公开(公告)号：US20150138671A1

公开(公告)日：2015-05-21

申请号：US14083088

申请日：2013-11-18

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Shigeki TANEMURA ,  Kazuki SATO ,  Tatsuya SHIMIZU

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Shigeki TANEMURA ,  Kazuki SATO ,  Tatsuya SHIMIZU

IPC分类号： G11B5/60

CPC分类号： G11B5/127 ,  G11B5/1278 ,  G11B5/31 ,  G11B5/3133 ,  G11B5/607 ,  G11B2005/0021

摘要： A magnetic head includes a main pole, an expansion member, and a heater. The main pole has an end face located in a medium facing surface. The expansion member is located farther from the medium facing surface than is the main pole and adjacent to the main pole in a direction perpendicular to the medium facing surface. The heater heats the expansion member. The expansion member has a linear expansion coefficient higher than that of the main pole.

摘要翻译： 磁头包括主极，膨胀构件和加热器。 主极具有位于面向介质的表面中的端面。 膨胀构件比垂直于与介质相对的表面垂直的方向远离中心面向表面远离主极并且与主极相邻。 加热器加热膨胀件。 膨胀构件的线膨胀系数高于主极的线膨胀系数。

公开(公告)号：US20140177099A1

公开(公告)日：2014-06-26

申请号：US13722025

申请日：2012-12-20

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Shigeki TANEMURA ,  Hironori ARAKI ,  Tatsuya SHIMIZU

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Shigeki TANEMURA ,  Hironori ARAKI ,  Tatsuya SHIMIZU

IPC分类号： G11B5/127

CPC分类号： G11B5/1278 ,  G11B5/3123 ,  G11B5/315

摘要： A magnetic head includes a coil, a main pole, a write shield, and a return path section. The return path section includes a yoke layer located on the front side in the direction of travel of a recording medium relative to the main pole, and a coupling part coupling the main pole and the yoke layer to each other. The coupling part includes a plurality of magnetic path portions that separate a magnetic flux into a plurality of fluxes and allow the fluxes to pass therethrough in parallel. The coil includes a plurality of winding portions disposed around the plurality of magnetic path portions, respectively.

摘要翻译： 磁头包括线圈，主极，写入屏蔽和返回路径部分。 返回路径部分包括位于记录介质相对于主极的行进方向的前侧上的轭层，以及将主极和轭层彼此耦合的联接部。 耦合部分包括将磁通分离成多个磁通并允许磁通平行通过的多个磁路部分。 线圈包括分别设置在多个磁路部分周围的多个绕组部分。

公开(公告)号：US20140175053A1

公开(公告)日：2014-06-26

申请号：US14189574

申请日：2014-02-25

申请人： Hironori ARAKI ,  Yoshitaka SASAKI ,  Hiroyuki ITO ,  Shigeki TANEMURA

发明人： Hironori ARAKI ,  Yoshitaka SASAKI ,  Hiroyuki ITO ,  Shigeki TANEMURA

IPC分类号： G11B5/31

CPC分类号： G11B5/31 ,  B44C1/22 ,  G02B6/1226 ,  G11B5/3163 ,  G11B7/22 ,  G11B2005/0021

摘要： A method of taper-etching a layer to be etched that is made of a dielectric material and has a top surface. The method includes the steps of: forming an etching mask with an opening on the top surface of the layer to be etched; and taper-etching a portion of the layer to be etched, the portion being exposed from the opening, by reactive ion etching so that a groove having two wall faces intersecting at a predetermined angle is formed in the layer to be etched. The step of taper-etching employs an etching gas containing a first gas contributing to the etching of the layer to be etched and a second gas contributing to the deposition of a sidewall protective film, and changes, during the step, the ratio of the flow rate of the second gas to the flow rate of the first gas so that the ratio increases.

摘要翻译： 对由电介质材料制成并具有顶表面的被蚀刻层进行锥形蚀刻的方法。 该方法包括以下步骤：在待蚀刻层的顶表面上形成具有开口的蚀刻掩模; 并且通过反应离子蚀刻使待蚀刻的层的一部分从开口暴露出来，使得在待蚀刻的层中形成具有与预定角度相交的两个壁面的凹槽。 锥蚀刻的步骤使用包含有助于蚀刻被蚀刻层的第一气体的蚀刻气体和有助于沉积侧壁保护膜的第二气体，并且在该步骤期间改变流动比 第二气体与第一气体的流量的比率使得该比率增加。

公开(公告)号：US20130105949A1

公开(公告)日：2013-05-02

申请号：US13286728

申请日：2011-11-01

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Shigeki TANEMURA ,  Kazuki SATO ,  Atsushi IIJIMA

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Shigeki TANEMURA ,  Kazuki SATO ,  Atsushi IIJIMA

IPC分类号： H01L23/48 ,  H01L21/78 ,  H01L21/762

CPC分类号： H01L25/0657 ,  H01L22/32 ,  H01L24/05 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L25/50 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06135 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24146 ,  H01L2224/244 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/83005 ,  H01L2224/83191 ,  H01L2224/9202 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions having a semiconductor device formed therein and insulated from each other, and a plurality of wiring electrodes connected to the semiconductor devices respectively formed in the plurality of device regions and extending from the device regions into the inside of the scribe-groove parts. The plurality of wiring electrodes are arranged in a partial arrangement pattern in which the wiring electrodes are arranged along only a part of four boundary sides, corresponding to boundaries between each of the device regions and the scribe-groove parts. Further, the plurality of wiring electrodes extend into the scribe-groove part from only one of two device regions adjacent to each other with the scribe-groove part therebetween.

摘要翻译： 在层叠半导体衬底中层叠多个半导体衬底。 每个半导体衬底具有沿着划线形成的多个划线槽部分。 此外，每个半导体衬底具有多个器件区域，其中形成有彼此绝缘的半导体器件，以及多个布线电极，其连接到分别形成在多个器件区域中并从器件区域延伸的半导体器件 进入划痕槽部分的内部。 多个布线电极以局部布置图案布置，其中布线电极仅沿着四个边界侧的一部分布置，对应于每个装置区域和划线槽部分之间的边界。 此外，多个布线电极仅从彼此相邻的两个器件区域中的一个延伸到划线槽部分中，其间具有划线槽部分。

公开(公告)号：US20130068722A1

公开(公告)日：2013-03-21

申请号：US13235856

申请日：2011-09-19

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Shigeki TANEMURA ,  Hironori ARAKI ,  Kazuki SATO ,  Kazumasa YASUDA

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Shigeki TANEMURA ,  Hironori ARAKI ,  Kazuki SATO ,  Kazumasa YASUDA

IPC分类号： C23F1/02 ,  B05D3/00 ,  B05D3/10 ,  B05D5/06

CPC分类号： G11B5/314 ,  G11B5/3163 ,  G11B5/6088 ,  G11B2005/0021

摘要： A method of manufacturing the plasmon generator includes the steps of: forming a base part made of a dielectric material; forming a metal film that is to later become the plasmon generator; and forming a filler layer made of a dielectric material. The base part includes a base surface and a protruding part that protrudes from the base surface. The protruding part has a top surface that is different in level from the base surface, and a first sidewall connecting the top surface of the protruding part to the base surface. The metal film includes an adhesion part adhering to the first sidewall. The filler layer has a second sidewall disposed such that the adhesion part is interposed between the first sidewall and the second sidewall.

摘要翻译： 制造等离子体发生器的方法包括以下步骤：形成由电介质材料制成的基部; 形成以后成为等离子体发生器的金属膜; 并形成由介电材料制成的填充层。 基部包括基部表面和从基部表面突出的突出部分。 突出部分具有与基部表面不同的顶表面，以及将突出部分的顶表面连接到基部表面的第一侧壁。 金属膜包括附着在第一侧壁上的粘合部。 填料层具有第二侧壁，该第二侧壁设置成使得粘合部分插入在第一侧壁和第二侧壁之间。

公开(公告)号：US20120314323A1

公开(公告)日：2012-12-13

申请号：US13156784

申请日：2011-06-09

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

IPC分类号： G11B5/17

CPC分类号： G11B5/3123 ,  G11B5/1278 ,  G11B5/315

摘要： A magnetic head includes a coil, a main pole, a gap part, a write shield, and a return path section. The return path section includes a yoke part and first and second coupling layers. The first coupling layer is connected to the write shield. The second coupling layer magnetically couples the first coupling layer to the yoke part, and has an end face facing toward a medium facing surface and located away from the medium facing surface. The coil includes a first coil element and a plurality of second coil elements that each extend to pass through a space defined by the main pole, the gap part, the write shield, and the return path section. The first coil element is disposed with the first coupling layer interposed between the medium facing surface and the first coil element. The second coil elements are disposed with the second coupling layer interposed between the medium facing surface and the second coil elements, and with the first coil element interposed between the main pole and the second coil elements. The second coil elements are aligned perpendicularly to the medium facing surface.

摘要翻译： 磁头包括线圈，主极，间隙部分，写入屏蔽和返回路径部分。 返回路径部分包括轭部分和第一和第二耦合层。 第一耦合层连接到写屏蔽。 第二耦合层将第一耦合层磁耦合到磁轭部分，并且具有面向介质面向表面并远离介质面向表面定位的端面。 线圈包括第一线圈元件和多个第二线圈元件，每个第二线圈元件各自延伸以穿过由主极，间隙部分，写入屏蔽和返回路径部分限定的空间。 第一线圈元件设置有第一耦合层介于介质面对表面和第一线圈元件之间。 第二线圈元件设置有第二耦合层介于介质相对表面和第二线圈元件之间，并且第一线圈元件插入在主极和第二线圈元件之间。 第二线圈元件垂直于面向介质的表面对准。

公开(公告)号：US20120147501A1

公开(公告)日：2012-06-14

申请号：US12964313

申请日：2010-12-09

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

IPC分类号： G11B5/10

CPC分类号： G11B5/3163 ,  G11B5/1278 ,  G11B5/3116 ,  G11B5/315

摘要： A magnetic head includes a shield, and first and second return path sections. The shield has an end face that is located in a medium facing surface to wrap around an end face of a main pole. The shield includes a bottom shield, two side shields, and a top shield. The first return path section includes a yoke layer, and first and second coupling layers that magnetically couple the bottom shield and the yoke layer to each other. The first coupling layer is magnetically connected to the bottom shield. The second coupling layer magnetically couples the first coupling layer to the yoke layer. No end faces of the second coupling layer are exposed in the medium facing surface. The second return path section magnetically couples the top shield and the main pole to each other.

摘要翻译： 磁头包括屏蔽，以及第一和第二返回路径部分。 屏蔽件具有位于面向介质的表面中以围绕主极端面的端面。 屏蔽包括底部屏蔽，两个侧面屏蔽和顶部屏蔽。 第一返回路径部分包括轭层，以及使底屏蔽和轭层彼此磁耦合的第一和第二耦合层。 第一耦合层磁性地连接到底部屏蔽。 第二耦合层将第一耦合层磁耦合到轭层。 没有第二耦合层的端面在面向介质的表面中露出。 第二返回路径部分将顶部屏蔽和主极彼此磁耦合。

公开(公告)号：US20120147499A1

公开(公告)日：2012-06-14

申请号：US12964345

申请日：2010-12-09

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Kazuki SATO ,  Atsushi IIJIMA

IPC分类号： G11B5/23

CPC分类号： G11B5/1278 ,  G11B5/3116

摘要： A magnetic head includes a shield, and first and second return path sections. The shield has an end face that is located in a medium facing surface to wrap around an end face of a main pole. The shield includes a bottom shield, two side shields, and a top shield. The first return path section is magnetically connected to the bottom shield and is greater than the bottom shield in length in a direction perpendicular to the medium facing surface. The second return path section magnetically couples the top shield and the main pole to each other. The coil includes a first portion that passes through a space defined by the main pole and the first return path section, and a second portion that passes through a space defined by the main pole and the second return path section.

摘要翻译： 磁头包括屏蔽，以及第一和第二返回路径部分。 屏蔽件具有位于面向介质的表面中以围绕主极端面的端面。 屏蔽包括底部屏蔽，两个侧面屏蔽和顶部屏蔽。 第一返回路径部分磁性地连接到底部屏蔽件并且在垂直于介质面向表面的方向上大于底部屏蔽件的长度。 第二返回路径部分将顶部屏蔽和主极彼此磁耦合。 线圈包括通过由主极和第一返回路径部分限定的空间的第一部分和穿过由主极和第二返回路径部分限定的空间的第二部分。

公开(公告)号：US20120142146A1

公开(公告)日：2012-06-07

申请号：US12960921

申请日：2010-12-06

申请人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Hiroshi IKEJIMA ,  Atsushi IIJIMA

发明人： Yoshitaka SASAKI ,  Hiroyuki ITO ,  Hiroshi IKEJIMA ,  Atsushi IIJIMA

IPC分类号： H01L21/78

CPC分类号： H01L25/50 ,  H01L23/49805 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/24137 ,  H01L2225/06513 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/07802 ,  H01L2924/18162 ,  H01L2924/00

摘要： A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes a plurality of stacked layer portions. A method of manufacturing the layered chip package includes the step of fabricating a layered substructure and the step of cutting the layered substructure. The layered substructure includes: a plurality of arrayed pre-separation main bodies; a plurality of accommodation parts disposed between two adjacent pre-separation main bodies; and a plurality of preliminary wires accommodated in the accommodation parts. The accommodation parts are formed in a photosensitive resin layer by photolithography. In the step of cutting the layered substructure, the plurality of pre-separation main bodies are separated from each other, and the wires are formed by the preliminary wires.

摘要翻译： 分层芯片封装包括主体和布线，其包括布置在主体的侧表面上的多根导线。 主体包括多个堆叠层部分。 制造层状芯片封装的方法包括制造层状子结构的步骤和切割层状子结构的步骤。 分层子结构包括：多个排列的预分离主体; 设置在两个相邻的预分离主体之间的多个容纳部件; 以及容纳在容纳部中的多条初级线。 通过光刻在光敏树脂层中形成住宿部。 在切割层状子结构的步骤中，多个预分离主体彼此分离，并且通过初步线形成电线。

公开(公告)号：US20120140358A1

公开(公告)日：2012-06-07

申请号：US12960954

申请日：2010-12-06

申请人： Yoshitaka SASAKI ,  Kazuki SATO ,  Hiroyuki ITO ,  Takehiro HORINAKA ,  Kazumasa YASUDA

发明人： Yoshitaka SASAKI ,  Kazuki SATO ,  Hiroyuki ITO ,  Takehiro HORINAKA ,  Kazumasa YASUDA

IPC分类号： G11B5/187

CPC分类号： G11B5/1278 ,  G11B5/3116 ,  G11B5/315 ,  G11B5/3163 ,  Y10T29/49032

摘要： A magnetic head includes a main magnetic pole, a shield having an end face located in a medium facing surface to wrap around an end face of the main magnetic pole, and a gap part provided between the main magnetic pole and the shield. The shield includes a bottom shield, two side shields, and a top shield. The gap part includes first and second gap layers. In a manufacturing method of the magnetic head, a mold is formed on the top surface of the bottom shield, the mold having a shape determined by photolithography and being intended to be removed later. Next, the two side shields are formed on the top surface of the bottom shield by performing plating without forming a seed layer. Next, the mold is removed and then the first gap layer, the main magnetic pole, the second gap layer, and the top shield are formed in succession.

摘要翻译： 磁头包括主磁极，屏蔽，其具有位于介质面向表面中的端面以围绕主磁极的端面，以及设置在主磁极和屏蔽之间的间隙部分。 屏蔽包括底部屏蔽，两个侧面屏蔽和顶部屏蔽。 间隙部分包括第一和第二间隙层。 在磁头的制造方法中，在底部屏蔽的顶面上形成有模具，该模具具有通过光刻法确定的形状并且稍后被去除。 接下来，通过进行电镀而不形成种子层，在底部屏蔽的顶表面上形成两个侧面屏蔽。 接下来，移除模具，然后依次形成第一间隙层，主磁极，第二间隙层和顶部屏蔽。