摘要:
An EEPROM includes a device isolation layer for defining a plurality of active regions, a pair of control gates extending across the active regions and a pair of selection gates patterns that extend across the active regions and are interposed between the control gate patterns. A floating gate pattern is formed on intersection regions where the control gate patterns extend across the active regions. A lower gate pattern is formed on intersection regions where the selection gate patterns extend across the active regions. An inter-gate dielectric pattern is disposed between the control gate pattern and the floating gate pattern and a dummy dielectric pattern is disposed between the selection gate pattern and the lower gate pattern. The dummy dielectric pattern is substantially parallel to the selection gate pattern, and self-aligned with one sidewall of the selection gate pattern to overlap a predetermine width of the selection gate pattern.
摘要:
A semiconductor device includes a substrate of a first conductive type, and a well region of an opposite second conductive type is formed in the substrate. A first impurity region of the first conductive type extends to a first depth within the well region, and a second impurity region of the first conductive type is spaced from the first impurity region to define a channel region therebetween and extends to a second depth within the well region. Preferably, the second depth is greater than the first depth. A gate electrode is located over the channel region, and a silicide layer is formed at a third depth within the first impurity region. The third depth is less than the first depth, and a difference between the first depth and the third depth is less than or equal to a difference at which a leakage current from the silicide layer to the well region is sufficient to electrically bias the well region through the silicide layer.
摘要:
A semiconductor memory device comprises a semiconductor substrate having a memory cell region and a periphery circuit region. The memory cell region includes first and second conductivity type wells and an array of memory cell formed on the first and second conductivity type wells. The periphery circuit region comprises a guard ring that is formed at a location next to a second conductivity type well and to surround a side portion of the array of memory cells. The guard ring is formed with a depth different from that of the second conductivity type well.
摘要:
A hybrid schottky injection field effect transistor is provided. A first diffusion region of a second conductivity type and a second diffusion region of a first conductivity type are separately formed at a main surface of a silicon layer. A third diffusion region of a first conductivity type is formed within the first diffusion region. An insulating layer covers part of the second diffusion region and the third diffusion region. A gate electrode is formed on the insulating layer and is situated over the first and third diffusion regions and the silicon layer. A cathode electrode is commonly connected to the third diffusion region and the first diffusion region. An anode electrode comprises a trench filled with electrode material and is formed in the silicon layer along side of the second diffusion area and a gate insulating layer.
摘要:
The present invention relates to an inkjet composition for forming transparent films, which is highly economical and environmentally friendly and has excellent physical properties, including excellent transmittance, chemical resistance, heat resistance, adhesion, jetting stability and storage stability.
摘要:
The present invention relates to an infrared curable ink composition for a color filter. The ink composition according to the present invention includes a melamine compound and an epoxy compound, and thus can be cured for a short time, thereby being used in the infrared curing process, and reducing the production process and time required for the color filter production. In addition, the color filter produced by the ink composition according to the present invention has excellent chemical resistance and heat resistance, thereby being applied to various electronic devices such as liquid crystal display device.
摘要:
A stack-type semiconductor device and a method of manufacturing the same are provided. The stack-type semiconductor device includes an insulation layer on a single-crystalline substrate, a contact plug penetrating the insulation layer to contact the single-crystalline substrate, an upper semiconductor pattern including an impurity region and a gate structure positioned between the impurity regions on the upper semiconductor pattern. An upper surface of the contact plug contacts a lower surface of the semiconductor pattern. An operation failure of the stack-type semiconductor device is reduced since the upper semiconductor pattern is electrically connected to the single-crystalline semiconductor substrate.
摘要:
Provided is an ink composition for manufacturing color filters. The ink composition includes an acrylic binder resin obtained by polymerizing the group of monomers containing a compound represented by Formula 1. The ink composition has good chemical resistance and adhesive properties and is used for manufacturing color filters exhibiting a high contrast ratio: (where Ra is —H, or —CH3, and Rb is an alkyl group having 6-30 carbon atoms).
摘要:
A driving method of a three-dimensional memory device having a plurality of layers is provided. One of the layers is selected. A well of the selected layer is biased with a first well voltage. A word line voltage is applied to a selected word line of the selected layer. A well of an unselected layer is biased with a second well voltage higher than the first well voltage.
摘要:
The present invention relates to a hot dip galvanized steel sheet and a manufacturing method thereof. The hot dip galvanize steel sheet includes a steel sheet including a martensitic structure as a matrix, and a hot dip galvanized layer formed on the steel sheet. The steel sheet includes C of 0.05 wt % to 0.30 wt %, Mn of 0.5 wt % to 3.5 wt %, Si of 0.1 wt % to 0.8 wt %, Al of 0.01 wt % to 1.5 wt %, Cr of 0.01 wt % to 1.5 wt %, Mo of 0.01 wt % to 1.5 wt %, Ti of 0.001 wt % to 0.10 wt %, N of 5 ppm to 120 ppm, B of 3 ppm to 80 ppm, an impurity, and the remainder of Fe.