摘要:
A nonwoven fabric characterized in that the nonwoven fabric is a thermoplastic synthetic fiber nonwoven fabric having a fabric weight of 7 to 50 g/m2, an average yarn diameter of 7 to 40 μm, a partial heat contact bonding ratio of 5 to 30% and a content of a delustering agent of 0.5% by weight or less, or a nonwoven fabric laminate the major component of which is the thermoplastic synthetic fiber nonwoven fabric, and that the nonwoven fabric has a maximum opening diameter of 200 to 2,000 μm, and shows a transparency of 50% or more, a powder leakage ratio of 10% by weight or less and a hydrophilicity of less than 10 sec, and a tea bag in which the nonwoven fabric is used.
摘要翻译:一种无纺布,其特征在于,所述无纺布是织物重量为7〜50g / m 2的热塑性合成纤维无纺布,平均纱线直径为7〜40μm,部分热接触 粘合率为5〜30%,消光剂的含量为0.5重量%以下,或其主要成分为热塑性合成纤维无纺布的无纺布层叠体,无纺布的最大开口直径 为200〜2000μmol,透明度为50%以上,粉体泄漏率为10重量%以下,亲水性为10秒以下,茶袋为无纺布。
摘要:
Provided is metal-containing resin particle for forming a conductor pattern in which the metal particles are dispersed in a resin matrix, and the content of the metal particles is 70 wt % or less.
摘要:
There are provided a metal particulate spraying step to spray metal particulates over a substrate having an insulating pattern formed of thermosetting resin, a heating step to heat and dissolve the resin pattern and fix the metal particulates on the resin pattern, and a metal particulate eliminating step to eliminate metal particulates attached on the surface of the substrate excluding the resin pattern.
摘要:
A wiring board formed by an electrophotographic system of transferring a visible image to a substrate, the wiring board including: a substrate to which a visible image is transferred; a nonconductive metal-containing resin layer selectively formed on the substrate and containing metal particulates dispersed therein; a conductive conductor metal layer formed on the metal-containing resin layer; and a resin layer formed contiguously to the metal-containing resin layer on the substrate.
摘要:
According to one aspect of the invention, a contact sheet for testing electronic parts, comprising an insulating porous layer; and a connection electrode which is disposed on the insulating porous layer and electrically connect the electrode or terminal of the electronic parts and the terminal of a test apparatus; wherein the connection electrode is embedded below at least one main surface of the insulating porous layer.