公开(公告)号：US07589797B2

公开(公告)日：2009-09-15

申请号：US11777720

申请日：2007-07-13

申请人： Ra-Min Tain ,  Chun-Chuan Lin ,  Wei-Kuo Han ,  Je-Ping Hu ,  Chen-Hung Chew

发明人： Ra-Min Tain ,  Chun-Chuan Lin ,  Wei-Kuo Han ,  Je-Ping Hu ,  Chen-Hung Chew

IPC分类号： G02F1/1335 ,  G03B21/14

CPC分类号： G03B21/2073 ,  G02F1/133603 ,  G02F2001/133607 ,  G02F2001/133622 ,  G03B33/08 ,  G03B33/12 ,  H04N9/3111 ,  H04N9/3155 ,  H04N9/3164

摘要： A transmitting-type liquid crystal display projection system including a planar light source which emits planar white beam or planar R/G/B beams in succession is provided. A first polarization filter receives the planar light source and polarizes the same to be in a first polarization state. A liquid-crystal light valve receives the polarized planar light source, and converts the first polarization state to a second polarization state having a corresponding gray level. A second polarization filter receives a light output from the liquid crystal light valve to produce a second polarization light beam. A projection unit projects the second polarization light beam onto a display plane. Using the same planar light source, a polarization beam splitting (PBS) device with a refection-type liquid crystal light valve can be used to achieve the reflection-type projection system.

摘要翻译： 提供了一种发射型液晶显示投影系统，其包括平面光源，其连续地发射平面的白光束或平面的R / G / B光束。 第一偏振滤光器接收平面光源并使其偏振成第一偏振状态。 液晶光阀接收极化平面光源，并将第一偏振态转换为具有相应灰度级的第二偏振状态。 第二偏振滤波器接收从液晶光阀输出的光，以产生第二偏振光束。 投影单元将第二偏振光束投影到显示平面上。 使用相同的平面光源，可以使用具有反射型液晶光阀的偏振分束（PBS）装置来实现反射型投影系统。

公开(公告)号：US07205719B2

公开(公告)日：2007-04-17

申请号：US11023692

申请日：2004-12-27

申请人： Ra-Min Tain ,  Hei-Tong Ching ,  Chin-Lung Chen ,  Rong-Chang Fang

发明人： Ra-Min Tain ,  Hei-Tong Ching ,  Chin-Lung Chen ,  Rong-Chang Fang

IPC分类号： H05B33/00

CPC分类号： G02F1/133603 ,  F21K9/00 ,  G02F1/133606 ,  G02F2001/133628

摘要： A light source with LED and optical protrusions is provided. It comprises an optical panel and at least one optical plate. The light source can be used together with a heat sink or an optical element to enhance its performance. The optical panel forms an optical surface having plural optical protrusions to reflect and mix lights emitted from the LEDs. The optical plate is inserted into at least one slot on the optical panel, and it comprises a heat dissipation core plate and at least one electric circuit layer. The electric circuit layer comprises LEDs and at least one control circuitry. The electric circuit layer can be attached to either single side or both sides of the heat dissipation core plate. The invention achieves good uniformity and high intensity of the combined lights with desired chromaticity.

摘要翻译： 提供具有LED和光学突起的光源。 它包括光学面板和至少一个光学板。 光源可以与散热器或光学元件一起使用以增强其性能。 光学面板形成具有多个光学突起的光学表面，以反射和混合从LED发出的光。 光学板被插入到光学面板上的至少一个槽中，并且其包括散热芯板和至少一个电路层。 电路层包括LED和至少一个控制电路。 电路层可以安装在散热芯板的单侧或两侧。 本发明实现了具有所需色度的组合光的均匀性和高强度。

公开(公告)号：US20070012938A1

公开(公告)日：2007-01-18

申请号：US11255915

申请日：2005-10-24

申请人： Chih-Kuang Yu ,  Chun-Kai Liu ,  Ra-Min Tain ,  Jen-Hau Cheng

发明人： Chih-Kuang Yu ,  Chun-Kai Liu ,  Ra-Min Tain ,  Jen-Hau Cheng

IPC分类号： H01L33/00

CPC分类号： H01L25/167 ,  H01L33/62 ,  H01L33/645 ,  H01L2224/05147 ,  H01L2224/05171 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A light-emitting-diode packaging structure having thermoelectric device, which is applied to the LED unit packaged using the flip chip technology. This is realized by directly building the thermoelectric elements into the solder bump layer of the light-emitting-diode packaging structure to replace a part of the solder bumps, as such raising the heat dissipation efficiency of the light emitting diode unit, enhancing the stability and reliability of light emission of the LED unit, and reducing the difficulties and complexity of the integration of the LED package.

摘要翻译： 一种具有热电装置的发光二极管封装结构，其应用于使用倒装芯片技术封装的LED单元。 这是通过将热电元件直接构建到发光二极管封装结构的焊料凸块层中来实现的，以替代部分焊料凸块，从而提高发光二极管单元的散热效率，增强了稳定性和 LED单元发光的可靠性，降低了LED封装的集成难度和复杂性。

公开(公告)号：US08502224B2

公开(公告)日：2013-08-06

申请号：US12962658

申请日：2010-12-08

申请人： Ra-Min Tain ,  John H. Lau ,  Ming-Che Hsieh ,  Wei Li ,  Ming-Ji Dai

发明人： Ra-Min Tain ,  John H. Lau ,  Ming-Che Hsieh ,  Wei Li ,  Ming-Ji Dai

IPC分类号： H01L23/58

CPC分类号： G01B7/18 ,  G01L1/18 ,  G01L1/2206 ,  H01L2224/16145

摘要： A measuring apparatus including a first chip, a first circuit layer, a first heater, a first stress sensor and a second circuit layer is provided. The first chip has a first through silicon via, a first surface and a second surface opposite to the first surface. The first circuit layer is disposed on the first surface. The first heater and the first stress sensor are disposed on the first surface and connected to the first circuit layer. The second circuit layer is disposed on the second surface.

摘要翻译： 提供了包括第一芯片，第一电路层，第一加热器，第一应力传感器和第二电路层的测量装置。 第一芯片具有第一通孔硅通孔，第一表面和与第一表面相对的第二表面。 第一电路层设置在第一表面上。 第一加热器和第一应力传感器设置在第一表面上并连接到第一电路层。 第二电路层设置在第二表面上。

公开(公告)号：US08397584B2

公开(公告)日：2013-03-19

申请号：US13023545

申请日：2011-02-09

申请人： Ming-Che Hsieh ,  John H. Lau ,  Ra-Min Tain

发明人： Ming-Che Hsieh ,  John H. Lau ,  Ra-Min Tain

IPC分类号： G01N3/00 ,  G01N3/20

CPC分类号： H01L22/12 ,  G01N19/04 ,  H01L2224/16

摘要： A fabricating method and a testing method of a semiconductor device and a mechanical integrity testing apparatus are provided. An object includes a wafer, an insulating layer, and a plurality of conductive posts is provided. A surface of the wafer has a plurality of first blind holes outside chip regions and a plurality of second blind holes inside the chip regions. The insulating layer is between the conductive posts and the walls of the first blind holes and between the conductive posts and the walls of the second blind holes. A mechanical integrity test is performed to test a binding strength between the insulating layer, the conductive posts, and the walls of the first blind holes. The conductive posts in the chip regions are electrically connected to an element after the conductive posts in the first blind holes are qualified in the mechanical integrity test.

摘要翻译： 提供了半导体器件和机械完整性测试装置的制造方法和测试方法。 一种物体包括晶片，绝缘层和多个导电柱。 晶片的表面在芯片区域外部具有多个第一盲孔和芯片区域内的多个第二盲孔。 绝缘层位于导电柱和第一盲孔的壁之间以及导电柱和第二盲孔的壁之间。 执行机械完整性测试以测试绝缘层，导电柱和第一盲孔的壁之间的结合强度。 在机械完整性测试中，在第一盲孔中的导电柱被限定之后，芯片区域中的导电柱电连接到元件。

公开(公告)号：US20120068177A1

公开(公告)日：2012-03-22

申请号：US13308523

申请日：2011-11-30

申请人： Ra-Min Tain ,  Ming-Ji Dai ,  Shyh-Shyuan Sheu ,  Chih-Sheng Lin ,  Shih-Hsien Wu

发明人： Ra-Min Tain ,  Ming-Ji Dai ,  Shyh-Shyuan Sheu ,  Chih-Sheng Lin ,  Shih-Hsien Wu

IPC分类号： H01L25/07

CPC分类号： G01B7/18 ,  G01L1/18 ,  G01L1/2206 ,  H01L2224/16145

摘要： A measuring apparatus including a first chip, a first circuit layer, a first heater, a first stress sensor and a second circuit layer is provided. The first chip has a first through silicon via, a first surface and a second surface opposite to the first surface. The first circuit layer is disposed on the first surface. The first heater and the first stress sensor are disposed on the first surface and connected to the first circuit layer. The second circuit layer is disposed on the second surface. The first heater comprises a plurality of first switches connected in series to generate heat.

摘要翻译： 提供了包括第一芯片，第一电路层，第一加热器，第一应力传感器和第二电路层的测量装置。 第一芯片具有第一通孔硅通孔，第一表面和与第一表面相对的第二表面。 第一电路层设置在第一表面上。 第一加热器和第一应力传感器设置在第一表面上并连接到第一电路层。 第二电路层设置在第二表面上。 第一加热器包括串联连接以产生热量的多个第一开关。

公开(公告)号：US20100162969A1

公开(公告)日：2010-07-01

申请号：US12390512

申请日：2009-02-23

申请人： Ra-Min Tain ,  Wen-Yang Peng ,  Yao-Shun Chen

发明人： Ra-Min Tain ,  Wen-Yang Peng ,  Yao-Shun Chen

IPC分类号： F02B43/10 ,  F01K27/00 ,  F01K11/02 ,  C25B1/04 ,  F02B33/40

CPC分类号： F01N5/02 ,  C25B1/04 ,  C25B9/00 ,  F01K27/00 ,  F02B43/10 ,  F02B2043/106 ,  F02G2260/00 ,  H02K7/1823 ,  Y02E60/366 ,  Y02T10/16 ,  Y02T10/32

摘要： A heat-pipe electric power generating device including a fan disposed between an evaporating end and a condensing end of a heat-pipe is provided. A magnetic substance is disposed on the fan to form a magnetic field. A stator coil of a generator is disposed at the outer of the heat-pipe, which is corresponding to the position of the fan. An induced current is generated by the stator coil of the generator when the magnetic substance spins. Since the heat-pipe is made of copper, and the magnetic field is not shielded by copper, a current is induced when a relative motion between the magnetic substance on the fan and the stator coil of the generator at the outer of the heat-pipe is generated. Further, the heat-pipe electric power generating device can be applied on a hydrogen/oxygen gas generating apparatus and an internal combustion engine system of a motor vehicle.

摘要翻译： 提供一种热管发电装置，其包括设置在蒸发端和热管的冷凝端之间的风扇。 将磁性物质设置在风扇上以形成磁场。 发电机的定子线圈设置在热管的外部，其对应于风扇的位置。 当磁性物质旋转时，发电机的定子线圈产生感应电流。 由于热管由铜制成，并且磁场不被铜屏蔽，当风扇上的磁性物质与发热体的定子线圈之间在热管外部的相对运动时，会产生电流 被生成。 此外，热管式发电装置可以应用于机动车辆的氢气/氧气发生装置和内燃机系统。

公开(公告)号：US20100085754A1

公开(公告)日：2010-04-08

申请号：US12575317

申请日：2009-10-07

申请人： Kung-Hsia Wang ,  Ra-Min Tain ,  Ping-Hsin Hsia ,  Hsien-Chang Lee ,  Shu-Jung Yang ,  Chao-Hsien Chang

发明人： Kung-Hsia Wang ,  Ra-Min Tain ,  Ping-Hsin Hsia ,  Hsien-Chang Lee ,  Shu-Jung Yang ,  Chao-Hsien Chang

IPC分类号： F21S4/00

CPC分类号： F21V29/74 ,  F21K9/23 ,  F21V3/00 ,  F21V23/002 ,  F21V29/004 ,  F21V29/89 ,  F21V31/005 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light-emitting device may include a heat-dissipating base, a light-emitting unit, a housing, and a first conductive contact and a second conductive contact. The heat-dissipating base has a top portion and a bottom portion. The bottom portion of the heat-dissipating base may include an exposed heat-dissipation surface. The light-emitting unit is over the top portion of the heat-dissipating base and is arranged to provide heat conductivity at least from the light-emitting unit to the heat-dissipating base. The light-emitting unit may include at least one light-emitting diode for emitting light and a first electrode and a second electrode. Heat may be generated as the light-emitting diode emits light, and the at least one light-emitting diode may have power input terminals for receiving power input to the at least one light-emitting diode. The power input may include one of an alternating-current input and a direct-current input. The first electrode and the second electrode are electrically coupled with the input terminals of the at least one light-emitting diode. The housing encloses at least a portion of the light emitting unit and covers the top portion of the heat-dissipating base. The first conductive contact and the second conductive contact are near or below a portion of the heat-dissipating base and are configured to receive external power supply. The first conductive contact may be electrically coupled with the first electrode, and the second conductive contact may be electrically coupled with the second electrode.

摘要翻译： 发光装置可以包括散热基座，发光单元，外壳以​​及第一导电触点和第二导电触点。 散热基座具有顶部和底部。 散热基座的底部可包括暴露的散热表面。 发光单元在散热基座的顶部之上，并且布置成至少从发光单元向散热基底提供导热性。 发光单元可以包括用于发光的至少一个发光二极管和第一电极和第二电极。 可以在发光二极管发光时产生热量，并且至少一个发光二极管可以具有用于接收输入到至少一个发光二极管的功率的电力输入端子。 电源输入可以包括交流输入和直流输入之一。 第一电极和第二电极与至少一个发光二极管的输入端电耦合。 壳体包围发光单元的至少一部分并且覆盖散热基座的顶部。 第一导电接触和第二导电接触靠近或低于散热基部的一部分，并且被配置为接收外部电源。 第一导电接触可以与第一电极电耦合，并且第二导电接触可以与第二电极电耦合。

公开(公告)号：US07413326B2

公开(公告)日：2008-08-19

申请号：US11851930

申请日：2007-09-07

申请人： Ra-Min Tain ,  Tzong-Che Ho ,  Shyl-Ching Liau

发明人： Ra-Min Tain ,  Tzong-Che Ho ,  Shyl-Ching Liau

IPC分类号： F21V29/00 ,  H01L29/22

CPC分类号： H05B33/0857 ,  F21K9/00 ,  F21V7/0008 ,  F21V29/51 ,  F21V29/67 ,  F21V29/677 ,  F21V29/74 ,  F21Y2107/30 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05B33/0803

摘要： An LED lamp includes LED chips, an axle, and a lampshade. The LED chips are mounted on surface of the axle. The axle which is coupled to the lampshade includes heat pipes for transferring the heat generated by the LED chips to exterior of the lampshade and obtaining a better heat dissipation.

摘要翻译： LED灯包括LED芯片，轴和灯罩。 LED芯片安装在轴的表面上。 耦合到灯罩的轴包括用于将由LED芯片产生的热量传递到灯罩外部并获得更好散热的热管。

公开(公告)号：US20060138951A1

公开(公告)日：2006-06-29

申请号：US11023692

申请日：2004-12-27

申请人： Ra-Min Tain ,  Hei-Tong Ching ,  Chin-Lung Chen ,  Rong-Chang Fang

发明人： Ra-Min Tain ,  Hei-Tong Ching ,  Chin-Lung Chen ,  Rong-Chang Fang

IPC分类号： H05B37/02 ,  H01L33/00

CPC分类号： G02F1/133603 ,  F21K9/00 ,  G02F1/133606 ,  G02F2001/133628

摘要： A light source with LED and optical protrusions is provided. It comprises an optical panel and at least one optical plate. The light source can be used together with a heat sink or an optical element to enhance its performance. The optical panel forms an optical surface having plural optical protrusions to reflect and mix lights emitted from the LEDs. The optical plate is inserted into at least one slot on the optical panel, and it comprises a heat dissipation core plate and at least one electric circuit layer. The electric circuit layer comprises LEDs and at least one control circuitry. The electric circuit layer can be attached to either single side or both sides of the heat dissipation core plate. The invention achieves good uniformity and high intensity of the combined lights with desired chromaticity.

摘要翻译： 提供具有LED和光学突起的光源。 它包括光学面板和至少一个光学板。 光源可以与散热器或光学元件一起使用以增强其性能。 光学面板形成具有多个光学突起的光学表面，以反射和混合从LED发出的光。 光学板被插入到光学面板上的至少一个槽中，并且其包括散热芯板和至少一个电路层。 电路层包括LED和至少一个控制电路。 电路层可以安装在散热芯板的单侧或两侧。 本发明实现了具有所需色度的组合光的均匀性和高强度。