公开(公告)号：US20170125467A1

公开(公告)日：2017-05-04

申请号：US14930912

申请日：2015-11-03

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chun-Sheng Fan

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/11 ,  H01L2924/16235

Abstract: A chip-scale image sensor packaging method with black masking includes (a) cutting a composite wafer having a plurality of image sensors bonded to a common glass substrate to form slots in the common glass substrate, wherein the slots define a cover glass for each of the image sensors, respectively, (b) forming black mask in the slots such that the black mask, for each of the image sensors, spans perimeter of the cover glass as viewed cross-sectionally along optical axis of the image sensors, and (c) dicing through the black mask in the slots to singulate a plurality of chip-scale packaged image sensors each including one of the image sensors and the cover glass bonded thereto, with sides of the cover glass facing away from the optical axis being at least partly covered by the black mask.

公开(公告)号：US09459500B2

公开(公告)日：2016-10-04

申请号：US14616900

申请日：2015-02-09

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chun-Sheng Fan

IPC: G02F1/1343 ,  G02F1/1345 ,  G02F1/1337 ,  G02F1/1333

CPC classification number: G02F1/1345 ,  G02F1/133723 ,  G02F1/13439 ,  G02F1/13452 ,  G02F1/13458 ,  G02F1/136277 ,  G02F2001/133302

Abstract: A liquid crystal on silicon (LCOS) panel is provided that includes an electrical contact layer deposited in a pattern on a portion of a transparent conductive layer. An alignment layer protects the conductive layer and electrical contact layer during LCOS panel assembly. The alignment layer is etched away to expose the electrical contact, which protects the underlying conductive layer from the etching process. The resulting LCOS panel has more reliably formed electrical contacts for improved stability of electrical connections to the conductive layer. A method for forming an electrical contact layer on a conductive layer of a LCOS panel includes steps for depositing a patterned layer on a portion of the conductive layer. The method is compatible with microfabrication techniques for scalable manufacturing. The resulting LCOS panel includes a pattern of one or more electrical contacts exposed on a portion of the conductive layer.

Abstract translation: 提供了一种硅（LCOS）面板，其包括在透明导电层的一部分上以图案沉积的电接触层。 在LCOS面板组装期间，取向层保护导电层和电接触层。 蚀刻掉取向层以暴露电接触，其保护下面的导电层免受蚀刻过程。 所得到的LCOS面板具有更可靠地形成的电触点，以改善与导电层的电连接的稳定性。 在LCOS面板的导电层上形成电接触层的方法包括在导电层的一部分上沉积图案层的步骤。 该方法与可扩展制造的微加工技术相兼容。 所得到的LCOS面板包括暴露在导电层的一部分上的一个或多个电触头的图案。

公开(公告)号：US09450004B2

公开(公告)日：2016-09-20

申请号：US14542169

申请日：2014-11-14

Applicant: OmniVision Technologies, Inc.

Inventor： Chih-Hung Tu ,  Wei-Feng Lin

IPC: H01L27/146 ,  H01L21/82

CPC classification number: H01L27/14618 ,  H01L21/82 ,  H01L23/3114 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/11

Abstract: An encapsulated semiconductor device includes a device die with a semiconductor device fabricated thereon. A carrier layer opposite the device die covers the semiconductor device. A dam supports the carrier layer above the device die, the dam being located therebetween. The semiconductor device further includes a first sealant portion for attaching the dam to the device die, and a means for attaching the dam to the carrier layer. The device die, the dam, and the carrier layer form a sealed cavity enclosing the semiconductor device.A method of encapsulating semiconductor devices formed on a device wafer includes forming an assembly including a carrier wafer and a plurality of dams thereon. After the step of forming, the method attaches the plurality of dams to the device wafer to form a respective plurality of encapsulated semiconductor devices.

Abstract translation: 封装形成在器件晶片上的半导体器件的方法包括在其上形成包括载体晶片和多个堤坝的组件。 在形成步骤之后，该方法将多个堤坝连接到器件晶片以形成相应的多个封装的半导体器件。

公开(公告)号：US20160268327A1

公开(公告)日：2016-09-15

申请号：US15161726

申请日：2016-05-23

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chi-Chih Huang

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14605 ,  H01L27/14607 ,  H01L27/14612 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14687 ,  H01L27/14689 ,  H01L27/14698 ,  H01L2224/11

Abstract: A curved image sensor system includes (a) an image sensor substrate having a concave light-receiving surface, a pixel array located along the concave light-receiving surface, and a planar external surface facing away from the concave light-receiving surface, (b) a light-transmitting substrate bonded to the image sensor substrate by a bonding layer, and (c) a hermetically sealed cavity, bounded at least by the concave light-receiving surface, the light-transmitting substrate, and the bonding layer.

Abstract translation: 弯曲图像传感器系统包括：（a）具有凹面光接收面的图像传感器基板，沿着凹面受光面设置的像素阵列，以及背离凹面受光面的平面外表面，（b ）通过接合层与所述图像传感器基板接合的透光性基板，以及（c）至少由所述凹面受光面，所述透光性基板和所述接合层限定的气密密封空腔。

公开(公告)号：US09443894B1

公开(公告)日：2016-09-13

申请号：US14642245

申请日：2015-03-09

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Wei-Feng Lin ,  Chi-Kuei Lee

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14687 ,  H01L2224/11

Abstract: An imaging package includes an image sensor package formed with a semiconductor substrate. A removable transparent cover is bonded over the image sensor package to cover a first side the image sensor package. A lateral dimension of the removable transparent cover along a first direction is larger than a lateral dimension of the image sensor package along the first direction. An overhang portion of the removable transparent cover is defined by an exposed portion of the removable transparent cover that extends beyond a lateral side of the image sensor package along the first direction.

Abstract translation: 成像封装包括形成有半导体衬底的图像传感器封装。 可拆卸的透明盖粘合在图像传感器封装上以覆盖图像传感器封装的第一侧。 沿着第一方向的可拆卸透明盖的横向尺寸大于图像传感器封装沿着第一方向的横向尺寸。 可拆卸透明盖的突出部分由可移除的透明盖的暴露部分限定，其沿着第一方向延伸超过图像传感器封装的横向侧。

公开(公告)号：US20160260760A1

公开(公告)日：2016-09-08

申请号：US14639610

申请日：2015-03-05

Applicant: OmniVision Technologies, Inc.

Inventor： Chun-Sheng Fan ,  Wei-Feng Lin

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14698 ,  H01L2224/11 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An aerogel-encapsulated image sensor includes a device die with an image sensor fabricated thereon and an aerogel layer that encapsulates the image sensor. A method for encapsulating image sensor pixel arrays of respective bare image sensors formed on a sensor array sheet may include injecting an uncured aerogel portion on each image sensor pixel array, and curing each uncured aerogel portion. The step of curing may include at least one of (a) super-critical drying, (b) surface-modification drying, and (c) pinhole drying an uncured aerogel portion. The method may further include singulating the sensor array sheet into a plurality of aerogel-encapsulated image sensors. A method for encapsulating image sensor pixel arrays of respective bare image sensors on a device wafer may include forming an aerogel layer on each bare image sensor. The step of forming may include at least one of spin-coating, dip-coating, and spray-coating the aerogel layer.

Abstract translation: 气凝胶封装的图像传感器包括其上制造有图像传感器的器件裸片和封装图像传感器的气凝胶层。 封装形成在传感器阵列片上的各个裸图像传感器的图像传感器像素阵列的方法可以包括在每个图像传感器像素阵列上注入未固化的气凝胶部分，并固化每个未固化的气凝胶部分。 固化步骤可以包括（a）超临界干燥，（b）表面改性干燥和（c）针孔干燥未固化的气凝胶部分中的至少一种。 该方法还可以包括将传感器阵列片分成多个气凝胶封装的图像传感器。 将各个裸影像传感器的图像传感器像素阵列封装在器件晶片上的方法可包括在每个裸影像传感器上形成气凝胶层。 形成步骤可以包括旋涂，浸涂和喷涂气凝胶层中的至少一个。

公开(公告)号：US20160141320A1

公开(公告)日：2016-05-19

申请号：US14542169

申请日：2014-11-14

Applicant: OmniVision Technologies, Inc.

Inventor： Chih-Hung Tu ,  Wei-Feng Lin

IPC: H01L27/146 ,  H01L21/82

CPC classification number: H01L27/14618 ,  H01L21/82 ,  H01L23/3114 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2224/11

Abstract: An encapsulated semiconductor device includes a device die with a semiconductor device fabricated thereon. A carrier layer opposite the device die covers the semiconductor device. A dam supports the carrier layer above the device die, the dam being located therebetween. The semiconductor device further includes a first sealant portion for attaching the dam to the device die, and a means for attaching the dam to the carrier layer. The device die, the dam, and the carrier layer form a sealed cavity enclosing the semiconductor device.A method of encapsulating semiconductor devices formed on a device wafer includes forming an assembly including a carrier wafer and a plurality of dams thereon. After the step of forming, the method attaches the plurality of dams to the device wafer to form a respective plurality of encapsulated semiconductor devices.

Abstract translation: 封装的半导体器件包括在其上制造半导体器件的器件裸片。 与器件裸片相对的载体层覆盖半导体器件。 大坝支撑设备模具上方的载体层，坝体位于其间。 所述半导体器件还包括用于将所述大坝附接到所述器件裸片的第一密封剂部分和用于将所述大坝附着到所述载体层的装置。 器件裸片，大坝和载体层形成封闭半导体器件的密封腔。 封装形成在器件晶片上的半导体器件的方法包括在其上形成包括载体晶片和多个堤坝的组件。 在形成步骤之后，该方法将多个堤坝连接到器件晶片以形成相应的多个封装的半导体器件。

公开(公告)号：US12251081B2

公开(公告)日：2025-03-18

申请号：US17747803

申请日：2022-05-18

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng Chen ,  Wei-Ping Chen ,  Wei-Feng Lin ,  Jau-Jan Deng

IPC: A61B1/00 ,  A61B1/05 ,  A61B1/06

Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.

公开(公告)号：US11943525B2

公开(公告)日：2024-03-26

申请号：US17674675

申请日：2022-02-17

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng Chen ,  Wei-Ping Chen ,  Jau-Jan Deng ,  Wei-Feng Lin

IPC: H04N23/50 ,  H04N23/55 ,  H04N23/56 ,  H04N23/57

CPC classification number: H04N23/555 ,  H04N23/55 ,  H04N23/56 ,  H04N23/57

Abstract: An electronic camera assembly includes a camera chip cube bonded to camera bondpads of an interposer; at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at the same height as the camera bondpads; and a housing extending from the interposer and LEDs to the height of the camera chip cube, with light guides extending from the LEDs through the housing to a top of the housing. In embodiments, the electronic camera assembly includes a cable coupled to the interposer. In typical embodiments the camera chip cube has footprint dimensions of less than three and a half millimeters square.

公开(公告)号：US11114483B2

公开(公告)日：2021-09-07

申请号：US16100835

申请日：2018-08-10

Applicant: OmniVision Technologies, Inc.

Inventor： Chien-Chan Yeh ,  Ying-Chih Kuo ,  Wei-Feng Lin ,  Chun-Sheng Fan

IPC: H01L27/146 ,  G02F1/133 ,  G02F1/1335

Abstract: A cavityless chip-scale image-sensor package includes a substrate, a microlens array, and a low-index layer. The substrate includes a plurality of pixels forming a pixel array. The microlens array includes a plurality of microlenses each (i) having a lens refractive index, (ii) being aligned to a respective one of the plurality of pixels and (iii) having a non-planar microlens surfaces facing away from the respective one of the plurality of pixels. The low-index layer has a first refractive index less than the lens refractive index. The low-index layer also includes a bottom surface, at least part of which is conformal to each non-planar microlens surface. The microlens array is between the pixel array and the low-index layer.