日：2019-08-06

申请号：US15482810

申请日：2017-04-09

Applicant: Intel Corporation

Inventor： Joydeep Ray ,  Altug Koker ,  James A. Valerio ,  David Puffer ,  Abhishek R. Appu ,  Stephen Junkins

IPC: G06T1/60 ,  G06T1/20 ,  G06F12/0811 ,  G06F12/0815 ,  G06F12/0831 ,  G06F12/0888

Abstract: One embodiment provides for a general-purpose graphics processing device comprising a general-purpose graphics processing compute block to process a workload including graphics or compute operations, a first cache memory, and a coherency module enable the first cache memory to coherently cache data for the workload, the data stored in memory within a virtual address space, wherein the virtual address space shared with a separate general-purpose processor including a second cache memory that is coherent with the first cache memory.

公开(公告)号：US20180293693A1

公开(公告)日：2018-10-11

申请号：US15482810

申请日：2017-04-09

Applicant: Intel Corporation

Inventor： Joydeep Ray ,  Altug Koker ,  James A. Valerio ,  David Puffer ,  Abhishek R. Appu ,  Stephen Junkins

IPC: G06T1/20 ,  G06T1/60

CPC classification number: G06T1/20 ,  G06F12/0811 ,  G06F12/0815 ,  G06F12/0831 ,  G06F12/0888 ,  G06F2212/1024 ,  G06F2212/302 ,  G06F2212/621 ,  G06F2212/656 ,  G06F2212/657 ,  G06T1/60

Abstract: One embodiment provides for a general-purpose graphics processing device comprising a general-purpose graphics processing compute block to process a workload including graphics or compute operations, a first cache memory, and a coherency module enable the first cache memory to coherently cache data for the workload, the data stored in memory within a virtual address space, wherein the virtual address space shared with a separate general-purpose processor including a second cache memory that is coherent with the first cache memory.

公开(公告)号：US20180293692A1

公开(公告)日：2018-10-11

申请号：US15482808

申请日：2017-04-09

Applicant: Intel Corporation

Inventor： Altug Koker ,  Ingo Wald ,  David Puffer ,  Subramaniam M. Maiyuran ,  Prasoonkumar Surti ,  Balaji Vembu ,  Guei-Yuan Lueh ,  Murali Ramadoss ,  Abhishek R. Appu ,  Joydeep Ray

IPC: G06T1/20 ,  G06T1/60

CPC classification number: G06T1/20 ,  G06F9/3009 ,  G06F9/30185 ,  G06F9/3851 ,  G06F9/461 ,  G06F9/4843

Abstract: One embodiment provides for a parallel processor comprising a processing array within the parallel processor, the processing array including multiple compute blocks, each compute block including multiple processing clusters configured for parallel operation, wherein each of the multiple compute blocks is independently preemptable. In one embodiment a preemption hint can be generated for source code during compilation to enable a compute unit to determine an efficient point for preemption.

公开(公告)号：US09542336B2

公开(公告)日：2017-01-10

申请号：US14133097

申请日：2013-12-18

Applicant: INTEL CORPORATION

Inventor： Marc Torrant ,  David Puffer ,  Blaise Fanning ,  Bryan White ,  Joydeep Ray ,  Neil Schaper ,  Todd Witter ,  Altug Koker ,  Aditya Sreenivas

IPC: G06F12/02 ,  G06F12/08 ,  G06F12/10 ,  G06F12/12

CPC classification number: G06F12/126

Abstract: A processing device comprises an instruction execution unit, a memory agent and pinning logic to pin memory pages in a multi-level memory system upon request by the memory agent. The pinning logic includes an agent interface module to receive, from the memory agent, a pin request indicating a first memory page in the multi-level memory system, the multi-level memory system comprising a near memory and a far memory. The pinning logic further includes a memory interface module to retrieve the first memory page from the far memory and write the first memory page to the near memory. In addition, the pinning logic also includes a descriptor table management module to mark the first memory page as pinned in the near memory, wherein marking the first memory page as pinned comprises setting a pinning bit corresponding to the first memory page in a cache descriptor table and to prevent the first memory page from being evicted from the near memory when the first memory page is marked as pinned.

Abstract translation: 处理设备包括指令执行单元，存储器代理和钉住逻辑，以在存储器请求时针对多级存储器系统中的存储器页面进行引脚。 钉扎逻辑包括代理接口模块，用于从存储器代理接收指示多级存储器系统中的第一存储器页的引脚请求，所述多级存储器系统包括近存储器和远存储器。 钉扎逻辑还包括存储器接口模块，用于从远端存储器检索第一存储器页面，并将第一存储器页面写入近端存储器。 此外，钉扎逻辑还包括描述符表管理模块，用于将第一存储器页标记为固定在近存储器中，其中将第一存储器页标记为固定包括将对应于第一存储器页的锁存位设置在高速缓存描述符表中 并且当第一存储器页面被标记为被固定时，防止第一存储器页被从近存储器逐出。

公开(公告)号：US12229069B2

公开(公告)日：2025-02-18

申请号：US17083200

申请日：2020-10-28

Applicant: Intel Corporation

Inventor： Pratik Marolia ,  Andrew Herdrich ,  Rajesh Sankaran ,  Rahul Pal ,  David Puffer ,  Sayantan Sur ,  Ajaya Durg

IPC: G06F13/40 ,  G06F13/42

Abstract: Methods and apparatus for an accelerator controller hub (ACH). The ACH may be a stand-alone component or integrated on-die or on package in an accelerator such as a GPU. The ACH may include a host device link (HDL) interface, one or more Peripheral Component Interconnect Express (PCIe) interfaces, one or more high performance accelerator link (HPAL) interfaces, and a router, operatively coupled to each of the HDL interface, the one or more PCIe interfaces, and the one or more HPAL interfaces. The HDL interface is configured to be coupled to a host CPU via an HDL link and the one or more HPAL interfaces are configured to be coupled to one or more HPALs that are used to access high performance accelerator fabrics (HPAFs) such as NVlink fabrics and CCIX (Cache Coherent Interconnect for Accelerators) fabrics. Platforms including ACHs or accelerators with integrated ACHs support RDMA transfers using RDMA semantics to enable transfers between accelerator memory on initiators and targets without CPU involvement.

公开(公告)号：US20250004981A1

公开(公告)日：2025-01-02

申请号：US18793247

申请日：2024-08-02

Applicant: Intel Corporation

Inventor： Abhishek R. Appu ,  Altug Koker ,  Aravindh Anantaraman ,  Elmoustapha Ould-Ahmed-Vall ,  Valentin Andrei ,  Nicolas Galoppo Von Borries ,  Varghese George ,  Mike Macpherson ,  Subramaniam Maiyuran ,  Joydeep Ray ,  Lakshminarayana Striramassarma ,  Scott Janus ,  Brent Insko ,  Vasanth Ranganathan ,  Kamal Sinha ,  Arthur Hunter ,  Prasoonkumar Surti ,  David Puffer ,  James Valerio ,  Ankur N. Shah

IPC: G06F15/78 ,  G06F7/544 ,  G06F7/575 ,  G06F7/58 ,  G06F9/30 ,  G06F9/38 ,  G06F9/50 ,  G06F12/02 ,  G06F12/06 ,  G06F12/0802 ,  G06F12/0804 ,  G06F12/0811 ,  G06F12/0862 ,  G06F12/0866 ,  G06F12/0871 ,  G06F12/0875 ,  G06F12/0882 ,  G06F12/0891 ,  G06F12/0893 ,  G06F12/0895 ,  G06F12/0897 ,  G06F12/1009 ,  G06F12/128 ,  G06F15/80 ,  G06F17/16 ,  G06F17/18 ,  G06N3/08 ,  G06T1/20 ,  G06T1/60 ,  G06T15/06 ,  H03M7/46

Abstract: Methods and apparatus relating to techniques for multi-tile memory management. In an example, a graphics processor includes an interposer, a first chiplet coupled with the interposer, the first chiplet including a graphics processing resource and an interconnect network coupled with the graphics processing resource, cache circuitry coupled with the graphics processing resource via the interconnect network, and a second chiplet coupled with the first chiplet via the interposer, the second chiplet including a memory-side cache and a memory controller coupled with the memory-side cache. The memory controller is configured to enable access to a high-bandwidth memory (HBM) device, the memory-side cache is configured to cache data associated with a memory access performed via the memory controller, and the cache circuitry is logically positioned between the graphics processing resource and a chiplet interface.

公开(公告)号：US12182062B1

公开(公告)日：2024-12-31

申请号：US17961833

申请日：2022-10-07

Applicant: Intel Corporation

Inventor： Abhishek R. Appu ,  Altug Koker ,  Aravindh Anantaraman ,  Elmoustapha Ould-Ahmed-Vall ,  Valentin Andrei ,  Nicolas Galoppo Von Borries ,  Varghese George ,  Mike Macpherson ,  Subramaniam Maiyuran ,  Joydeep Ray ,  Lakshminarayanan Striramassarma ,  Scott Janus ,  Brent Insko ,  Vasanth Ranganathan ,  Kamal Sinha ,  Arthur Hunter ,  Prasoonkumar Surti ,  David Puffer ,  James Valerio ,  Ankur N. Shah

IPC: G06F15/78 ,  G06F7/544 ,  G06F7/575 ,  G06F7/58 ,  G06F9/30 ,  G06F9/38 ,  G06F9/50 ,  G06F12/02 ,  G06F12/06 ,  G06F12/0802 ,  G06F12/0804 ,  G06F12/0811 ,  G06F12/0862 ,  G06F12/0866 ,  G06F12/0871 ,  G06F12/0875 ,  G06F12/0882 ,  G06F12/0891 ,  G06F12/0893 ,  G06F12/0895 ,  G06F12/0897 ,  G06F12/1009 ,  G06F12/128 ,  G06F15/80 ,  G06F17/16 ,  G06F17/18 ,  G06T1/20 ,  G06T1/60 ,  H03M7/46 ,  G06N3/08 ,  G06T15/06

Abstract: Methods and apparatus relating to techniques for multi-tile memory management. In an example, a graphics processor includes an interposer, a first chiplet coupled with the interposer, the first chiplet including a graphics processing resource and an interconnect network coupled with the graphics processing resource, cache circuitry coupled with the graphics processing resource via the interconnect network, and a second chiplet coupled with the first chiplet via the interposer, the second chiplet including a memory-side cache and a memory controller coupled with the memory-side cache. The memory controller is configured to enable access to a high-bandwidth memory (HBM) device, the memory-side cache is configured to cache data associated with a memory access performed via the memory controller, and the cache circuitry is logically positioned between the graphics processing resource and a chiplet interface.