Monitoring method for three-dimensional intergrated circuit (3D IC) and apparatus using the same
    1.
    发明授权
    Monitoring method for three-dimensional intergrated circuit (3D IC) and apparatus using the same 有权
    三维集成电路(3D IC)及其使用的装置的监控方法

    公开(公告)号:US09064837B2

    公开(公告)日:2015-06-23

    申请号:US13493976

    申请日:2012-06-11

    CPC classification number: H01L22/34 H01L2924/0002 H01L2924/00

    Abstract: A monitoring method of a three-dimensional integrated circuit (3D IC) is provided, wherein the method includes: providing a plurality of TSVs, providing a plurality of inverters; connecting the inverters with the plurality of TSVs as a circuit loop; enabling the circuit loop to oscillate; measuring an output signal on an output end of one of the plurality of inverters; and determining the manufacturing state of the plurality of TSVs of the 3D IC based on the output signal and apparatus using the same.

    Abstract translation: 提供了三维集成电路(3D IC)的监视方法,其中所述方法包括:提供多个TSV,提供多个逆变器; 将所述反相器与所述多个TSV连接作为电路回路; 使电路回路振荡; 测量所述多个逆变器之一的输出端上的输出信号; 以及基于输出信号和使用其的装置来确定3D IC的多个TSV的制造状态。

    Multi-chip stack structure
    2.
    发明授权
    Multi-chip stack structure 有权
    多芯片堆栈结构

    公开(公告)号:US08581419B2

    公开(公告)日:2013-11-12

    申请号:US12968285

    申请日:2010-12-15

    Abstract: A multi-chip stack structure including a first chip, a second chip, a shielding layer, and a plurality of conductive bumps is provided. The second chip is stacked on the first chip. The second chip has a plurality of through silicon via (TSV) structures to conduct a reference voltage. The shielding layer and the plurality of conductive bumps are disposed between the first chip and the second chip, and are electrically connected to the plurality of TSV structures. The shielding layer can isolate noises and improve signal coupling between two adjacent chips.

    Abstract translation: 提供了包括第一芯片,第二芯片,屏蔽层和多个导电凸块的多芯片堆叠结构。 第二芯片堆叠在第一芯片上。 第二芯片具有多个贯穿硅通孔(TSV)结构以导通参考电压。 屏蔽层和多个导电凸块设置在第一芯片和第二芯片之间,并且电连接到多个TSV结构。 屏蔽层可以隔离噪声并改善两个相邻芯片之间的信号耦合。

    AC Direct Drive Organic Light Emitting Diode Assembly
    3.
    发明申请
    AC Direct Drive Organic Light Emitting Diode Assembly 审中-公开
    交流直接驱动有机发光二极管组件

    公开(公告)号:US20130020952A1

    公开(公告)日:2013-01-24

    申请号:US13541689

    申请日:2012-07-04

    CPC classification number: H05B33/0827 Y02B20/36

    Abstract: The present invention is related to AC direct drive organic light emitting diode assembly which comprises parallelly connected a positive duty OLED serial and a negative duty OLED serial receiving an AC voltage. A positive duty of the AC voltage actives the positive serial OLED to generates light output and a negative duty of the AC voltage lights on the negative serial OLED so that the present invention can be driven directly with AC power. The present invention provides a sparkless light output OLED assembly having a very low production cost and being very convenience to use.

    Abstract translation: 本发明涉及AC直驱驱动有机发光二极管组件,其包括并联连接正负载OLED串联和负责负载的OLED串行接收AC电压。 交流电压的正负值激活正串联OLED以产生负的串行OLED上的交流电压光的光输出和负占空比,使得本发明可以直接用交流电驱动。 本发明提供一种无火花光输出OLED组件,其具有非常低的生产成本并且非常方便使用。

    MONITORING METHOD FOR THREE-DIMENSIONAL INTERGRATED CIRCUIT (3D IC) AND APPARATUS USING THE SAME
    4.
    发明申请
    MONITORING METHOD FOR THREE-DIMENSIONAL INTERGRATED CIRCUIT (3D IC) AND APPARATUS USING THE SAME 审中-公开
    三维集成电路(3D IC)的监视方法及其使用的装置

    公开(公告)号:US20120249178A1

    公开(公告)日:2012-10-04

    申请号:US13493976

    申请日:2012-06-11

    CPC classification number: H01L22/34 H01L2924/0002 H01L2924/00

    Abstract: A monitoring method of a three-dimensional integrated circuit (3D IC) is provided, wherein the method includes: providing a plurality of TSVs, providing a plurality of inverters; connecting the inverters with the plurality of TSVs as a circuit loop; enabling the circuit loop to oscillate; measuring an output signal on an output end of one of the plurality of inverters; and determining the manufacturing state of the plurality of TSVs of the 3D IC based on the output signal and apparatus using the same.

    Abstract translation: 提供了三维集成电路(3D IC)的监视方法,其中该方法包括:提供多个TSV,提供多个逆变器; 将所述反相器与所述多个TSV连接作为电路回路; 使电路回路振荡; 测量所述多个逆变器之一的输出端上的输出信号; 以及基于输出信号和使用其的装置来确定3D IC的多个TSV的制造状态。

    Intruder detection system and method
    6.
    发明授权
    Intruder detection system and method 有权
    入侵者检测系统和方法

    公开(公告)号:US08111156B2

    公开(公告)日:2012-02-07

    申请号:US12262152

    申请日:2008-10-30

    CPC classification number: G08B25/009 G08B13/19645 G08B13/19647

    Abstract: This invention is an intruder detection system which integrates wireless sensor network and security robots. Multiple ZigBee wireless sensor modules installed in the environment can detect intruders and abnormal conditions with various sensors, and transmit alert to the monitoring center and security robot via the wireless mesh network. The robot can navigate in the environment autonomously and approach to a target place using its localization system. If any possible intruder is detected, the robot can approach to that location, and transmit images to the mobile devices of the securities and users, in order to determine the exact situation in real time.

    Abstract translation: 本发明是一种综合无线传感器网络和安全机器人的入侵者检测系统。 安装在环境中的多个ZigBee无线传感器模块可以通过各种传感器检测入侵者和异常情况,并通过无线网状网络向监控中心和安全机器人发送警报。 机器人可以自主地在环境中导航,并使用其定位系统接近目标地点。 如果检测到任何可能的入侵者,机器人可以接近该位置,并将图像发送到证券和用户的移动设备,以便实时确定确切的情况。

    Light-emitting diode device including a multi-functional layer
    7.
    发明授权
    Light-emitting diode device including a multi-functional layer 失效
    包括多功能层的发光二极管装置

    公开(公告)号:US08080829B2

    公开(公告)日:2011-12-20

    申请号:US12685350

    申请日:2010-01-11

    CPC classification number: H01L33/46 H01L33/14 H01L33/38

    Abstract: A light-emitting diode device includes: a substrate; a light-emitting layered structure formed on the substrate; a multi-functional layer having a first main portion and formed on the light-emitting layered structure for spreading current laterally and for reflecting light emitted from the light-emitting layered structure; and first and second electrodes electrically coupled to the light-emitting layered structure. The first electrode is formed on the light-emitting layered structure and has a first electrode main part. The first main portion of the multi-functional layer is aligned below and is provided with a size larger than that of the first electrode main part.

    Abstract translation: 发光二极管装置包括:基板; 形成在基板上的发光层状结构; 具有第一主要部分并形成在发光层状结构上用于横向扩散电流并用于反射从发光层状结构发射的光的多功能层; 以及电耦合到发光层状结构的第一和第二电极。 第一电极形成在发光层状结构上并具有第一电极主体部分。 多功能层的第一主要部分在下方对准并且具有比第一电极主体部分大的尺寸。

    LIGHT EMITTING DIODE MODULE AND METHOD OF MAKING THE SAME
    8.
    发明申请
    LIGHT EMITTING DIODE MODULE AND METHOD OF MAKING THE SAME 失效
    发光二极管模块及其制造方法

    公开(公告)号:US20110278600A1

    公开(公告)日:2011-11-17

    申请号:US12968589

    申请日:2010-12-15

    CPC classification number: H01L27/153 H01L33/20 H01L2224/18

    Abstract: A light emitting diode module includes a substrate, at least two spaced apart light emitting diodes formed on the substrate, an insulating layer, and an electrically conductive layer. Each of the light emitting diodes includes a light emitting unit, an n-electrode, and a p-electrode. The light emitting unit has first and second portions. The first portion has an n-type top face and a first stepped side. The second portion has a p-type top face and a second stepped side. The insulating layer is formed on the n-type top face and the first stepped side of the first portion of one of the light emitting diodes, and the second stepped side and the p-type top face of the second portion of the other one of the light emitting diodes. The electrically conductive layer is formed on the insulating layer. A method of making the light emitting diode module is also disclosed.

    Abstract translation: 发光二极管模块包括衬底,形成在衬底上的至少两个间隔开的发光二极管,绝缘层和导电层。 每个发光二极管包括发光单元,n电极和p电极。 发光单元具有第一和第二部分。 第一部分具有n型顶面和第一台阶侧。 第二部分具有p型顶面和第二阶梯侧。 绝缘层形成在一个发光二极管的第一部分的n型顶面和第一台阶侧,另一个的第二部分的第二台阶侧和p型顶面 发光二极管。 导电层形成在绝缘层上。 还公开了制造发光二极管模块的方法。

    Apparatus for fastening a matrix band to a tooth
    10.
    发明授权
    Apparatus for fastening a matrix band to a tooth 失效
    用于将矩阵带固定到牙齿上的装置

    公开(公告)号:US5722831A

    公开(公告)日:1998-03-03

    申请号:US770558

    申请日:1996-12-20

    Applicant: Chih-Sheng Lin

    Inventor: Chih-Sheng Lin

    CPC classification number: A61C5/125

    Abstract: An apparatus for fastening a matrix band to a tooth includes an elongated frame, an elongated slide member, a locking unit and a single-direction positioning mechanism. A front end of the support frame is formed with a retaining member which engages slidably overlapping end portions of the matrix band in order to orient selectively a loop portion of the matrix band to predetermined directions. The slide member engages slidably and parallelly with the support frame. A front end of the slide member is formed with a sliding block. The locking unit is provided on the sliding block of the slide member for locking releasably the overlapping end portions in the sliding block. The single-direction positioning mechanism permits the sliding block of the slide member to move away from the retaining member in order to pull the overlapping end portions of the matrix band to move rearward, but locks releasably the slide member relative to the support frame in order to prevent the sliding block from being moved toward the retaining member.

    Abstract translation: 用于将矩阵带固定到齿的装置包括细长框架,细长滑动构件,锁定单元和单向定位机构。 支撑框架的前端形成有保持构件,该保持构件与矩阵带的可滑动重叠的端部接合,以便选择性地将矩阵带的环部分定向到预定方向。 滑动构件与支撑框架可滑动地并且平行地接合。 滑动构件的前端形成有滑动块。 锁定单元设置在滑动构件的滑动块上,用于可松开地锁定滑动块中的重叠端部。 单向定位机构允许滑动构件的滑动块移动远离保持构件,以便拉动矩阵带的重叠端部向后移动,但是顺序地相对于支撑框架可释放地锁定滑动构件 以防止滑动块朝向保持构件移动。

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