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    HIGH DENSITY MULTI-CHIP LED DEVICES
    62.
    发明申请
    HIGH DENSITY MULTI-CHIP LED DEVICES 有权
    高密度多芯片LED器件

    公开(公告)号：US20120068198A1

    公开(公告)日：2012-03-22

    申请号：US13017502

    申请日：2011-01-31

    Applicant: Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

    Inventor： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

    IPC: H01L33/58

    CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  Y10T29/49002 ,  H01L2924/00014

    Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

    Abstract translation: 描述了高密度多芯片LED器件。 本发明的实施例提供了具有相对较高效率和小尺寸的光输出的高密度多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 LED芯片可以分为两组，其中每组中的LED芯片并联连接，并且串联连接。 在一些实施例中，LED装置包括可由陶瓷制成的底座。 底座可以包括连接母线和与芯片接合的半圆形区域。 引线键可以连接到LED芯片，使得所有的引线键都布置在一组LED芯片的外部以最小化光吸收。

    High Performance LED Package
    65.
    发明申请
    High Performance LED Package 有权
    高性能LED封装

    公开(公告)号：US20080173883A1

    公开(公告)日：2008-07-24

    申请号：US11624954

    申请日：2007-01-19

    Applicant: Christopher P. Hussell ,  David T. Emerson ,  Michael J. Bergmann

    Inventor： Christopher P. Hussell ,  David T. Emerson ,  Michael J. Bergmann

    IPC: H01L33/00

    CPC classification number: H01L33/60 ,  G02B6/0073 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: A light emitting diode lamp is disclosed that includes a resin package that defines a recess in the shape of a solid polygon or another three-dimensional solid. The recess includes a floor, two side walls along the respective longer sides of the floor, and two end walls along the respective shorter sides of the floor. The two side walls define an angle therebetween greater than 3°, and the two end walls define an angle therebetween greater than 40°. A light emitting diode chip is positioned on the rectangular floor of the package.

    Abstract translation: 公开了一种发光二极管灯，其包括限定具有实心多边形或另一立体固体形状的凹部的树脂封装。 凹部包括地板，沿着地板的相应长边的两个侧壁以及沿着地板的相应短边的两个端壁。 两个侧壁在它们之间限定了大于3°的角度，并且两个端壁在它们之间限定了大于40°的角度。 发光二极管芯片位于封装的矩形地板上。

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