公开(公告)号：US20170077361A1

公开(公告)日：2017-03-16

申请号：US15122680

申请日：2015-03-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Brandl ,  Tobias Gebuhr ,  Thomas Schwarz

IPC: H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/507 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: A method of producing optoelectronic components includes providing a carrier; arranging optoelectronic semiconductor chips on the carrier; forming a conversion layer for radiation conversion on the carrier, wherein the optoelectronic semiconductor chips are surrounded by the conversion layer; and carrying out a singulation process to form separate optoelectronic components, wherein at least the conversion layer is severed.

Abstract translation: 制造光电子部件的方法包括提供载体; 在载体上布置光电子半导体芯片; 在所述载体上形成用于辐射转换的转换层，其中所述光电半导体芯片被所述转换层包围; 并执行单一化处理以形成分离的光电子部件，其中至少转换层被切断。