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    Resist Composition
    53.
    发明申请
    Resist Composition 有权

    公开(公告)号：US20220179319A1

    公开(公告)日：2022-06-09

    申请号：US17384066

    申请日：2021-07-23

    申请人： The University of Manchester

    发明人： Scott Lewis ,  Richard Winpenny ,  Stephen Yeates ,  Antonio Fernandez

    IPC分类号： G03F7/20 ,  G03F7/004 ,  G03F7/031 ,  G03F7/038 ,  G03F7/16 ,  G03F7/32 ,  H01L21/027 ,  H01L21/56 ,  H01L21/768 ,  H01L21/78

    摘要： The present invention relates to resist compostions, in particular to photoresists that can be used in photolithography, especially in the fabrication of integrated circuits and derivative products. The resist compositions of the invention include an anti-scattering component which has a significant amount of empty space, and thus fewer scattering centers, such that radiation-scattering events are more limited during exposure. Such anti-scattering effects can lead to improved resolutions by reducing the usual proximity effects associated with lithographic techniques, allowing the production of smaller, higher resolution microchips. Furthermore, certain embodiments involve anti-scattering components which are directly linked to the resist components, which can improve the overall lithographic chemistry to provide benefits both in terms of resolution and resist sensitivity.

    RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN
    54.
    发明申请
    RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN 有权

    公开(公告)号：US20220179314A1

    公开(公告)日：2022-06-09

    申请号：US17455510

    申请日：2021-11-18

    申请人： TOKYO OHKA KOGYO CO., LTD.

    发明人： Rin ODASHIMA ,  Masatoshi ARAI ,  Masahito YAHAGI

    IPC分类号： G03F7/039 ,  G03F7/004 ,  G03F7/20 ,  G03F7/38 ,  G03F7/16 ,  G03F7/40 ,  G03F7/32

    摘要： A resist composition containing a resin component that exhibits changed solubility in a developing solution under action of acid and a photodecomposable base that controls the diffusion of the acid generated upon exposure, the resin component has a constitutional unit represented by General Formula (a0-1), and the photodecomposable base has an anion moiety and a cation moiety, where the energy of LUMO of the cation moiety is −4.70 eV or less, wherein R01 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms; Ya01 represents a single bond or a divalent linking group; Ar represents a benzene ring or a naphthalene ring; m01 represents an integer in a range of 0 to 6; n01 represents an integer in a range of 1 to 4

    Filter with seal treatment
    57.
    发明授权
    Filter with seal treatment 有权

    公开(公告)号：US11351509B2

    公开(公告)日：2022-06-07

    申请号：US14338883

    申请日：2014-07-23

    申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

    发明人： Kuan-Hsin Lo ,  Ching-Yu Chang

    IPC分类号： B01D67/00 ,  B01D65/00 ,  B01D69/02 ,  G03F7/16

    摘要： In accordance with an embodiment, a filter membrane is sealed with a sealing material prior to using the filter membrane to filter process fluids. The sealing material is a fluorine-based polymer or a polymer with a cross-linking group. Once the sealing material has been placed in contact with the filter membrane, a cross-linking reaction may be initiated using either physical or chemical processes to cross-link the sealing material and to seal the filter membrane within the sealing material, thereby separating the filter membrane from the process fluids, reducing or eliminating leaching of the filter membrane into the process fluid.

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    59.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权

    公开(公告)号：US20220165597A1

    公开(公告)日：2022-05-26

    申请号：US17533672

    申请日：2021-11-23

    申请人： Tokyo Electron Limited

    发明人： Tsuyoshi WATANABE ,  Masashi TSUCHIYAMA ,  Suguru ENOKIDA ,  Taro YAMAMOTO

    IPC分类号： H01L21/677 ,  G03F7/16

    摘要： A substrate processing apparatus includes; a carrier block; a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block; a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks; a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks; a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block; and a bypass transfer mechanism provided for each of the first and second processing blocks.

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    60.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权

    公开(公告)号：US20220165596A1

    公开(公告)日：2022-05-26

    申请号：US17530581

    申请日：2021-11-19

    申请人： Tokyo Electron Limited

    发明人： Tsuyoshi WATANABE ,  Masashi TSUCHIYAMA ,  Suguru ENOKIDA ,  Taro YAMAMOTO

    IPC分类号： H01L21/677 ,  H01L21/67 ,  H01L21/683 ,  G03F7/16

    摘要： A substrate processing apparatus includes a carrier block on which a carrier configured to store a substrate is placed, first processing block including a plurality of first processing modules, and a first transport mechanism shared by the plurality of first processing modules to transport the substrate, second processing block overlapping the first processing block, including a plurality of second processing modules, and a second transport mechanism shared by the plurality of second processing modules to transport the substrate, and configured to transport the substrate to the carrier block. The substrate processing apparatus includes a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part configured to face and support the substrate, and a rotation mechanism configured to rotate the support part around the shaft such that an orientation of the support part is changed between a first orientation and the second position.