METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    55.
    发明申请
    METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 有权
    制造半导体集成电路器件的方法

    公开(公告)号:US20110021022A1

    公开(公告)日:2011-01-27

    申请号:US12896933

    申请日:2010-10-04

    IPC分类号: H01L21/768

    CPC分类号: H01L27/1104 H01L27/11

    摘要: In forming five trenches buried with an intermediate conductive layer for connecting transfer MISFETs and driving MISFETs with vertical MISFETs formed thereover, in which the second and third trenches, and the first, fourth, and fifth trenches are formed separately by twice etching using first and second photoresist films as a mask. Since all the trenches can be formed at a good accuracy even in a case where the shortest distance between the first trench and the second or third trench, and the shortest distance between the second or third trench and the fourth trench is smaller than the resolution limit for the exposure light, the distance between each of the five trenches arranged in one identical memory cell can be reduced to be smaller than resolution limit for the exposure light.

    摘要翻译: 在形成五个埋入中间导电层的沟槽中,用于连接转移MISFET和驱动MISFET与其上形成的垂直MISFET,其中第二和第三沟槽以及第一,第四和第五沟槽分别通过使用第一和第二 光刻胶膜作为掩模。 由于即使在第一沟槽和第二或第三沟槽之间的最短距离以及第二沟槽和第三沟槽与第四沟槽之间的最短距离小于分辨率极限的情况下,也可以以高精度形成所有沟槽 对于曝光光,布置在一个相同存储单元中的五个沟槽中的每一个之间的距离可以减小到小于曝光光的分辨率极限。

    METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    57.
    发明申请
    METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
    制造半导体集成电路器件的方法

    公开(公告)号:US20090275193A1

    公开(公告)日:2009-11-05

    申请号:US12435446

    申请日:2009-05-05

    IPC分类号: H01L21/768

    CPC分类号: H01L27/1104 H01L27/11

    摘要: In forming five trenches buried with an intermediate conductive layer for connecting transfer MISFETs and driving MISFETs with vertical MISFETs formed thereover, in which the second and third trenches, and the first, fourth, and fifth trenches are formed separately by twice etching using first and second photoresist films as a mask. Since all the trenches can be formed at a good accuracy even in a case where the shortest distance between the first trench and the second or third trench, and the shortest distance between the second or third trench and the fourth trench is smaller than the resolution limit for the exposure light, the distance between each of the five trenches arranged in one identical memory cell can be reduced to be smaller than resolution limit for the exposure light.

    摘要翻译: 在形成五个埋入中间导电层的沟槽中,用于连接转移MISFET和驱动MISFET与其上形成的垂直MISFET,其中第二和第三沟槽以及第一,第四和第五沟槽分别通过使用第一和第二 光刻胶膜作为掩模。 由于即使在第一沟槽和第二或第三沟槽之间的最短距离以及第二沟槽和第三沟槽与第四沟槽之间的最短距离小于分辨率极限的情况下,也可以以高精度形成所有沟槽 对于曝光光,布置在一个相同存储单元中的五个沟槽中的每一个之间的距离可以减小到小于曝光光的分辨率极限。

    Method of Manufacturing A Semiconductor Integrated Circuit Device
    59.
    发明申请
    Method of Manufacturing A Semiconductor Integrated Circuit Device 失效
    制造半导体集成电路器件的方法

    公开(公告)号:US20080268639A1

    公开(公告)日:2008-10-30

    申请号:US12146599

    申请日:2008-06-26

    IPC分类号: H01L21/768 H01L21/44

    CPC分类号: H01L27/1104 H01L27/11

    摘要: In forming five trenches buried with an intermediate conductive layer for connecting transfer MISFETs and driving MISFETs with vertical MISFETs formed thereover, in which the second and third trenches, and the first, fourth, and fifth trenches are formed separately by twice etching using first and second photoresist films as a mask. Since all the trenches can be formed at a good accuracy even in a case where the shortest distance between the first trench and the second or third trench, and the shortest distance between the second or third trench and the fourth trench is smaller than the resolution limit for the exposure light, the distance between each of the five trenches arranged in one identical memory cell can be reduced to be smaller than resolution limit for the exposure light.

    摘要翻译: 在形成五个埋入中间导电层的沟槽中,用于连接转移MISFET和驱动MISFET与其上形成的垂直MISFET,其中第二和第三沟槽以及第一,第四和第五沟槽分别通过使用第一和第二 光刻胶膜作为掩模。 由于即使在第一沟槽和第二或第三沟槽之间的最短距离以及第二沟槽和第三沟槽与第四沟槽之间的最短距离小于分辨率极限的情况下,也可以以高精度形成所有沟槽 对于曝光光,布置在一个相同存储单元中的五个沟槽中的每一个之间的距离可以减小到小于曝光光的分辨率极限。

    Switching power supply device and electronic apparatus
    60.
    发明授权
    Switching power supply device and electronic apparatus 有权
    开关电源装置和电子设备

    公开(公告)号:US07433208B2

    公开(公告)日:2008-10-07

    申请号:US10564025

    申请日:2005-04-20

    IPC分类号: H02M3/335

    CPC分类号: H02M3/3381

    摘要: A switching power supply device includes a primary winding of a transformer that is connected in series to a first switching element, and a secondary winding is provided with a rectifier circuit and an output voltage control circuit arranged to detect an output voltage and feed it back to a control circuit. The control circuit is provided with an on-period control circuit arranged to turn off the first switching element in an on-state based on a feedback signal from the output voltage control circuit and an off-period control circuit arranged to control an off-period thereof by delaying turn-on of the first switching element based on the feedback signal.

    摘要翻译: 开关电源装置包括与第一开关元件串联连接的变压器的初级绕组,次级绕组设置有整流电路和输出电压控制电路,其布置成检测输出电压并将其馈送回 一个控制电路。 所述控制电路设置有接通时间控制电路,其布置成基于来自所述输出电压控制电路的反馈信号而将所述第一开关元件断开,并且将所述第一开关元件设置为断开时段控制电路, 其基于反馈信号延迟第一开关元件的导通。