公开(公告)号：US20060012039A1

公开(公告)日：2006-01-19

申请号：US11221453

申请日：2005-09-07

Applicant: Sarah Kim ,  Kevin Lee ,  Steven Towle ,  Anna George

Inventor： Sarah Kim ,  Kevin Lee ,  Steven Towle ,  Anna George

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L24/81 ,  H01L21/31051 ,  H01L21/76801 ,  H01L21/76829 ,  H01L21/76838 ,  H01L23/5283 ,  H01L23/5286 ,  H01L23/53238 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

Abstract: A process flow to make an interconnect structure with one or more thick metal layers under Controlled Collapse Chip Connection (C4) bumps at a die or wafer level. The interconnect structure may be used in a backend interconnect of a microprocessor. The process flow may include forming an inter-layer dielectric with spray coating or lamination over a surface with high aspect ratio structures.

Abstract translation: 在芯片或晶片级别的受控崩溃芯片连接（C4）凸起处形成具有一个或多个厚金属层的互连结构的工艺流程。 互连结构可以用在微处理器的后端互连中。 工艺流程可以包括在具有高纵横比结构的表面上形成具有喷涂或层压的层间电介质。

公开(公告)号：US20050256867A1

公开(公告)日：2005-11-17

申请号：US11082212

申请日：2005-03-15

Applicant: Eckart Walther ,  Qi Lu ,  David Ku ,  Kevin Lee ,  Chung-Man Tam ,  Ali Diab

Inventor： Eckart Walther ,  Qi Lu ,  David Ku ,  Kevin Lee ,  Chung-Man Tam ,  Ali Diab

IPC: G06F7/00 ,  G06F17/30

CPC classification number: G06F17/30867 ,  G06F17/30696 ,  G06F17/30864 ,  G06F17/30882 ,  G06F17/30935 ,  Y10S707/99942 ,  Y10S707/99943 ,  Y10S707/99944 ,  Y10S707/99945

Abstract: Computer systems and methods allow users to annotate content items found in a corpus such as the World Wide Web. Annotations, which can include any descriptive and/or evaluative metadata related to a document, are collected from a user and stored in association with that user. Users are able to annotate and view their annotations for any document they encounter while interacting with the corpus, including hits returned in a search of the corpus. Users are also able to search their annotations or to limit searches to documents they have annotated. Metadata from annotations can also be aggregated across users and aggregated metadata applied in generating search results.

Abstract translation: 计算机系统和方法允许用户注释在诸如万维网的语料库中发现的内容项。 可以包括与文档相关的任何描述性和/或评估性元数据的注释，从用户收集并与该用户相关联地存储。 用户可以在与语料库进行交互的同时，为他们遇到的任何文档注释并查看其注释，包括在语料库搜索中返回的命中。 用户还可以搜索其注释或将搜索限制为已注释的文档。 来自注释的元数据也可以跨用户聚合，并在生成搜索结果时应用汇总的元数据。

公开(公告)号：US20050161756A1

公开(公告)日：2005-07-28

申请号：US11050814

申请日：2005-01-27

Applicant: Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

Inventor： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

IPC: H01L21/00 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01L27/146 ,  H01L31/0203 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14683 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/16235 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract translation: 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。

公开(公告)号：USD481780S1

公开(公告)日：2003-11-04

申请号：US29161134

申请日：2002-05-21

Applicant: Kevin Lee ,  Justine Chen

Designer： Kevin Lee ,  Justine Chen

公开(公告)号：USD480169S1

公开(公告)日：2003-09-30

申请号：US29160804

申请日：2002-05-17

Applicant: Kevin Lee

Designer： Kevin Lee

公开(公告)号：USD474558S1

公开(公告)日：2003-05-13

申请号：US29158063

申请日：2002-03-29

Applicant: Kevin Lee

Designer： Kevin Lee

公开(公告)号：US06536933B1

公开(公告)日：2003-03-25

申请号：US09940830

申请日：2001-08-27

Applicant: Shawn R. Gettemy ,  Kevin Lee

Inventor： Shawn R. Gettemy ,  Kevin Lee

IPC: G02F11335

CPC classification number: G02B6/0065

Abstract: A flat panel display system utilizing a light pipe having vapor deposited highly reflective material on a light pipe. The flat panel display may be used in a portable electronic device. One embodiment discloses deposition of a highly reflective material (e.g., SiO2 or TiO2) around the non-viewing areas of a light pipe that provides light to the display screen. Front lighting embodiments and back lighting embodiments are described. One embodiment further discloses deposition of reflective material on the surface of microstructures of the light pipe to enhance light reflection and to prevent light escape. Another embodiment of the present invention discloses the coating or vapor deposition of phosphor material on the light pipe. This embodiment utilizes a blue light or IR light with the phosphor layer, to create a long lasting white light which is appealing for many portable electronic device displays.

Abstract translation: 一种利用在光管上具有气相沉积的高反射材料的光管的平板显示系统。 平板显示器可以用在便携式电子设备中。 一个实施例公开了将高反射材料（例如，SiO 2或TiO 2）沉积在向显示屏提供光的光管的非观察区域周围。 描述前照明实施例和背光照明实施例。 一个实施例进一步公开了在光管的微结构的表面上沉积反射材料以增强光反射并防止光逸出。 本发明的另一实施例公开了在光管上涂覆或蒸镀磷光体材料。 该实施例利用蓝色光或IR光与荧光体层，以产生持久的白光，其吸引许多便携式电子设备显示器。

公开(公告)号：US6051098A

公开(公告)日：2000-04-18

申请号：US916923

申请日：1997-08-22

Applicant: Kevin Lee

Inventor： Kevin Lee

IPC: B23K26/08 ,  B23K26/14 ,  C23F1/02

CPC classification number: B23K26/0838 ,  B23K26/142 ,  B23K26/1462 ,  H01H2009/187

Abstract: A keyboard etching apparatus includes a base on which a frame is fixed to support a laser beam source and a keyboard tray thereon to be spaced from each other in such a manner to allow a laser beam emitted from the laser beam source to project onto a keyboard removably supported on the keyboard tray for performing etching operation on the keyboard. A keyboard supply cart having a plurality of non-etched keyboards held therein and a keyboard collecting cart for collecting etched keyboards are respectively arranged on two opposite sides of the frame and movable along rails fixed on the base. A conveyor system is arranged between the keyboard supply cart and the keyboard collecting cart for sequentially moving each of the non-etched keyboards received in the keyboard supply cart to the keyboard tray to be etched by the laser beam and to simultaneously move the etched keyboard from the keyboard tray to the keyboard collecting cart to be collected therein.

Abstract translation: 键盘蚀刻装置包括：基座，其上固定框架以支撑激光束源和键盘托盘，以便彼此间隔开，从而允许从激光束源发射的激光束投射到键盘上 可拆卸地支撑在键盘盘上，用于在键盘上进行蚀刻操作。 键盘供给车具有多个未被蚀刻的键盘和一个用于收集蚀刻键盘的键盘收集车，分别设置在框架的两个相对的两侧，并可沿着固定在基座上的导轨移动。 输送机系统布置在键盘供应车和键盘收集车之间，用于将接收在键盘供应车中的每个未蚀刻的键盘顺序地移动到要由激光束蚀刻的键盘托盘，并同时将蚀刻的键盘从 键盘托盘到键盘收集车收集在其中。

公开(公告)号：USD1054892S1

公开(公告)日：2024-12-24

申请号：US29808748

申请日：2021-09-22

Applicant: Kevin Lee

Designer： Kevin Lee

公开(公告)号：US10524519B2

公开(公告)日：2020-01-07

申请号：US15675375

申请日：2017-08-11

Applicant: Beverly Ann Deal ,  Rebecca Harmon ,  Chih Jung Lee ,  Judy Lee ,  Kevin Lee

Inventor： Beverly Ann Deal ,  Rebecca Harmon ,  Chih Jung Lee ,  Judy Lee ,  Kevin Lee

IPC: A41C3/00 ,  A41C3/06 ,  A41C3/12

Abstract: An adhesive bra comprised of left and right breast support members where each support member includes a cup portion and a vertically extending strap. The rear facing surface of the cup and strap carry reusable pressure sensitive adhesive for adhering to a wearer's skin.