摘要:
A method of inspecting detects includes assigning a plurality of sets of image acquisition conditions, executing inspection using each of the sets of conditions, classifying all detected defects into real defects and false defects by use of an automatic defect classification function, and selecting, from the plurality of sets of conditions, a set of conditions ideal for detection.
摘要:
An apparatus and/or a method for inspecting fine defects on a substrate having minute patterns formed thereon as a target of inspection by detecting an image thereof with fine pixel size, wherein high speed processing is needed for position alignment over a wide region which is expanded equivalently therewith while obtaining a video processing circuit having a small size, wherein a video signal equal to or less than 0.2 &mgr;m in pixel size is obtained by using an optical system of DUV (far-ultraviolet) light or a video detection system of an electron beam. For instance, a search region for detecting position gaps is set at ±4 pixels, while on one substrate are mounted a plurality of video processing circuits, each being constructed with an LSI which can perform processing of k channels, thereby realizing a high-speed video processing portion having a small size.
摘要:
The present invention is related to an inspection data processing method for processing inspection data composed of coordinates data and characteristic quantity data about a defect generated on a subject of inspection detected with a visual inspection apparatus. The inspection data processing method comprises the following steps: a preparation step of storing a first fatality judgment data group corresponding to the kinds of areas on the subject of inspection and a second fatality judgment data group corresponding to categories of defects beforehand; a first fatality judgment step of judging a first fatality level of a defect corresponding to the kind of an area where the defect exists; a category giving step of giving category to the defect in the inspection data; and a second fatality judgment step of judging a second fatality of the defect based on second fatality judgment data selected according to the category which are given based on the first fatality level of defects judged in the first fatality judgment step.
摘要:
The invention provides a defect inspection method and a defect inspection device which enable a defect to be inspected regardless of optical conditions. The invention comprises the steps of setting a target local region and a plurality of corresponding local regions in the image signals, the target local region including a target pixel and an area surrounding the target pixel, the corresponding local regions including pixels corresponding to the target pixel and areas surrounding the corresponding pixels; searching similarities between the image signal of the target local region and the image signals of the plurality of corresponding local regions; determining a plurality of image signals that represent corresponding local regions and are similar to the image signal of the target local region; and comparing the image signal of the target local region with the image signals that represent the corresponding local regions.
摘要:
A defect inspection method for inspecting a defect(s) on an object to be inspected, within a step for determining parameter includes: a step for extracting a defect candidate on the object to be inspected with using said discriminant function with determining an arbitrary parameter; and a step for automatically renewing the parameter of said discriminant function, upon basis of teaching of defect information relating to the defect candidate, which is extracted in the step for extracting the defect candidate.
摘要:
According to the present invention, for a pattern inspection apparatus that compares images in corresponding areas of two patterns that are identical and that determines an unmatched portion between the images is a defect, a plurality of detection systems and a plurality of corresponding image comparison methods are provided. With this configuration, the affect of uneven brightnesses for a pattern that occurs due to differences in film thicknesses can be reduced, a highly sensitive pattern inspection can be performed, a variety of defects can be revealed, and the pattern inspection apparatus can be applied for processing performed within a wide range. Furthermore, the pattern inspection apparatus also includes a unit for converting the tone of image signals of comparison images for a plurality of different processing units, and when a difference in brightness occurs in the same pattern of the images, a defect can be correctly detected.
摘要:
In a pattern inspection apparatus for comparing images of areas corresponding to patterns each formed so as to be the same pattern and determining a non-coincident portion of the image as a defect, an image comparison processing unit configured with a processing system mounting a plurality of CPUs operating in parallel is provided, whereby an effect of brightness irregularity between the comparison images generated from a difference of a film thickness, a difference of a pattern thickness, and the like can be reduced, and a highly sensitive pattern inspection can be performed without setting parameters. Further, a feature amount of each pixel is calculated between the comparison images, and a plurality of feature amounts are compared, so that distinction between a defect and a noise, which is impossible by a luminance value, can be performed with high accuracy.
摘要:
A fault inspection method and apparatus in which the scattergram is separated or objects of comparison are combined in such a manner as to reduce the difference between an inspection object image and a reference image. As a result, the difference between images caused by the thickness difference in the wafer can be tolerated and the false information generation prevented without adversely affecting the sensitivity.
摘要:
In a pattern inspection apparatus, influences of pattern brightness variations that is caused in association with, for example, a film thickness difference or a pattern width variation can be reduced, high sensitive pattern inspection can be implemented, and a variety of defects can be detected. Thereby, the pattern inspection apparatus adaptable to a broad range of processing steps is realized. In order to realize this, the pattern inspection apparatus of the present invention performs comparison between images of regions corresponding to patterns formed to be same patterns, thereby determining mismatch portions across the images to be defects. The apparatus includes multiple sensors capable of synchronously acquiring images of shiftable multiple detection systems different from one another, and an image comparator section corresponding thereto. In addition, the apparatus includes means of detecting a statistical offset value from the feature amount to be a defect, thereby enabling the defect to be properly detected even when a brightness difference is occurring in association with film a thickness difference in a wafer.
摘要:
A pattern inspection apparatus is provided to compare images of regions, corresponding to each other, of patterns that are formed so as to be identical and judge that non-coincident portions in the images are defects. The pattern inspection apparatus is equipped with an image comparing section which plots individual pixels of an inspection subject image in a feature space and detects excessively deviated points in the feature space as defects. Defects can be detected correctly even when the same patterns in images have a brightness difference due to a difference in the thickness of a film formed on a wafer.