摘要:
A solid-state image pickup device comprising a semiconductor substrate which comprises a substrate body containing P-type impurities and a first N-type semiconductor layer containing N-type impurities, the first N-type semiconductor layer being provided on the substrate body, and including a first P-type semiconductor layer which contains p-type impurities, and which is located on the substrate body, a plurality of optical/electrical conversion portions formed of second N-type semiconductor layers which are provided independently of each other in respective positions in a surface portion of the first N-type semiconductor layer, and a plurality of second P-type semiconductor layers which are formed to surround the optical/electrical conversion portions, which are provided along element isolation regions provided in respective positions in the surface portion of the first N-type semiconductor layer, and which continuously extend from the surface portion of the first N-type semiconductor layer to a surface portion of the first P-type semiconductor layer.
摘要:
It is an object to prevent distortions and deviations of images caused by the eccentricity of a driven gear mounted to a rotational shaft of a photosensitive drum. There are provided a driving gear which is secured to a rotational shaft of a rotational driving power source and is rotated at a constant peripheral speed, a driven gear secured coaxially to a rotational shaft of a cylindrical-shaped photosensitive member, a phase control gear having the same diameter as that of the driven gear and having the same rotational speed variation characteristic as that of the driven gear, and a transmission gear, and a driving force from the driving gear is transmitted to the driven gear through the phase control gear and the transmission gear.
摘要:
According to an aspect of the invention, there is provided an amplification-type solid-state image sensing device which uses a semiconductor substrate formed by epitaxially depositing an n-type semiconductor layer on a p-type semiconductor substrate and has a photoelectric conversion unit formed in the n-type semiconductor layer including a first p-type semiconductor layer which is formed under the photoelectric conversion unit of at least one of a G pixel portion and a B pixel portion a second p-type semiconductor layer which is formed to surround the photoelectric conversion unit together with the first p-type semiconductor layer and has a depth up to the first p-type semiconductor layer and a third p-type semiconductor layer which is formed to surround an R pixel portion and has a depth up to the p-type semiconductor substrate.
摘要:
An image forming apparatus including: image forming sections, each image forming section forming an image of a color component among plural color components under a predetermined condition, and forming a pattern of each color component for adjusting the condition; a detecting section that reads the formed patterns so as to perform a temporary detection and a main detection of a deviation from a reference under the condition; and a correction control section that determines whether the deviation of the temporary detection exceeds a predetermined threshold value or not, and when the deviation exceeds the threshold value, executes the main detection to fully detect the deviation so as to correct the condition, wherein the correction control section controls to form the pattern for the temporary detection, the number of the color components for the temporary detection being fewer than those of the patterns to be used for the main detection.
摘要:
A hydraulic control apparatus, provided with a manual shift valve that outputs a forward range pressure and a reverse range pressure, and a linear solenoid valve that outputs an engagement pressure to the hydraulic servo that engages during reverse travel when energized, includes a fourth clutch relay valve that is interposed between the linear solenoid valve and the hydraulic servo. The fourth clutch relay valve communicates an engagement pressure of the linear solenoid valve to the hydraulic servo by locking in the normal position when a signal pressure of the solenoid valve is input, and communicates a reverse range pressure to the hydraulic servo by being switched to a fail position by the reverse range pressure during a failure in which the fourth clutch relay valve is de-energized. Thereby, it is possible to establish a reverse speed during a failure in which the solenoid valve is de-energized.
摘要:
A solid-state image sensing device including an image sensing region in which a matrix of unit pixels, each including a photodiode in a surface portion of a semiconductor substrate, is provided; a read transistor connected between a respective photodiode and a detection node; an amplifying transistor connected to the detection node so as to amplify the signal charge output to the detection node and to output a pixel signal to a signal output line reading out the pixel signal output; a reset transistor connected to the detection node and to a discharge node; and an address transistor connected to a source of the amplifying transistor for selecting an address of the photodiode when an address signal is supplied to a gate.
摘要:
A solid-state image pickup device comprising a semiconductor substrate which comprises a substrate body containing P-type impurities and a first N-type semiconductor layer containing N-type impurities, the first N-type semiconductor layer being provided on the substrate body, and including a first P-type semiconductor layer which contains p-type impurities, and which is located on the substrate body, a plurality of optical/electrical conversion portions formed of second N-type semiconductor layers which are provided independently of each other in respective positions in a surface portion of the first N-type semiconductor layer, and a plurality of second P-type semiconductor layers which are formed to surround the optical/electrical conversion portions, which are provided along element isolation regions provided in respective positions in the surface portion of the first N-type semiconductor layer, and which continuously extend from the surface portion of the first N-type semiconductor layer to a surface portion of the first P-type semiconductor layer.
摘要:
A solid state imaging device includes a substrate of a first conductivity type. A transistor, which includes a first gate electrode and a first and second impurity areas, is provided on a surface of the substrate. The first and second impurity areas are formed in the surface of the substrate and sandwich a region under the first gate electrode. A third impurity area of a second conductivity type is formed in the surface of the substrate and spaced from the second impurity area at an opposite side to the first gate electrode. A fourth impurity area is formed under the second impurity area and connected to the third impurity area. A second gate electrode is provided above the substrate. A fifth impurity area of the second conductivity type is formed in the surface of the substrate. The third and fifth impurity areas sandwich a region under the second gate electrode.
摘要:
A solid-state image sensor comprises a photodiode which is provided in a p-type substrate or a p-type well and composed of a first n-type region for storing photoelectrically converted signal charges, a gate electrode provided above the substrate or well so as to be adjacent to one end of the photodiode, and a n-type drain provided at the surface of the substrate or well opposite to the photodiode, with the gate electrode interviewing therebetween. There is provided a second n-type region which is formed so as to be in contact with the upper part of the first n-type region on the gate electrode side and one end of which is formed to self-align with one end of the gate electrode to be part of the photodiode. This construction prevents the short-channel effect of the signal read transistor section and reduces or eradicates the left-over signal charges stored in the photodiode, thereby reducing noise and improving the sensitivity of the sensor.
摘要:
In an amplifier-type solid-state image sensor device, each unit cell comprises a photoconverter and a signal scanning circuit in an image sensing region on a semiconductor substrate, a metal film has an opening region for defining regions where light is radiated in the photoconverters of the unit cells, and a center position of the opening region of the metal film is displaced to the side of the center of the image sensing region with respect to a center portion of the photoconverter, so that the amount of light entering the center of the semiconductor chip and the peripheral portions of the semiconductor chip can be made equal, thereby obtaining substantially the same sensitivity at the center and peripheral portions of the semiconductor chip.