公开(公告)号：US08524614B2

公开(公告)日：2013-09-03

申请号：US12955203

申请日：2010-11-29

Applicant: Kuen-Ting Shiu ,  Dechao Guo ,  Shu-Jen Han ,  Edward W. Kiewra ,  Masaharu Kobayashi

Inventor： Kuen-Ting Shiu ,  Dechao Guo ,  Shu-Jen Han ,  Edward W. Kiewra ,  Masaharu Kobayashi

IPC: H01L21/31

CPC classification number: H01L29/0603 ,  H01L21/28158 ,  H01L21/28264 ,  H01L29/517 ,  H01L29/66522 ,  H01L29/78 ,  H01L29/7833

Abstract: The present disclosure reduces and, in some instances, eliminates the density of interface states in III-V compound semiconductor materials by providing a thin crystalline interlayer onto an upper surface of a single crystal III-V compound semiconductor material layer to protect the crystallinity of the single crystal III-V compound semiconductor material layer's surface atoms prior to further processing of the structure.

Abstract translation: 本公开通过在单晶III-V化合物半导体材料层的上表面上提供薄的晶体中间层来减少并且在一些情况下消除III-V族化合物半导体材料中的界面态的密度，以保护单晶III-V化合物半导体材料层的结晶度 单晶III-V化合物半导体材料层的表面原子在进一步处理结构之前。

公开(公告)号：US08513081B2

公开(公告)日：2013-08-20

申请号：US13272349

申请日：2011-10-13

Applicant: Dechao Guo ,  Shu-Jen Han ,  Keith Kwong Hon Wong ,  Jun Yuan

Inventor： Dechao Guo ,  Shu-Jen Han ,  Keith Kwong Hon Wong ,  Jun Yuan

IPC: H01L21/336

CPC classification number: H01L21/2822 ,  H01L21/26506 ,  H01L21/823412 ,  H01L21/823437 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/4966 ,  H01L29/517 ,  H01L29/518 ,  H01L29/66545

Abstract: A method includes providing a wafer that has a semiconductor layer having an insulator layer disposed on the semiconductor layer. The insulator layer has openings made therein to expose a surface of the semiconductor layer, where each opening corresponds to a location of what will become a transistor channel in the semiconductor layer disposed beneath a gate stack. The method further includes depositing a high dielectric constant gate insulator layer so as to cover the exposed surface of the semiconductor layer and sidewalls of the insulator layer; depositing a gate metal layer that overlies the high dielectric constant gate insulator layer; and implanting Carbon through the gate metal layer and the underlying high dielectric constant gate insulator layer so as to form in an upper portion of the semiconductor layer a Carbon-implanted region having a concentration of Carbon selected to establish a voltage threshold of the transistor.

Abstract translation: 一种方法包括提供具有设置在半导体层上的绝缘体层的半导体层的晶片。 绝缘体层具有在其中形成的开口以暴露半导体层的表面，其中每个开口对应于在栅叠层下方的半导体层中将成为晶体管沟道的位置。 该方法还包括沉积高介电常数栅极绝缘体层以覆盖半导体层的暴露表面和绝缘体层的侧壁; 沉积覆盖在高介电常数栅极绝缘体层上的栅极金属层; 以及通过栅极金属层和下面的高介电常数栅极绝缘体层注入碳以便在半导体层的上部形成具有选定的碳浓度的碳注入区域，以建立晶体管的电压阈值。

公开(公告)号：US08455365B2

公开(公告)日：2013-06-04

申请号：US13111615

申请日：2011-05-19

Applicant: Dechao Guo ,  Shu-Jen Han ,  Keith Kwong Hon Wong ,  Jun Yuan

Inventor： Dechao Guo ,  Shu-Jen Han ,  Keith Kwong Hon Wong ,  Jun Yuan

IPC: H01L21/302 ,  H01L21/461

CPC classification number: H01L29/66515 ,  B82Y10/00 ,  B82Y40/00 ,  H01L29/41733 ,  H01L29/42384 ,  H01L29/66742 ,  H01L29/78684 ,  H01L51/0045 ,  H01L51/0048 ,  H01L51/0525 ,  H01L51/0545

Abstract: A device and method for device fabrication includes forming a buried gate electrode in a dielectric substrate and patterning a stack that includes a high dielectric constant layer, a carbon-based semi-conductive layer and a protection layer over the buried gate electrode. An isolation dielectric layer formed over the stack is opened to define recesses in regions adjacent to the stack. The recesses are etched to form cavities and remove a portion of the high dielectric constant layer to expose the carbon-based semi-conductive layer on opposite sides of the buried gate electrode. A conductive material is deposited in the cavities to form self-aligned source and drain regions.

Abstract translation: 一种用于器件制造的器件和方法包括在电介质衬底中形成掩埋栅电极，并且在掩埋栅电极之上构图包括高介电常数层，碳基半导电层和保护层的堆叠。 在叠层上形成的绝缘介电层被打开以在与堆叠相邻的区域中限定凹陷。 蚀刻凹槽以形成空腔并去除高介电常数层的一部分以暴露在掩埋栅电极的相对侧上的碳基半导体层。 导电材料沉积在空腔中以形成自对准的源区和漏区。

公开(公告)号：US20130130446A1

公开(公告)日：2013-05-23

申请号：US13605238

申请日：2012-09-06

Applicant: Qing Cao ,  Dechao Guo ,  Shu-Jen Han ,  Yu Lu ,  Keith Kwong Hon Wong

Inventor： Qing Cao ,  Dechao Guo ,  Shu-Jen Han ,  Yu Lu ,  Keith Kwong Hon Wong

IPC: H01L21/336 ,  B82Y40/00

CPC classification number: H01L51/057 ,  B82Y10/00 ,  B82Y30/00 ,  H01L29/125 ,  H01L29/66439 ,  H01L29/775 ,  H01L29/7827 ,  H01L51/0045 ,  H01L51/0048 ,  Y10S977/742 ,  Y10S977/842 ,  Y10S977/938

Abstract: A fin structure including a vertical alternating stack of a first isoelectric point material layer having a first isoelectric point and a second isoelectric material layer having a second isoelectric point less than the first isoelectric point is formed. The first and second isoelectric point material layers become oppositely charged in a solution with a pH between the first and second isoelectric points. Negative electrical charges are imparted onto carbon nanotubes by an anionic surfactant to the solution. The electrostatic attraction causes the carbon nanotubes to be selectively attached to the surfaces of the first isoelectric point material layer. Carbon nanotubes are attached to the first isoelectric point material layer in self-alignment along horizontal lengthwise directions of the fin structure. A transistor can be formed, which employs a plurality of vertically aligned horizontal carbon nanotubes as the channel.

Abstract translation: 形成包括具有第一等电点的第一等电点材料层和具有小于第一等电点的第二等电点的第二等电子材料层的垂直交替堆叠的鳍结构。 第一和第二等电点材料层在具有第一和第二等电点之间的pH的溶液中相反地充电。 通过阴离子表面活性剂将负电荷赋予碳纳米管。 静电引力使得碳纳米管选择性地附着在第一等电点材料层的表面上。 碳纳米管沿翅片结构的水平长度方向自对准地附接到第一等电点材料层。 可以形成晶体管，其采用多个垂直排列的水平碳纳米管作为沟道。

公开(公告)号：US20130093000A1

公开(公告)日：2013-04-18

申请号：US13271812

申请日：2011-10-12

Applicant: Dechao Guo ,  Shu-Jen Han ,  Keith Kwong Hon Wong ,  Jun Yuan

Inventor： Dechao Guo ,  Shu-Jen Han ,  Keith Kwong Hon Wong ,  Jun Yuan

IPC: H01L29/78 ,  H01L21/336

CPC classification number: H01L29/78 ,  H01L21/823487 ,  H01L21/823885 ,  H01L29/4983 ,  H01L29/66666 ,  H01L29/7827

Abstract: A transistor structure is formed to include a substrate and, overlying the substrate, a source; a drain; and a channel disposed vertically between the source and the drain. The channel is coupled to a gate conductor that surrounds the channel via a layer of gate dielectric material that surrounds the channel. The gate conductor is composed of a first electrically conductive material having a first work function that surrounds a first portion of a length of the channel and a second electrically conductive material having a second work function that surrounds a second portion of the length of the channel. A method to fabricate the transistor structure is also disclosed. The transistor structure can be characterized as being a vertical field effect transistor having an asymmetric gate.

Abstract translation: 晶体管结构被形成为包括衬底和覆盖衬底的源极; 排水 以及垂直设置在源极和漏极之间的通道。 通道耦合到栅极导体，该栅极导体通过围绕该沟道的栅极电介质材料层围绕该沟道。 栅极导体由具有围绕通道长度的第一部分的第一功函数的第一导电材料和具有围绕通道长度的第二部分的第二功函数的第二导电材料组成。 还公开了制造晶体管结构的方法。 晶体管结构可以表征为具有非对称栅极的垂直场效应晶体管。

公开(公告)号：US08404539B2

公开(公告)日：2013-03-26

申请号：US12832224

申请日：2010-07-08

Applicant: Josephine B. Chang ,  Dechao Guo ,  Shu-Jen Han ,  Chung-Hsun Lin

Inventor： Josephine B. Chang ,  Dechao Guo ,  Shu-Jen Han ,  Chung-Hsun Lin

IPC: H01L21/8238

CPC classification number: H01L29/1606 ,  B82Y10/00 ,  H01L29/165 ,  H01L29/41733 ,  H01L29/41766 ,  H01L29/41775 ,  H01L29/66431 ,  H01L29/66742 ,  H01L29/7781 ,  H01L29/78 ,  H01L29/78684 ,  H01L51/0048

Abstract: A method for forming a semiconductor device includes forming a carbon material on a substrate, forming a gate stack on the carbon material, removing a portion of the substrate to form at least one cavity defined by a portion of the carbon material and the substrate, and forming a conductive contact in the at least one cavity.

Abstract translation: 一种用于形成半导体器件的方法包括在基片上形成碳材料，在碳材料上形成栅叠层，去除基片的一部分以形成由碳材料和基片的一部分限定的至少一个空腔，以及 在所述至少一个空腔中形成导电接触。

公开(公告)号：US20130020658A1

公开(公告)日：2013-01-24

申请号：US13186597

申请日：2011-07-20

Applicant: Dechao Guo ,  Shu-Jen Han ,  Keith Kwong Hon Wong ,  Jun Yuan

Inventor： Dechao Guo ,  Shu-Jen Han ,  Keith Kwong Hon Wong ,  Jun Yuan

IPC: H01L29/78 ,  H01L21/28

CPC classification number: H01L29/42364 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823842 ,  H01L29/165 ,  H01L29/41775 ,  H01L29/4958 ,  H01L29/4966 ,  H01L29/513 ,  H01L29/517 ,  H01L29/665 ,  H01L29/66545 ,  H01L29/6659 ,  H01L29/66636 ,  H01L29/7833 ,  H01L29/7843 ,  H01L29/7848

Abstract: In a replacement gate scheme, a continuous material layer is deposited on a bottom surface and a sidewall surface in a gate cavity. A vertical portion of the continuous material layer is removed to form a gate component of which a vertical portion does not extend to a top of the gate cavity. The gate component can be employed as a gate dielectric or a work function material portion to form a gate structure that enhances performance of a replacement gate field effect transistor.

Abstract translation: 在替代栅极方案中，连续材料层沉积在栅极腔中的底表面和侧壁表面上。 去除连续材料层的垂直部分以形成垂直部分不延伸到栅极腔的顶部的栅极部件。 栅极元件可以用作栅极电介质或功函数材料部分，以形成增强替代栅极场效应晶体管性能的栅极结构。

公开(公告)号：US20130001519A1

公开(公告)日：2013-01-03

申请号：US13613198

申请日：2012-09-13

Applicant: Zhihong Chen ,  Aaron Daniel Franklin ,  Shu-Jen Han

Inventor： Zhihong Chen ,  Aaron Daniel Franklin ,  Shu-Jen Han

IPC: H01L29/66

CPC classification number: H01L29/66045 ,  H01L21/02178 ,  H01L21/02181 ,  H01L21/02527 ,  H01L21/044 ,  H01L29/1606 ,  H01L29/42376 ,  H01L29/42384 ,  H01L29/4908 ,  H01L29/4916 ,  H01L29/517 ,  H01L29/66015 ,  H01L29/66742 ,  H01L29/78645 ,  H01L29/78648 ,  H01L29/78684

Abstract: An electronic device comprises an insulator, a local first gate embedded in the insulator with a top surface of the first gate being substantially coplanar with a surface of the insulator, a first dielectric layer formed over the first gate and insulator, and a channel. The channel comprises a bilayer graphene layer formed on the first dielectric layer. The first dielectric layer provides a substantially flat surface on which the channel is formed. A second dielectric layer formed over the bilayer graphene layer and a local second gate formed over the second dielectric layer. Each of the local first and second gates is capacitively coupled to the channel of the bilayer graphene layer. The local first and second gates form a first pair of gates to locally control a first portion of the bilayer graphene layer.

公开(公告)号：US20120326236A1

公开(公告)日：2012-12-27

申请号：US13604340

申请日：2012-09-05

Applicant: Josephine B. Chang ,  Dechao Guo ,  Shu-Jen Han ,  Chung-Hsun Lin

Inventor： Josephine B. Chang ,  Dechao Guo ,  Shu-Jen Han ,  Chung-Hsun Lin

IPC: H01L29/78

CPC classification number: H01L29/785 ,  H01L29/66795 ,  H01L2029/7858

Abstract: A multi-gate transistor having a plurality of sidewall contacts and a fabrication method that includes forming a semiconductor fin on a semiconductor substrate and etching a trench within the semiconductor fin, depositing an oxide material within the etched trench, and etching the oxide material to form a dummy oxide layer along exposed walls within the etched trench; and forming a spacer dielectric layer along vertical sidewalls of the dummy oxide layer. The method further includes removing exposed dummy oxide layer in a channel region in the semiconductor fin and beneath the spacer dielectric layer, forming a high-k material liner along sidewalls of the channel region in the semiconductor fin, forming a metal gate stack within the etched trench, and forming a plurality of sidewall contacts within the semiconductor fin along adjacent sidewalls of the dummy oxide layer.

Abstract translation: 一种具有多个侧壁触点的多栅极晶体管及其制造方法，包括在半导体衬底上形成半导体鳍片并蚀刻半导体鳍片内的沟槽，在蚀刻沟槽内沉积氧化物材料，并蚀刻氧化物材料以形成 沿着蚀刻沟槽内的暴露壁的虚拟氧化物层; 以及沿所述虚拟氧化物层的垂直侧壁形成间隔电介质层。 该方法还包括去除半导体鳍片中的沟道区域中的暴露的虚拟氧化物层并且在间隔物电介质层下方形成沿着半导体鳍片中的沟道区域的侧壁形成高k材料衬垫，在蚀刻 沟槽，并且在半导体鳍片内沿虚拟氧化物层的相邻侧壁形成多个侧壁接触。

公开(公告)号：US20120295423A1

公开(公告)日：2012-11-22

申请号：US13557501

申请日：2012-07-25

Applicant: Dechao Guo ,  Shu-Jen Han ,  Chung-Hsun Lin ,  Ning Su

Inventor： Dechao Guo ,  Shu-Jen Han ,  Chung-Hsun Lin ,  Ning Su

IPC: H01L21/36

CPC classification number: H01L27/0688 ,  H01L29/1606 ,  Y10S977/755

Abstract: A three-dimensional (3D) integrated circuit (IC) structure includes a first layer of graphene formed over a substrate; a first level of one or more active devices formed using the first layer of graphene; an insulating layer formed over the first level of one or more active devices; a second layer of graphene formed over the insulating layer; and a second level of one or more active devices formed using the second layer of graphene, the second level of one or more active devices electrically interconnected with the first level of one or more active devices.

Abstract translation: 三维（3D）集成电路（IC）结构包括在衬底上形成的第一层石墨烯; 使用第一层石墨烯形成的一个或多个有源器件的第一级; 绝缘层，形成在一个或多个有源器件的第一级上; 在所述绝缘层上形成的第二层石墨烯; 以及使用第二层石墨烯形成的一个或多个有源器件的第二电平，一个或多个有源器件的第二电平与一个或多个有源器件的第一电平电互连。