摘要:
A method of forming a planarized photoresist coating on a substrate having holes with different duty ratios is described. A first photoresist preferably comprised of a Novolac resin and a diazonaphthoquinone photoactive compound is coated on a substrate and baked at or slightly above its Tg so that it reflows and fills the holes. The photoresist is exposed without a mask at a dose that allows the developer to thin the photoresist to a recessed depth within the holes. After the photoresist is hardened with a 250° C. bake, a second photoresist is coated on the substrate to form a planarized film with a thickness variation of less than 50 Angstroms between low and high duty ratio hole regions. One application is where the second photoresist is used to form a trench pattern in a via first dual damascene method. Secondly, the method is useful in fabricating MIM capacitors.
摘要:
A resist film made of a chemically amplified positive resist is formed on a substrate. On the resist film, a light absorbing film containing a fluoropolymer which is alkali-soluble and has an aromatic ring is formed. Thereafter, first pattern exposure is performed by irradiating the resist film through the light absorbing film with first exposure light containing extreme ultraviolet light having passed through a first mask. Thereafter, second pattern exposure is performed by irradiating the resist film through the light absorbing film with exposure light having passed through a second mask. After the substrate is heated, the resist film is developed to remove the light absorbing film and form a resist pattern made of the resist film. An opening portion of the second mask is formed in a region corresponding to a non-opening portion of the first mask in which an opening portion is not formed.
摘要:
The invention relates to a method for producing a substrate having a resist layer in the form of a relief structure, which represents a diffraction structure. The resist layer at least in certain areas adjoins a conductive layer, which scatters the primary electrons and/or produces secondary electrons when the resist layer is exposed by means of an electron beam. With this method the material of the resist layer and the conductive layer and the exposure parameters are adjusted to each other such that the resist layer is also exposed outside the area impinged with the electron beam such that the flanks of the relief structure obtain an inclined form.
摘要:
There are disclosed a photosensitive element comprising a support film which comprises a biaxially oriented polyester film and a photosensitive resin composition layer formed on one surface of the polyester film;wherein a resin layer containing fine particles is formed on the opposite surface of the support film to which the photosensitive resin composition layer is formed, and said photosensitive resin composition comprises (A) a binder polymer having a carboxyl group, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule, and (C) a photopolymerization initiator, a photosensitive element roll, a process for the preparation of a resist pattern using the same, the resist pattern, a resist pattern-laminated substrate, a process for the preparation of a wiring pattern and the wiring pattern.
摘要:
A laser sensitive lithographic printing plate comprises an electrochemically grained, anodized, hydrophilically treated aluminum substrate with a reflection optical density of 0.30 or higher; a free radical polymerizable photosensitive layer; and a water soluble or dispersible overcoat. The photosensitive layer comprises a polymeric binder, a free radical polymerizable monomer, a free radical initiator, and a sensitizing dye. Such dark aluminum substrate in combination with the hydrophilic treatment allows both clean background and good printing durability. Such plate can be exposed with a suitable laser at lower dosage to cause hardening in the exposed areas. The exposed plate can be developed with a regular liquid developer or with ink and/or fountain solution.
摘要:
A production process of a chemical amplification-type resist composition, which is a process for producing a chemical amplification-type composition comprising: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer is changed under an action of an acid; (C) a basic compound; (D) a surfactant; and (E) a solvent, the production process comprising: preparing a solution containing the component (A); and mixing the solution containing the component (A) with the components (B) to (E), and a chemical amplification-type resist composition produced by the production process.
摘要:
A pretreatment composition for treating a substrate to be subjected to forming a relief pattern thereon by exposure to actinic radiation, the pretreatment composition comprising: (a) at least one compound having Structure VI wherein, V is selected from CH and N, Y is selected from O and NR3 wherein R3 is selected from H, CH3 and C2H5, R1 and R2 are each independently selected from H, a C1-C4 alkyl group, a C1-C4 alkoxy group, cyclopentyl and cyclohexyl, or alternatively, R1 and R2 can be fused to produce a substituted or unsubstituted benzene ring, with the proviso that the substituent is not an electron withdrawing group, (b) at least one organic solvent, and optionally, (c) at least one adhesion promoter; wherein the amount of the compound of Structure VI present in the composition effective to inhibit residue from forming when the photosensitive composition is coated on a substrate and the coated substrate is subsequently processed to form an image on the substrate. Processes for pretreatment of substrates and processes for forming relief images on pretreated substrates are disclosed.
摘要:
There are disclosed a photosensitive element comprising a support film which comprises a biaxially oriented polyester film and a photosensitive resin composition layer formed on one surface of the polyester film; wherein a resin layer containing fine particles is formed on the opposite surface of the support film to which the photosensitive resin composition layer is formed, and said photosensitive resin composition comprises (A) a binder polymer having a carboxyl group, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule, and (C) a photopolymerization initiator, a photosensitive element roll, a process for the preparation of a resist pattern using the same, the resist pattern, a resist pattern-laminated substrate, a process for the preparation of a wiring pattern and the wiring pattern.
摘要:
An improved digitally imageable relief printing element having an increased direct-cure imaging speed upon exposure to lasers and other digital sources of actinic radiation. The printing elements of the invention comprise a reflective layer beneath a photosensitive resin layer so that instead of being absorbed by the reflective layer, photons of actinic radiation are reflected back up into the photosensitive layer, thereby speeding up the curing rate of the printing element.
摘要:
A primary object of the present invention is to provide a process for the production of a pattern-forming body, the process enabling the formation of a highly precise pattern, requiring no post-exposure treatment and being free from a fear as to the deterioration of the pattern-forming body itself because no photocatalyst is contained in the produced pattern-forming body. In the present invention, the above problem can be solved by providing a process for the production of a pattern-forming body, the process comprising disposing a catalyst-containing layer-side substrate containing at least a photocatalyst-containing layer and a pattern-forming body substrate containing a characteristic-changeable layer which is changed in characteristics by the action of the photocatalyst in at least said photocatalyst-containing layer such that the photocatalyst-containing layer is in contact with the characteristic-changeable layer, followed by performing exposure to thereby change the characteristics of the exposed portion of the characteristic-changeable layer and thereafter dismounting the photocatalyst-containing layer-side substrate, thereby obtaining a pattern-forming body having a pattern which has been changed in characteristics on the characteristic-changeable layer.