Interposable Heat Sink for Adjacent Memory Modules
    52.
    发明申请
    Interposable Heat Sink for Adjacent Memory Modules 有权
    相邻内存模块的可插拔散热器

    公开(公告)号:US20070201212A1

    公开(公告)日:2007-08-30

    申请号:US11746322

    申请日:2007-05-09

    IPC分类号: H05K7/20

    摘要: A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

    摘要翻译: 用于常规存储器模块(例如DIMM)的散热装置,其被配置为定位在安装在印刷电路板上的基本上平行的连接器中的相邻存储器模块之间。 每个散热装置包括配置成与常规存储器模块的电子部件热耦合的导热第一和第二部件。 第一和第二构件可以被弹性地偏离彼此偏离,使得当放置在相邻的存储器模块之间时,弹性偏置使得构件邻接相应的电子部件。 可以提供单独的楔形物或杠杆安装的楔形物,用于插入在构件之间以将它们彼此远离并且与邻近的存储器模块的相对表面上的电子部件邻接。 当抵靠相对的电子部件时,单个散热器件便于从两个相邻的存储器模块散热。

    Acoustic and thermal energy management system
    53.
    发明授权
    Acoustic and thermal energy management system 有权
    声热管理系统

    公开(公告)号:US07116555B2

    公开(公告)日:2006-10-03

    申请号:US10747569

    申请日:2003-12-29

    IPC分类号: H05K7/20

    摘要: An acoustic and thermal energy management system and method comprising a microprocessor and a thermal mass positioned at a distance from the microprocessor, the microprocessor and thermal mass being thermally connected to the microprocessor in a manner to transfer thermal energy from the microprocessor to the thermal mass. The acoustic and thermal energy management system transferring heat from the microprocessor to a thermal mass for dissipation reducing the level of heat at the microprocessor, thereby limiting the operation of or the operation level of a fan.

    摘要翻译: 声学和热能管理系统和方法包括微处理器和与微处理器一定距离的热质量传感器,微处理器和热质量以将热能从微处理器转移到热质量的方式热连接到微处理器。 声学和热能管理系统将热量从微处理器传递到热质量,以消除微处理器处的热量,从而限制风扇的运行或操作水平。

    Quick-release mechanism for hard disk drive
    54.
    发明授权
    Quick-release mechanism for hard disk drive 失效
    硬盘驱动器的快速释放机制

    公开(公告)号:US06227516B1

    公开(公告)日:2001-05-08

    申请号:US09362428

    申请日:1999-07-28

    IPC分类号: H05K712

    CPC分类号: G11B33/124 G11B25/043

    摘要: A mounting tray for a hard disk drive has a base, a front wall, and a pair of side walls. A pair of latching mechanisms are located in each side wall. Each latching mechanism has a slide and a spring-like fastener. The fasteners have an unlocked position where they are biased away from the tray, and a locked position where the slides capture them against the side walls. A tapered pin extends inward from each fastener. With the latching mechanisms in their unlocked positions, a drive is placed in the tray. The slides are then moved to the locked positions such that the pins on the fasteners engage holes in the drive. The pins secure the drive from movement relative to the tray to facilitate hot plugging of the drive into a computer system.

    摘要翻译: 用于硬盘驱动器的安装盘具有基座,前壁和一对侧壁。 一对闭锁机构位于每个侧壁上。 每个锁定机构具有滑动件和弹簧状紧固件。 紧固件具有解锁位置,在该位置处,它们被偏压离开托盘,并且锁定位置,其中滑动件将它们抵靠侧壁捕获它们。 锥形销从每个紧固件向内延伸。 当锁定机构处于未锁定位置时,将驱动器放置在托盘中。 然后将滑块移动到锁定位置,使得紧固件上的销钉接合驱动器中的孔。 引脚固定驱动器相对于托盘移动,以便驱动器热插拔到计算机系统中。

    System to improve operation of a data center with heterogeneous computing clouds
    56.
    发明授权
    System to improve operation of a data center with heterogeneous computing clouds 有权
    系统改进了具有异构计算云的数据中心的运行

    公开(公告)号:US08856321B2

    公开(公告)日:2014-10-07

    申请号:US13077578

    申请日:2011-03-31

    IPC分类号: G06F15/16 G06F15/173 G06F9/50

    CPC分类号: G06F9/5094 Y02D10/22

    摘要: A system to improve operation of a data center with heterogeneous computing clouds may include monitoring components to track data center climate controls and individual heterogeneous computing clouds' operating parameters within the data center. The system may also include a controller that regulates the individual heterogeneous computing clouds and data center climate controls based upon data generated by the monitoring components to improve the operating performance of the individual heterogeneous computing clouds as well as the operating performance of the data center. The system may further include spilling computing clouds to receive excess workload of an individual heterogeneous computing cloud without violating individual heterogeneous computing clouds contracts.

    摘要翻译: 改进具有异构计算云的数据中心运行的系统可能包括监视组件以跟踪数据中心气候控制和数据中心内的个别异构计算云运行参数。 该系统还可以包括控制器,其基于由监视组件生成的数据来调节各个异构计算云和数据中心气候控制,以改善各个异构计算云的操作性能以及数据中心的操作性能。 该系统可以进一步包括溢出计算云以接收单个异构计算云的额外的工作量,而不违反个别的异构计算云合同。

    Fan speed control of rack devices where sum of device airflows is greater than maximum airflow of rack
    57.
    发明授权
    Fan speed control of rack devices where sum of device airflows is greater than maximum airflow of rack 有权
    机架设备的风扇速度控制,其中设备气流的总和大于机架的最大气流

    公开(公告)号:US08805590B2

    公开(公告)日:2014-08-12

    申请号:US12647357

    申请日:2009-12-24

    IPC分类号: G05D7/06

    摘要: Computing devices have fan speeds governing airflows through the computing devices. The rack has a maximum airflow associated with a cooling component for the rack. The computing devices transmit their current airflows. A sum of the current airflows is determined. Where the sum is greater than the maximum airflow, the fan speeds of one or more selected computing devices are decreased. The fan speeds of lower priority computing devices may be reduced before the fan speeds higher priority computing devices are reduced. Fan speed reduction may be achieved in a centralized manner, by employing a centralized management component, or in a decentralized manner, without employing a centralized management component.

    摘要翻译: 计算设备具有控制通过计算设备的气流的风扇速度。 机架具有与机架的冷却组件相关的最大气流。 计算设备传送其当前气流。 确定当前气流的总和。 在总和大于最大气流的情况下,减少一个或多个所选计算装置的风扇速度。 降低优先级较高的计算设备的风扇速度可能会在风扇转速较高的优先级计算设备减少之前被降低。 可以通过采用集中式管理部件或以分散的方式集中地实现风扇减速,而不采用集中式管理部件。

    Heatsink with flexible base and height-adjusted cooling fins
    59.
    发明授权
    Heatsink with flexible base and height-adjusted cooling fins 有权
    散热器采用柔性底座和高度调节的散热片

    公开(公告)号:US08567483B2

    公开(公告)日:2013-10-29

    申请号:US12613938

    申请日:2009-11-06

    IPC分类号: F28F7/00 F28D15/00 H05K7/20

    摘要: One embodiment provides a heatsink having a flexible base and height-adjusted cooling fins. The flexible base includes a single base plate, with cooling fins and heat pipes secured directly to an upper surface of the single base plate. The use of the single base plate allows the length of the cooling fins to be increased. The use of a single base plate also allows the base to flex when mounted at the outer region of the base plate to a circuit board using fasteners. The flexure of the base biases the heatsink against the heat-generating component. The flexure also displaces the outer cooling fins, and the length of the outer cooling fins is further increased to compensate for the anticipate displacement.

    摘要翻译: 一个实施例提供具有柔性基座和高度调节的散热片的散热器。 柔性基座包括单个基板,其中冷却翅片和热管直接固定在单个基板的上表面上。 使用单个底板允许冷却翅片的长度增加。 使用单个基板还允许基座在使用紧固件安装在基板的外部区域时弯曲到电路板。 基座的弯曲使散热器偏压发热部件。 该挠曲件还使外部冷却翅片移位,并且进一步增加外部冷却翅片的长度以补偿预期的位移。

    Fan speed control of rack devices where sum of device airflows is greater than maximum airflow of rack
    60.
    发明申请
    Fan speed control of rack devices where sum of device airflows is greater than maximum airflow of rack 有权
    机架设备的风扇速度控制,其中设备气流的总和大于机架的最大气流

    公开(公告)号:US20110160916A1

    公开(公告)日:2011-06-30

    申请号:US12647357

    申请日:2009-12-24

    IPC分类号: G05D7/06 G05D23/19

    摘要: Computing devices have fan speeds governing airflows through the computing devices. The rack has a maximum airflow associated with a cooling component for the rack. The computing devices transmit their current airflows. A sum of the current airflows is determined. Where the sum is greater than the maximum airflow, the fan speeds of one or more selected computing devices are decreased. The fan speeds of lower priority computing devices may be reduced before the fan speeds higher priority computing devices are reduced. Fan speed reduction may be achieved in a centralized manner, by employing a centralized management component, or in a decentralized manner, without employing a centralized management component.

    摘要翻译: 计算设备具有控制通过计算设备的气流的风扇速度。 机架具有与机架的冷却组件相关的最大气流。 计算设备传送其当前气流。 确定当前气流的总和。 在总和大于最大气流的情况下,减少一个或多个所选计算装置的风扇速度。 降低优先级较高的计算设备的风扇速度可能会在风扇转速较高的优先级计算设备减少之前被降低。 可以通过采用集中式管理部件或以分散的方式集中地实现风扇减速,而不采用集中式管理部件。