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公开(公告)号：US20190296486A1
公开(公告)日：2019-09-26
申请号：US16058408
申请日：2018-08-08
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Kuen-Hsien WU , Kuo-Wei LEE
IPC: H01R13/631 , H05K7/20 , H01R13/502
Abstract: A heat transfer system between a heat source and a heat sink, wherein the heat transfer contact surfaces comprise a metal which forms numerous voids when placed adjacent one another. A thermal pad comprising a polymer filled with ceramic particles is placed between these heat transfer surfaces to intimately contact each of the metal surfaces without void formation, thereby increasing thermal conductivity. The heat source and heat sink are joined by relative sliding motion. This sliding motion might damage the thermal pad. Thus, a hot swap structure is provided for controlling the movement of the thermal pad into contact with the heat source as the sliding motion is completed.
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公开(公告)号：US20190234647A1
公开(公告)日：2019-08-01
申请号：US15972795
申请日：2018-05-07
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Kuen-Hsien WU
IPC: F24F13/14
CPC classification number: F24F13/1426 , F04D19/007 , F04D25/08 , F04D25/14 , F04D25/166 , F04D29/601
Abstract: A fan assembly is disclosed to prevent reverse air flow when the fan stops working. The assembly has a fan module including an intake end, a motor casing and a motor propelling a fan. A louver module has a plurality of slats having an open position to allow air flow and a closed position to block air flow. The louver module is coupled to the motor casing to provide a seal between the louver module and the motor casing.
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Patent Agency Ranking
公开(公告)号：US20190223317A1
公开(公告)日：2019-07-18
申请号：US15939690
申请日：2018-03-29
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Herman TAN , Yung-Hsiang LU
CPC classification number: H05K7/20009 , H05F1/00 , H05K7/20145 , H05K7/20709
Abstract: An air duct that can be attached to existing grille of an electronic device to improve airflow and reduce overall system impedance/pressure drop without increasing the power to an air mover. The air duct has a wall configuration to smooth-out airflow while simultaneously delivering more airflow to selected portions of the interior of an electronic device, such as a server.
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公开(公告)号：US20190111375A1
公开(公告)日：2019-04-18
申请号：US15730937
申请日：2017-10-12
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Hou-Hsien CHANG , Kuen-Hsien Wu
Abstract: A coolant gas, multi-filter filtering unit, for use with servers and other electrical equipment that can be utilized as a retrofit device for existing servers or provided as OEM equipment with the server is described. A series of static centrifugal force filtering units are position upstream of a replaceable surface filter. The surface filter can be a HEPA filter, or alternatively include an absorbent layer or separate third filter of charcoal to remove VOCs.
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公开(公告)号：US20180192545A1
公开(公告)日：2018-07-05
申请号：US15397437
申请日：2017-01-03
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Ching-Yu CHEN , Tsung-Ta LI
CPC classification number: H05K7/20336 , F28D15/0266 , F28D15/0275 , F28F3/02 , F28F3/06 , F28F3/12 , F28F2215/04 , F28F2215/06 , H05K7/20409
Abstract: A heat dissipation apparatus having a base, a heat dissipater, and a plurality of fin arrays. The base has at least one horizontal portion disposed in the base and at least one vertical portion extending therefrom. At least one of the plurality of fin arrays coupled with the at least one horizontal portion of the heat dissipater and at least one of the plurality of fin arrays coupled with the at least one vertical portion of the heat dissipater.
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公开(公告)号：US20180003192A1
公开(公告)日：2018-01-04
申请号：US15197507
申请日：2016-06-29
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Ching-Yu CHEN , Tsung-Ta LI
CPC classification number: F04D29/542 , F04D19/002 , F04D29/325 , H05K7/20727 , H05K7/20736
Abstract: A cooling system includes a fan and a system component. The fan includes a plurality of fan blades and configured to rotate in a fan direction. The system component is located downstream of the fan, and includes a cutout for passing of airflow from the fan, and a bridge spanning the cutout. The bridge includes a center section and at least one arm section extending from the center section to an edge of the cutout along a curved path offset towards the fan direction.
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57.发明申请公开(公告)号：US20140290913A1
公开(公告)日：2014-10-02
申请号：US14089491
申请日：2013-11-25
Applicant: Quanta Computer Inc.
Inventor： Yu-Nien HUANG , Cheng-Yu CHENG
CPC classification number: F28D15/04 , B23P15/26 , B23P2700/09 , F28D15/0233 , F28D15/046 , F28F2255/08 , Y10T29/49353
Abstract: A heat pipe includes a flat tube, a first capillary structure, a second capillary structure, and a capillary structure block. The flat tube has flat portions, a first arc portion and a second arc portion. The first arc portion and the second arc portion are respectively connected to the opposite sides of the flat portions. The first capillary structure is accommodated in the flat tube and is in contact with the first arc portion. The second capillary structure is accommodated in the flat tube, and is in contact with the second arc portion. The first and second capillary structures are spaced apart from each other, and define a gas flowing chamber therebetween. The capillary structure block is disposed on a partial area of the gas flowing chamber, and is in contact with the flat portions, the first and second capillary structures.
Abstract translation: 热管包括扁平管，第一毛细结构，第二毛细管结构和毛细结构块。 扁平管具有平坦部分，第一弧形部分和第二弧形部分。 第一弧形部分和第二弧形部分分别连接到平坦部分的相对侧。 第一毛细结构容纳在扁平管中并与第一弧形部分接触。 第二毛细结构容纳在扁平管中，并与第二弧形部分接触。 第一和第二毛细结构彼此间隔开，并且在它们之间限定气体流动室。 毛细管结构块设置在气体流动室的局部区域上，并且与平坦部分，第一和第二毛细结构接触。
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