公开(公告)号：US20100020389A1

公开(公告)日：2010-01-28

申请号：US12179192

申请日：2008-07-24

申请人： Roger Schmidt ,  Michael Stuart

发明人： Roger Schmidt ,  Michael Stuart

IPC分类号： G02B7/24 ,  G02B7/22

CPC分类号： G02B7/22 ,  G02B7/24

摘要： An articulating infrared window to be installed into a panel of a cabinet is disclosed. The window includes a window housing and an infrared transparent pane. The infrared transparent pane is installed within the window housing. Embodiments of the window housing can include various articulation mechanisms including individually or in combination a double gimbal assembly, a single gimbal and rotary stage, a ball and socket joint, and an extension joint (such as a bellows) for articulating the infrared transparent pane.

摘要翻译： 公开了一种安装在机柜面板上的铰接式红外线窗。 窗户包括一个窗户外壳和红外透明窗格。 红外透明窗格安装在窗户外壳内。 窗户壳体的实施例可以包括各种铰接机构，其包括单个或组合的双重万向架组件，单个万向节和旋转台，球窝接头以及用于铰接红外线透明板的延伸接头（例如波纹管）。

公开(公告)号：US07584622B2

公开(公告)日：2009-09-08

申请号：US11162174

申请日：2005-08-31

申请人： Gamal Refai-Ahmed ,  Roger Schmidt

发明人： Gamal Refai-Ahmed ,  Roger Schmidt

IPC分类号： F25B21/02

CPC分类号： F25B21/02 ,  F28D15/0266 ,  F28D15/04 ,  F28F3/12 ,  H01L23/427 ,  H01L2224/16 ,  H01L2224/73253

摘要： A localized refrigerator apparatus for a thermal management device includes a chamber having an evaporation portion and a condensation portion. The evaporation portion is adapted to thermally couple to a heat generating device. A fluid housed in the chamber and is adapted to facilitate heat transfer between the evaporation portion and the condensation portion by an evaporation and condensation cycle. The thermal management device also includes a thermoelectric cooler thermally coupled to the condensation portion.

摘要翻译： 一种用于热管理装置的本地化冰箱装置包括具有蒸发部分和冷凝部分的室。 蒸发部适于热耦合到发热装置。 容纳在腔室中并且适于通过蒸发和冷凝循环来促进蒸发部分和冷凝部分之间的热传递的流体。 热管理装置还包括热耦合到冷凝部分的热电冷却器。

公开(公告)号：US20070121299A1

公开(公告)日：2007-05-31

申请号：US11290756

申请日：2005-11-30

申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  H01L23/473 ,  H01L23/4735 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/00

摘要： A heat transfer apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The heat transfer apparatus includes a thermally conductive base having a main surface, and a plurality of thermally conductive fins extending from the main surface. The thermally conductive fins are disposed to facilitate transfer of heat from the thermally conductive base, which can be a portion of the electronic device or a separate structure coupled to the electronic device. At least some conductive fins are composite structures, each including a first material coated with a second material, wherein the first material has a first thermal conductivity and the second material a second thermal conductivity. In one implementation, the thermally conductive fins are wire-bonded pin-fins, each being a discrete, looped pin-fin separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.

摘要翻译： 提供了一种传热装置和制造方法，用于便于从发热电子装置中除去热量。 传热装置包括具有主表面的导热基底和从主表面延伸的多个导热翅片。 导热翅片设置成有助于传导热量，该热传导基底可以是电子设备的一部分或耦合到电子设备的单独结构。 至少一些导电翅片是复合结构，每个包括涂覆有第二材料的第一材料，其中第一材料具有第一导热性，第二材料具有第二导热性。 在一个实施方案中，导热翅片是引线接合的销翅片，每个是分开的环形销翅片，其分开地引线键合到主表面上，并且间隔小于300微米。

公开(公告)号：US20060126308A1

公开(公告)日：2006-06-15

申请号：US11009935

申请日：2004-12-10

申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons ,  Prabjit Singh

发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons ,  Prabjit Singh

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  F28F3/022 ,  H01L23/433 ,  H01L23/473 ,  H01L2224/78301 ,  H01L2924/10253 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base and disposed to facilitate the transfer of heat from the thermally conductive base. The thermally conductive base can be a portion of the electronic device to be cooled or a separate structure coupled to the electronic device to be cooled. If a separate structure, the thermally conductive base has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of the electronic device. In one implementation, the wire-bonded pin fins are discrete, looped pin fins separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.

摘要翻译： 提供冷却装置和制造方法以便于从发热电子装置中除去热量。 冷却装置包括具有基本上平面的主表面的导热基体和与导热基体的主表面引线接合并设置成有助于从导热基底转移热量的多个导热销散热片。 导热基座可以是要冷却的电子设备的一部分或者耦合到要冷却的电子设备的单独的结构。 如果是单独的结构，导热基座的热膨胀系数在电子设备的热膨胀系数的规定范围内。 在一个实施方式中，引线接合销散热片是离散的环形销散热片，其分开地引线键合到主表面，并且间隔小于300微米。

公开(公告)号：US20060126293A1

公开(公告)日：2006-06-15

申请号：US11008732

申请日：2004-12-09

申请人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

发明人： Levi Campbell ,  Richard Chu ,  Michael Ellsworth ,  Madhusudan Iyengar ,  Roger Schmidt ,  Robert Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/2079

摘要： A coolant flow drive apparatus is provided for facilitating removal of heat from a cooling structure coupled to a heat generating electronics component. The coolant flow drive apparatus includes a turbine in fluid communication with a primary coolant flowing within a primary coolant flow loop, and a pump in fluid communication with a secondary coolant within a secondary coolant flow path. The secondary fluid flow path is separate from the primary coolant flow path. The flow drive apparatus further includes a magnetic coupling between the turbine and the pump, wherein the turbine drives the pump through the magnetic coupling to pump secondary coolant through the secondary coolant flow path.

摘要翻译： 提供冷却剂流动驱动装置，用于便于从耦合到发热电子部件的冷却结构移除热量。 冷却剂流动驱动装置包括与在主冷却剂流动回路内流动的主要冷却剂流体连通的涡轮机，以及与次级冷却剂流动路径内的二级冷却剂流体连通的泵。 次级流体流动路径与主冷却剂流动路径分离。 流动驱动装置还包括在涡轮机和泵之间的磁耦合，其中涡轮机通过磁耦合驱动泵以将二级冷却剂泵送通过次级冷却剂流动路径。

公开(公告)号：US20060002087A1

公开(公告)日：2006-01-05

申请号：US10883534

申请日：2004-07-01

申请人： Raschid Bezama ,  Evan Colgan ,  John Magerlein ,  Roger Schmidt

发明人： Raschid Bezama ,  Evan Colgan ,  John Magerlein ,  Roger Schmidt

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  F28F3/12 ,  F28F9/028 ,  F28F13/06 ,  F28F2260/02 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices. Apparatus for microchannel cooling include integrated microchannel heat sink devices and fluid distribution manifold structures that are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths.

摘要翻译： 提供了用于诸如IC芯片的电子器件的微通道冷却的装置和方法，其能够实现高功率密度电子器件的高效和低工作压力的微通道冷却。 用于微通道冷却的装置包括集成微通道散热装置和流体分配歧管结构，其被设计成提供冷却剂流体的均匀流动和分布并使沿着冷却剂流动路径的压降最小化。

公开(公告)号：US20050280140A1

公开(公告)日：2005-12-22

申请号：US10869524

申请日：2004-06-16

申请人： John Corbin ,  Gary Goth ,  Dales Kent ,  William Kostenko ,  Roger Schmidt ,  John Torok

发明人： John Corbin ,  Gary Goth ,  Dales Kent ,  William Kostenko ,  Roger Schmidt ,  John Torok

IPC分类号： H01L21/44 ,  H01L23/34 ,  H01L23/367 ,  H01L23/433

CPC分类号： H01L23/367 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

摘要： In an integrated circuit packaging structure, such as in a SCM, DCM, or MCM, a method and apparatus for increasing heat spreader size and thus thermal performance is disclosed. The packaging structure includes a first substrate; an electronic device operably coupled to a top surface defining the first substrate; a heat spreader having a first surface operably coupled to a top surface defining the electronic device and an opposite second surface in thermal communication with a second substrate; and a frame defining an opening therethrough. The frame is further defined by an inwardly extending ledge configured to allow the heat spreader to extend at least to a peripheral edge defining a perimeter of the first substrate. In an exemplary embodiment, the second substrate includes one of a heat sink, cooling plate, thermal spreader, heat pipe, thermal hat, package lid, or other cooling member.

摘要翻译： 在诸如在SCM，DCM或MCM中的集成电路封装结构中，公开了一种用于增加散热器尺寸并因此提高散热性能的方法和装置。 包装结构包括第一基板; 电子设备，其可操作地耦合到限定所述第一基板的顶表面; 散热器具有可操作地耦合到限定电子设备的顶表面的第一表面和与第二基板热连通的相对的第二表面; 以及限定穿过其中的开口的框架。 框架进一步由向内延伸的凸缘限定，该凸缘构造成允许散热器至少延伸至限定第一基板的周边的周边边缘。 在示例性实施例中，第二基板包括散热器，冷却板，散热器，热管，散热帽，封装盖或其它冷却构件中的一个。

公开(公告)号：US20050248922A1

公开(公告)日：2005-11-10

申请号：US10841748

申请日：2004-05-07

申请人： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

发明人： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20727 ,  H05K7/20809

摘要： A cooling apparatus for electronic drawers utilizing a passive fluid cooling loop in conjunction with an air cooled drawer cover. The air cooled cover provides an increased surface area from which to transfer heat to cooling air flowing through the drawer. The increased cooling surface uses available space within the drawer, which may be other than immediately adjacent to a high power device within the drawer. The passive fluid cooling loop provides heat transfer from the high power device to the air cooled cover assembly, allowing placement of the air cooled cover assembly other than immediately adjacent to the high power device. The cooling apparatus is easily disengaged from the electronics drawer, providing access to devices within the drawer.

摘要翻译： 一种用于电子抽屉的冷却装置，其利用被动流体冷却回路与空气冷却的抽屉盖结合。 空气冷却盖提供了增加的表面积，从而将热量传递到流过抽屉的冷却空气。 增加的冷却表面使用抽屉内的可用空间，其可以不是紧邻抽屉内的大功率设备。 被动流体冷却回路提供从高功率设备到空气冷却盖组件的热传递，允许空气冷却盖组件的布置而不是紧邻大功率设备。 冷却装置容易从电子抽屉中脱离，提供对抽屉内的装置的通路。

公开(公告)号：US20050217299A1

公开(公告)日：2005-10-06

申请号：US10812732

申请日：2004-03-30

申请人： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

发明人： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

IPC分类号： F24F13/22 ,  F25D21/00 ,  F25D21/14 ,  F25D23/12 ,  F25J3/00 ,  H05K5/02 ,  H05K7/20

CPC分类号： H05K7/20609 ,  F24F13/222 ,  H05K5/0213 ,  H05K7/20736

摘要： System and method are provided for removing condensate from an air-to-liquid heat exchanger of a combined air/liquid enclosed apparatus for cooling rack-mounted electronic equipment. The condensate removal system includes a condensate collector for collecting liquid condensate from the air-to-liquid heat exchanger, and a vaporizing chamber in fluid communication with the condensate collector for receiving collected liquid therefrom. An actively controlled vaporizer vaporizes collected liquid within the vaporizing chamber and a vapor exhaust is in communication with the vaporizing chamber for venting vapor from the vaporizing chamber outside the cabinet containing the combined air/liquid cooling apparatus and rack-mounted electronic equipment.

摘要翻译： 提供了系统和方法，用于从用于冷却机架安装的电子设备的组合的空气/液体封闭装置的空气 - 液体热交换器中去除冷凝物。 冷凝水去除系统包括用于从空气 - 液体热交换器收集液体冷凝物的冷凝收集器，以及与冷凝水收集器流体连通的蒸发室，用于从其收集收集的液体。 主动控制的蒸发器蒸发蒸发室内的收集液体，并且蒸汽排气与蒸发室连通，用于从包含组合的空气/液体冷却装置和机架安装的电子设备的机柜外部的蒸发室排出蒸气。

公开(公告)号：US20050128705A1

公开(公告)日：2005-06-16

申请号：US10736949

申请日：2003-12-16

申请人： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

发明人： Richard Chu ,  Michael Ellsworth ,  Roger Schmidt ,  Robert Simons

IPC分类号： H01L23/473 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L2224/16 ,  H01L2224/73253

摘要： A cooling fluid distribution assembly for a plurality of electronic modules, using a composite cold plate structure. One cold plate is associated with each electronic module requiring liquid cooling. Each cold plate includes a high thermal conductivity base sealably fastened to a cover, the cover having at least one fluid inlet and at least one fluid outlet. Cover fluid inlets and outlets are connected via a plurality of flexible, nonmetallic conduits, the conduits being bonded to the cover inlets and outlets. Each cold plate cover is formed of a material that is capable of being bonded to the flexible, nonmetallic conduits, covers are therefore formed of a different material than the material comprising the cold plate base. Cold plate structures preferably include internal fluid distribution structures. The resulting cooling fluid distribution assembly provides reliable fluid connections and is sufficiently flexible to adjust for variances in module height etc.

摘要翻译： 一种用于多个电子模块的冷却流体分配组件，其使用复合冷板结构。 一个冷板与需要液体冷却的每个电子模块相关联。 每个冷板包括可密封地紧固到盖的高导热性基座，所述盖具有至少一个流体入口和至少一个流体出口。 覆盖流体入口和出口通过多个柔性非金属导管连接，导管结合到盖入口和出口。 每个冷板盖由能够结合到柔性非金属导管的材料形成，因此盖子由与冷板底座的材料不同的材料形成。 冷板结构优选地包括内部流体分配结构。 所得到的冷却流体分配组件提供可靠的流体连接，并且具有足够的灵活性以适应模块高度等的变化。