摘要:
A signal conversion circuit is provided for obtaining quantized pattern data indicating a variation of photoelectric signal amplitudes along photosensor arrays by a variable pulse width signal indicating the amplitude of the photoelectric signal from each photosensor. A difference detector detects differences in pulse width of the variable pulse width signals to be compared to determine the extent of the variation with a predetermined unit precision. A comparison device determines whether or not the difference in pulse width exceeds a selected number of difference units and the pattern data indicating the variation are supplied only if the difference exceeds the selected number. Consequently, even if there are errors in the circuit elements constituting the signal conversion circuit, correct pattern data free from influence of such errors can be supplied. If the influence of an error on the circuit elements is to be compensated, a device is provided to determine the precision of the pattern data based on the purpose of the conversion circuit. Therefore, the precision of the pattern data can be kept at the highest possible level. The pulse width difference detector and the comparison device each operate as a quantizing system to convert the variable pulse width signal into a quantized signal at the same time so that it is not necessary to supplement the circuit with a circuit element for initiating operation.
摘要:
A semiconductor device includes an IGBT, a constant voltage circuit, and protection Zener diodes. The IGBT makes/breaks a low-voltage current flowing in a primary coil. The constant voltage circuit and the protection Zener diodes are provided between an external gate terminal and an external collector terminal. The constant voltage circuit supplies a constant gate voltage to the IGBT to thereby set a saturation current value of the IGBT to a predetermined limiting current value. The IGBT has the saturation current value in a limiting current value range of the semiconductor device.
摘要:
An insulated gate silicon carbide semiconductor device is provided having small on-resistance in a structure obtained by combining the SIT and MOSFET structures having normally-off operation. The device includes an n− semiconductor layer on an SiC n+ substrate, a p-type base region and highly doped p-region both buried in the layer, a trench from the semiconductor layer surface to the p-base region, an n+ first source region in the surface of a p-type base region at the bottom of the trench, a p-type channel region in the surface of the sidewall of the trench, one end of which contacts the first source region, a gate electrode contacting the trench-side surface of the channel region via a gate insulating film, and a source electrode contacting the trench-side surface of the gate electrode via an interlayer insulating film and contacting the exposed first source region and p-base region at the bottom of the trench.
摘要翻译:提供了一种绝缘栅极碳化硅半导体器件,其通过组合具有常关断操作的SIT和MOSFET结构而获得的结构中具有小的导通电阻。 该器件包括在SiC n +衬底上的n-半导体层,两个埋在该层中的p型基极区域和高掺杂p区域,从半导体层表面到p基极区域的沟槽,n +第一源极 在沟槽底部的p型基极区域的表面中的沟槽区域,沟槽侧壁的表面中的一个p型沟道区域,其一端接触第一源极区域,与栅极接触的栅电极 经栅极绝缘膜形成沟道区的侧表面,以及源电极,经由层间绝缘膜与栅电极的沟槽侧表面接触,并与沟槽底部的暴露的第一源区和p基区接触 。
摘要:
A level shift circuit and a semiconductor device are configured to prevent failure and malfunction even when an excessive negative voltage or ESD surge are applied to a high-voltage power supply terminal. The level shift circuit includes a level shift resistor, a current-limiting resistor connected in series to the level shift resistor, and an n-channel MOSFET, with its drain connected to the current-limiting resistor. An output of the level-up circuit is obtained from the positioned between the level shift resistor and the current-limiting resistor. By providing the current-limiting resistor, the current that flows due to an excessive negative voltage or ESD surge is suppressed to prevent the level shift circuit from failing or malfunctioning.
摘要:
A micro-transformer manufacturing method is provided, which can improve throughput, prevent a crack from entering an insulating film between coils, and manufacture the micro-transformer without using a mask material having a high selection ratio. An insulating film is deposited on the whole face of a semiconductor substrate having an impurity-diffused region. This insulating film is partially removed to form a first opening and a second opening. A primary coil is formed such that a center pad contacts the impurity-diffused region through the first opening. A thin insulating film is deposited on the primary coil. An insulator material having a secondary coil formed thereon is adhered onto the insulating film on the primary coil by adhesive tape. The insulator material is sized to not cover both a pad, connected with the center pad of the primary coil through the impurity-diffused region, and an outer-end pad of the primary coil.
摘要:
In an operational control device 20 of a power supply system for supplying electric power from an electric power equipment 4 to a plurality of power consumption systems 8A to 8F, a power consumption pattern of each of the power consumption systems is stored, and a combined expected power consumption pattern 40 is obtained by adding together power consumption patterns of operating power consumption systems. Next, a combined assumed power consumption pattern is obtained by adding a power consumption pattern, obtained based on a temporary operational start time, of a power consumption system which has made the request for starting operation to the combined expected power consumption pattern. Subsequently, the combined assumed power consumption pattern and a preset allowable power 42 of the power supply equipment are compared to each other, and the temporary operational start time of the power consumption pattern is delayed along the axis of time until each of the power values in the combined assumed power consumption pattern is no longer above the preset allowable power. Thereafter, an expected operational start time is decided based on the temporary operational start time at which all power values represented in the combined assumed power consumption pattern are smaller than the preset allowable power, and an operational permission signal is outputted when the current time reaches the decided expected operational start time.
摘要:
An IGBT having a trench gate structure is disclosed which generates decreased noise at switching and displays superiority in saturation voltage to turn-off loss characteristics (trade-off characteristics). In a part of a region on an emitter side surface interposed between trench gates, a sub well region is provided, which is connected to an emitter electrode through diodes. When the IGBT is in a turned-on state, the diodes are brought into a non-conduction state to isolate the sub well region from the emitter electrode, by which carriers are accumulated. When the IGBT is in a turned-off state, the diodes are brought into a conduction state to electrically connect the sub well region to the emitter electrode, by which carriers are discharged at a high speed. In an early stage of turning-on of the IGBT, capacitance of a portion of the gate facing the sub well region is converted to gate-emitter capacitance to thereby reduce gate-collector capacitance, by which electromagnetic noise at switching is reduced.
摘要:
In a method for forming a silicon carbide vertical FET, a first mask and a second mask that overlaps the first mask are used so that a first conductivity type impurity region is defined by one end of a certain portion of the first mask, and that portion of the first mask and the second mask are then removed so that a second conductivity type impurity region is defined by another portion of the first mask. Thus, the first conductivity type impurity region and the second conductivity type impurity region are positioned relative to each other, with respect to the first mask. If a mask including a tapered end portion is used, and ion implantation is conducted with different accelerating-field voltages, the first conductivity type region and the second conductivity type region may be formed by self-alignment, using only one mask. By controlling the impurity concentration of the channel region, the threshold voltage can be controlled, and a normally-off type FET can be provided.
摘要:
An insulated-gate controlled semiconductor device includes a main circuit that is controlled by an insulated gate having a gate resistor, an overload detector having the insulated gate for use in common with the main circuit, the overload detector being of the same construction as that of the main circuit, a current detector for detecting current passing through the overload detector, and a field effect transistor having a gate which responds to the voltage drop across the current detector. The main circuit is protected by lowering the voltage applied to the insulated gate through the gate resistor and through the low on-resistance of the field effect transistor while the field effect transistor is held on.
摘要:
A silicon carbide trench MOSFET is provided that includes a first conductivity type semiconductor substrate made of silicon carbide. A first conductivity type drift layer and a second conductivity type base layer, both made of silicon carbide, are sequentially formed by epitaxial growth on the semiconductor substrate. The first conductivity type drift layer has a lower impurity concentration than the semiconductor substrate. A first conductivity type source region is formed in a part of a surface layer of the second conductivity type base layer. A gate electrode is received through an insulating film, in a first trench extending from a surface of the first conductivity type source region to reach the first conductivity type drift layer. A Schottky electrode disposed on an inner surface of a second trench having a greater depth than the first trench.