公开(公告)号：US20090037016A1

公开(公告)日：2009-02-05

申请号：US11830349

申请日：2007-07-30

申请人： Timothy J. Chainer ,  Peter A. Gruber ,  Dennis G. Manzer

发明人： Timothy J. Chainer ,  Peter A. Gruber ,  Dennis G. Manzer

IPC分类号： G06F19/00

CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L24/742 ,  H01L2224/11334 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00

摘要： An apparatus for placing solder bumps on a mold plate includes: a solder fill head configured for dispensing molten solder onto the mold plate, the solder fill head also configured for relative movement over the mold plate; and a control mechanism configured for controlling positions of the solder fill head relative to the mold plate. The control mechanism includes: a control input signal containing data about an ideal positioning of the solder fill head; a plurality of sensors positioned on the solder fill head, the sensors configured for providing data about a gap between the solder fill head and the mold plate; a position controller configured for receiving the gap data and comparing the gap data with the control input signal, wherein said position controller provides an inequality signal if the gap data and the control input signal are not equal; an amplifier configured for receiving the inequality signal and amplifying it; and an actuator configured for receiving the amplified inequality signal and controlling movement of the solder fill head in response to the inequality signal received. The control mechanism may be a servo control mechanism. The sensors may be gap sensors.

摘要翻译： 用于将焊料凸块放置在模板上的装置包括：焊料填充头，其被配置用于将熔融焊料分配到模板上，焊料填充头还构造成用于相对于模具板上的移动; 以及控制机构，被配置为控制焊料填充头相对于模板的位置。 控制机构包括：控制输入信号，其包含关于焊料填充头的理想定位的数据; 定位在焊料填充头上的多个传感器，所述传感器被配置为提供关于焊料填充头和模板之间的间隙的数据; 位置控制器，被配置为接收所述间隙数据并将所述间隙数据与所述控制输入信号进行比较，其中如果所述间隙数据和所述控制输入信号不相等，则所述位置控制器提供不等式信号; 放大器，被配置为接收不等式信号并对其进行放大; 以及致动器，被配置为接收放大的不等式信号，并响应于所接收的不等式信号控制焊料填充头的移动。 控制机构可以是伺服控制机构。 传感器可以是间隙传感器。

公开(公告)号：US20080284018A1

公开(公告)日：2008-11-20

申请号：US12119805

申请日：2008-05-13

申请人： Timothy J. Chainer

发明人： Timothy J. Chainer

IPC分类号： H01L29/40

CPC分类号： H01L21/486 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401

摘要： An electronic device includes: at least one electronic chip comprising a first coefficient of thermal expansion (CTE); and a carrier including a top surface connected to the bottom surface of the chip by solder bumps. The carrier further includes a second CTE that approximately matches the first CTE, and a plurality of through vias from the bottom surface of the carrier to the top surface of the carrier layer. Each through via includes a collar exposed at the top surface of the carrier, a pad exposed at the bottom surface of the carrier, and a post disposed between the collar and the pad. The post extends thorough a volume of space.

摘要翻译： 电子设备包括：包括第一热膨胀系数（CTE）的至少一个电子芯片; 以及载体，其包括通过焊料凸块连接到芯片的底表面的顶表面。 载体还包括与载体层的顶表面大致匹配的第一CTE的第二CTE和从载体的底表面到多个通孔。 每个通孔包括暴露在载体的顶表面处的套环，暴露在载体的底表面处的垫，以及设置在套环和衬垫之间的柱。 这篇文章扩展了一大堆空间。

公开(公告)号：US06611395B1

公开(公告)日：2003-08-26

申请号：US09432950

申请日：1999-11-03

申请人： Timothy J. Chainer ,  Edward J. Yarmchuk ,  Mark D. Schultz ,  Bucknell C. Webb

发明人： Timothy J. Chainer ,  Edward J. Yarmchuk ,  Mark D. Schultz ,  Bucknell C. Webb

IPC分类号： G11B2102

CPC分类号： G11B5/59633

摘要： A method for writing tracks on a rotating disk media data storage device comprising the steps of: receiving a set of component parameters; and adjusting track pitch for each of the tracks to be written in each disk according to the component parameters. According to another embodiment a disk drive includes at least one disk comprising a two or more of tracks in which the track pitch between each pair of adjacent tracks is set based on component parameters such as the recording head widths. According to another embodiment a servowriter is adapted to perform the method discussed above.

摘要翻译： 一种用于在旋转盘介质数据存储设备上写入轨迹的方法，包括以下步骤：接收一组分量参数; 以及根据组件参数调整要写入每个磁盘的每个磁道的磁道间距。 根据另一实施例，盘驱动器包括至少一个盘，其包括两个或更多个轨道，其中基于诸如记录头宽度的分量参数设置每对相邻轨道之间的轨道间距。 根据另一实施例，伺服驱动器适于执行上述方法。

公开(公告)号：US5581420A

公开(公告)日：1996-12-03

申请号：US317193

申请日：1994-10-03

申请人： Timothy J. Chainer ,  Wayne J. Sohn ,  Edward J. Yarmchuk

发明人： Timothy J. Chainer ,  Wayne J. Sohn ,  Edward J. Yarmchuk

IPC分类号： G11B5/55 ,  G11B5/596 ,  G11B20/16 ,  G11B21/08 ,  G11B21/10 ,  G11B27/30

CPC分类号： G11B27/30 ,  G11B20/16 ,  G11B21/083 ,  G11B21/10 ,  G11B21/106 ,  G11B27/3018 ,  G11B5/5534 ,  G11B5/59616 ,  G11B5/59644 ,  G11B5/59633

摘要： A technique for writing a servo-pattern on a storage medium located in a recording device having an internal recording head. A timing pattern is generated on the storage medium with the internal recording head and a radial positioning value is determined in order to radially position the internal recording head. The servo-pattern is written using the internal recording head at locations determined by the timing pattern and the radial positioning value.

摘要翻译： 一种在位于具有内部记录头的记录装置中的存储介质上写入伺服图案的技术。 在具有内部记录头的存储介质上产生定时模式，并且确定径向定位值以便径向定位内部记录头。 使用内部记录头在由定时图案和径向定位值确定的位置处写入伺服图案。

公开(公告)号：US08805613B2

公开(公告)日：2014-08-12

申请号：US12613758

申请日：2009-11-06

申请人： Timothy J. Chainer ,  Nitendra Rajput ,  Bernice E. Rogowitz

发明人： Timothy J. Chainer ,  Nitendra Rajput ,  Bernice E. Rogowitz

IPC分类号： G01V3/00 ,  G08B1/08

CPC分类号： G01V3/00 ,  G01W1/00

摘要： Data pertaining to environmental information is acquired using sensors on a multiplicity of networked pervasive devices, and analyzed to determine occurrence of at least one environmental event. Such data can be obtained, for example, from an inventive wireless communications device including an antenna, transmit circuitry coupled to the antenna for transmission of radio frequency radiation therefrom, at least one environmental sensor configured to obtain environmental data, and a communications module coupled to the at least one environmental sensor and configured to cause transmission of a representation of the data via the antenna and the transmit circuitry.

摘要翻译： 关于环境信息的数据是使用多个网络普及设备上的传感器来获取的，并被分析以确定至少一个环境事件的发生。 这样的数据可以例如从包括天线的发明的无线通信设备获得，耦合到天线的发射电路用于从其发射射频辐射，至少一个被配置为获得环境数据的环境传感器，以及耦合到 所述至少一个环境传感器并且被配置为经由所述天线和所述发射电路来发送所述数据的表示。

公开(公告)号：US20110213995A1

公开(公告)日：2011-09-01

申请号：US13074445

申请日：2011-03-29

申请人： Timothy J. Chainer

发明人： Timothy J. Chainer

IPC分类号： G06F1/32

CPC分类号： G06F1/3203 ,  G06F9/30156 ,  G06F9/3017

摘要： A method is disclosed to operate a power advisor. The method includes, reading a first instruction set; reading a data bus; and reading register value(s) stored in at least one data register. This information is analyzed for energy usage purposes. If a set of instruction can provide the same result with a lower energy usage, the first instruction set is replaced with the lower power usage instruction set. An apparatus and computer program product are also disclosed.

摘要翻译： 公开了一种操作电力顾问的方法。 该方法包括：读取第一指令集; 读数据总线; 以及读取存储在至少一个数据寄存器中的寄存器值。 分析此信息的能源使用目的。 如果一组指令可以提供具有较低能量使用的相同结果，则第一指令集被较低功率使用指令集替换。 还公开了一种装置和计算机程序产品。

公开(公告)号：US20110094096A1

公开(公告)日：2011-04-28

申请号：US12983377

申请日：2011-01-03

申请人： Timothy J. Chainer

发明人： Timothy J. Chainer

IPC分类号： B23P21/00 ,  H05K13/04

CPC分类号： H01L23/40 ,  H01L23/4006 ,  H01L23/4093 ,  H01L2023/4062 ,  H01L2224/16 ,  H01L2224/73253 ,  Y10T29/53022 ,  Y10T29/5313

摘要： A structure for attaching a heat sink to an integrated circuit chip includes a servo control system and at least one voice coil motor for actuating the heat sink.

摘要翻译： 用于将散热器附接到集成电路芯片的结构包括伺服控制系统和用于致动散热器的至少一个音圈电机。

公开(公告)号：US07513410B2

公开(公告)日：2009-04-07

申请号：US11760813

申请日：2007-06-11

申请人： Glen N. Biggs ,  Timothy J. Chainer ,  John P. Karidis ,  Dennis G. Manzer ,  Christopher L. Tessler

发明人： Glen N. Biggs ,  Timothy J. Chainer ,  John P. Karidis ,  Dennis G. Manzer ,  Christopher L. Tessler

IPC分类号： B23K31/02 ,  B22D35/00

CPC分类号： B23K3/0623

摘要： An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head structure, wherein the C-shape is open at the leading edge thereof. Hereby, a prevalent leading edge gap is tightly controlled by means of pressurized air in order to form an air bearing. Downstream of this leading edge is the molten solder, which is contained within a very narrow gap height between the solder filler head and the mold. As the solder fills the pits or recesses which are formed in the mold surface, air will rush out or be displaced from the pits towards the air bearing and is then expelled, while the deposited solder remains in place.

摘要翻译： 用于注射成型焊料填充头的空气轴承间隙控制装置。 还提供了一种利用空气轴承装置为注射成型的焊料填充头提供间隙控制的方法。 提供了在焊料填充头结构的下部或分配区域处的C形环密封件，其中C形在其前缘处是敞开的。 因此，为了形成空气轴承，通过加压空气严格控制流行的前缘间隙。 该前沿的下游是熔融焊料，其被包含在焊料填充头和模具之间的非常窄的间隙高度内。 当焊料填充形成在模具表面中的凹坑或凹槽时，空气将从凹坑向空气轴承移出或移出，然后排出，同时沉积的焊料保持在适当的位置。

公开(公告)号：US20090039499A1

公开(公告)日：2009-02-12

申请号：US11834552

申请日：2007-08-06

申请人： Timothy J. Chainer

发明人： Timothy J. Chainer

IPC分类号： H05K7/20 ,  H01L21/00 ,  H01L23/10

CPC分类号： H01L23/3677 ,  H01L23/433 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/10253 ,  H01L2924/00

摘要： A heat dissipating structure includes: a heat spreader; and a plurality of compliant beams attached to the heat spreader. The beams are formed of a high-conductive material such that a maximum stress of each beam is less than a fatigue stress of the high-conductive material; said beams are placed at an angle relative to a chip surface such that the beams are able to exert bending compliance in response to x, y, and z forces exerted upon them. The structure also includes a thermal material interface for bonding said structure to the chip surface. Both the heat spreader and the compliant beams can be machined from a copper block. An alternative heat dissipating structure includes compliant beams soldered to the chip surface.

摘要翻译： 散热结构包括：散热器; 以及附接到散热器的多个柔性梁。 梁由高导电材料形成，使得每个梁的最大应力小于高导电材料的疲劳应力; 所述梁相对于切屑表面以一定角度放置，使得梁能够响应于施加在它们上的x，y和z力而施加弯曲柔量。 该结构还包括用于将所述结构粘合到芯片表面的热材料界面。 散热器和柔性梁都可以从铜块加工而成。 替代的散热结构包括焊接到芯片表面的柔性梁。

公开(公告)号：US20080036061A1

公开(公告)日：2008-02-14

申请号：US11502969

申请日：2006-08-11

申请人： Timothy J. Chainer

发明人： Timothy J. Chainer

IPC分类号： H01L23/02

CPC分类号： H01L21/486 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401

摘要： An electronic device includes: at least one electronic chip comprising a first coefficient of thermal expansion (CTE); and a carrier including a top side connected to the bottom side of the chip by solder bumps. The carrier further includes a second CTE that approximately matches the first CTE, and a plurality of through vias from the bottom side of the carrier to the top side of the carrier layer. Each through via comprising a collar exposed at the top surface of the carrier, a pad exposed at the bottom surface of the carrier, and a post disposed between the collar and the pad. The post extends thorough a volume of space.

摘要翻译： 电子设备包括：包括第一热膨胀系数（CTE）的至少一个电子芯片; 以及载体，其包括通过焊料凸块连接到芯片的底侧的顶侧。 载体还包括与第一CTE近似匹配的第二CTE和从载体的底侧到载体层的顶侧的多个通孔。 每个通孔包括暴露在载体的顶表面处的套环，暴露在载体的底表面处的垫，以及设置在套环和垫之间的柱。 这篇文章扩展了一大堆空间。