摘要:
A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.
摘要:
A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.
摘要:
An acoustic and thermal energy management system and method comprising a microprocessor and a thermal mass positioned at a distance from the microprocessor, the microprocessor and thermal mass being thermally connected to the microprocessor in a manner to transfer thermal energy from the microprocessor to the thermal mass. The acoustic and thermal energy management system transferring heat from the microprocessor to a thermal mass for dissipation reducing the level of heat at the microprocessor, thereby limiting the operation of or the operation level of a fan.
摘要:
A mounting tray for a hard disk drive has a base, a front wall, and a pair of side walls. A pair of latching mechanisms are located in each side wall. Each latching mechanism has a slide and a spring-like fastener. The fasteners have an unlocked position where they are biased away from the tray, and a locked position where the slides capture them against the side walls. A tapered pin extends inward from each fastener. With the latching mechanisms in their unlocked positions, a drive is placed in the tray. The slides are then moved to the locked positions such that the pins on the fasteners engage holes in the drive. The pins secure the drive from movement relative to the tray to facilitate hot plugging of the drive into a computer system.
摘要:
An arrangement and method for enhancing the cooling capacity of portable personal computers. More particularly, the arrangement is employed for increasing the cooling capacity of portable personal computers, particularly such as laptop or notebook computers, wherein the computer possesses a keyboard housing having the rear edge thereof hingedly connected with the bottom of an openable display unit or panel, and containing heat-generating computer electronics, from which heat is removed through the intermediary of heat pipes which are hingedly connected with at least one heat dissipator located in the display unit.
摘要:
A system to improve operation of a data center with heterogeneous computing clouds may include monitoring components to track data center climate controls and individual heterogeneous computing clouds' operating parameters within the data center. The system may also include a controller that regulates the individual heterogeneous computing clouds and data center climate controls based upon data generated by the monitoring components to improve the operating performance of the individual heterogeneous computing clouds as well as the operating performance of the data center. The system may further include spilling computing clouds to receive excess workload of an individual heterogeneous computing cloud without violating individual heterogeneous computing clouds contracts.
摘要:
Computing devices have fan speeds governing airflows through the computing devices. The rack has a maximum airflow associated with a cooling component for the rack. The computing devices transmit their current airflows. A sum of the current airflows is determined. Where the sum is greater than the maximum airflow, the fan speeds of one or more selected computing devices are decreased. The fan speeds of lower priority computing devices may be reduced before the fan speeds higher priority computing devices are reduced. Fan speed reduction may be achieved in a centralized manner, by employing a centralized management component, or in a decentralized manner, without employing a centralized management component.
摘要:
An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.
摘要:
One embodiment provides a heatsink having a flexible base and height-adjusted cooling fins. The flexible base includes a single base plate, with cooling fins and heat pipes secured directly to an upper surface of the single base plate. The use of the single base plate allows the length of the cooling fins to be increased. The use of a single base plate also allows the base to flex when mounted at the outer region of the base plate to a circuit board using fasteners. The flexure of the base biases the heatsink against the heat-generating component. The flexure also displaces the outer cooling fins, and the length of the outer cooling fins is further increased to compensate for the anticipate displacement.
摘要:
Computing devices have fan speeds governing airflows through the computing devices. The rack has a maximum airflow associated with a cooling component for the rack. The computing devices transmit their current airflows. A sum of the current airflows is determined. Where the sum is greater than the maximum airflow, the fan speeds of one or more selected computing devices are decreased. The fan speeds of lower priority computing devices may be reduced before the fan speeds higher priority computing devices are reduced. Fan speed reduction may be achieved in a centralized manner, by employing a centralized management component, or in a decentralized manner, without employing a centralized management component.