Abstract:
A latch-up-free ESD protection circuit using SCR is disclosed, in which an SCR is connected between the input pad and the negative power supply; a turn-on switch and a turn-off switch are connected between the positive power supply VDD (or the input pad) and the SCR; and a transistor gating circuit is connected to the turn-on switch and the turn-off switch to direct the operation of the SCR. When overvoltage stress develops over the input pad in the fast-transient mode, the turn-on switch enables the NPN transistor to switch on the SCR to form a discharging path for electrostatic discharge; and when overvoltage stress is released, the turn-off switch enables the PNP transistor to switch off the SCR, thus making it immune to any latch-up after the overvoltage stress is released, and having the advantages of fast triggering, low trigger voltage, no latch-up, and full ESD protection in the active and passive modes.
Abstract:
A key array structure comprises a key array constituted by connecting a plurality of key members arranged in an array, it is characterized in that an elastic element is connected between each two adjacent key members and a positioning hole or position holes is or are disposed in the key member. The elastic member disposed between each two adjacent key members of the key array structure according to the present invention has a cushioning effect to adjust the deformation of the key array caused from the processes such as heat baking while manufacturing so as to allow the positioning hole in each key member to be precisely positioned with a corresponding position pin on a relative member.
Abstract:
A phase shift mask comprises a transparent substrate having a patterned opaque material layer formed thereupon to form a non-transmissive region of the transparent substrate and an adjoining transmissive region of the transparent substrate. A pit is formed within the transmissive region of the transparent substrate. The pit has a stepped sidewall such as to provide the phase shift mask with enhanced optical performance. The phase shift mask may be fabricated employing a self aligned method.
Abstract:
A directional interpolation method and device for increasing resolution of an image is disclosed. The device includes an input terminal, a memory, a texture analysis module, a texture variance consistence module and an interpolation module. The input terminal receives signals representing the pixels of the image. The memory stores the pixels in row direction. The texture analysis module obtains a monotone variation area by taking the position as a center. The texture variance consistence module computes all directional texture variances in a closest upper and a closest lower rows of pixels within the monotone variation area in the case of taking the position as a center and accordingly finds two pixels having texture variance consistence. The interpolation module finds a value of pixel to be interpolated to the position through a median filter in accordance with the two pixels and their neighbor pixels.
Abstract:
ntion is directed to the management of data burst requests. In iethod of the invention operates to determine a measure of one or parameters, which in an advantageous embodiment are the input z amount of data available in the input data buffer at the beginning t. The invention then proceeds to the selection of an operating data burst as a function of the input data parameter measures. In an nbodiment, the operating data rate is determined by computing the red data rate as a function of the input data rate and the data content fer at the beginning of the data burst, with the operating data rate lowest supported system data rate that is equal to or greater than the ed data rate. In a further step, the invention proceeds to a selection r the data burst from the burst durations supported by the wireless ction of the selected operating data rate and an end-of-burst data er. Advantageously, the system duration is selected that that, when selected operating data rate, provides a minimum end-of-burst data
Abstract:
A method and apparatus are provided for dynamically controlling a high speed wireless communication system capable of transmitting a message via a communication channel, to minimize the transmission power necessary for a single job and thereby increase system capacity. The communication channel is characterized by performance characteristics curves and physical channel characteristics curves. Channel conditions are sampled to model the performance characteristic curvers. Upon determining a minimum throughput to meet a Quality of Service requirement for user application, a first set of data pairs that correspond to the minimum throughput are determined from the performance characteristics curves. That first set of data pairs is in mapped to the physical channel characteristic curver and the data pair corresponding to minimum transmission power is then selected.
Abstract:
A wet dip method for photoresist and polymer stripping from a wafer surface without the need for a buffer solvent treatment step is disclosed. In the method, the wafer is first exposed to an etchant solution that is maintained at a temperature of at least 80° C. The wafer is then cooled in a room temperature air for a sufficient length of time until the temperature of the wafer reaches substantially room temperature. The wafer is then rinsed in a rinsing step that includes a quick dump rinse and a final rinse with deionized water that is maintained at a temperature not higher than room temperature without first exposing the wafer to a buffer solvent such as that required in a conventional wet dip method.
Abstract:
A method for forming wafer level package that has a serpentine-shaped electrode formed along a scribe line in-between two adjacent IC dies and the package formed are disclosed. In the method, each of the I/O redistribution lines connecting from an I/O redistribution pad is connected to a serpentine-shaped electrode for providing electrical communication during a subsequent electro-deposition process for forming a solder bump on the corresponding I/O redistribution pad. During a dicing operation of the wafer level package, a single cut through the center of the serpentine-shaped electrode can effect severance of all IC dies without possibility of any inter-die shorting or intra-die shorting.
Abstract:
A method for forming sidewall spacers with square shoulders on polysilicon gates and the structure formed by the method are disclosed. In the method, a polysilicon gate is first formed on a silicon substrate wherein the gate has a silicon nitride pad on top. A conformal silicon nitride layer is then blanket deposited on top of the structure followed by the deposition of a silicon oxide layer on top of the conformal silicon nitride layer. The silicon oxide layer is then planarized until a top of the conformal silicon nitride layer is exposed. The conformal silicon nitride layer and the silicon nitride pad are then wet etched away to expose the polysilicon gate by using the silicon oxide layer as a mask. After a photoresist layer is coated and etched-back such that only a cavity formed by the silicon oxide layer, the polysilicon gate and the conformal silicon nitride layer is filled with the photoresist, the silicon oxide layer is wet etched away by an etchant such as HF. The square-shouldered sidewall spacers are then formed by first anisotropically etching the first silicon nitride layer not masked by the photoresist layer and then by a wet etching step to remove the photoresist layer.
Abstract:
A method for fabricating a mixed-mode device. A first gate oxide layer and a second gate oxide layer are formed. The polysilicon layer is used as a mask to pattern the gate oxide layers. Additionally, a top electrode is formed during the first gate oxide layer is patterned. A bottom electrode is formed during the second gate oxide layer is patterned. The first gate oxide layer and the second gate oxide layer are formed by a single oxidation operation, thus thicknesses of the first gate oxide layer and the second oxide layer can be effectively controlled.