Electronic device that presents location-tethered augmented reality notifications

    公开(公告)号:US11721077B2

    公开(公告)日:2023-08-08

    申请号:US17544073

    申请日:2021-12-07

    摘要: An electronic device, computer program product, and method enhance an augmented reality (AR) display by visually tethering notification content to an identified object. The electronic device includes at least one network interface that communicatively connects the electronic device to the AR display device. A controller of the electronic device is communicatively coupled to the at least one network interface. The controller receives an image stream from a field of view (FOV) of the AR display device. The controller identifies at least one object within the image stream. The controller generates notification content associated with a particular object of the at least one object. The controller presents, at the AR display device, the notification content visually tethered to the particular object.

    MULTI-ACCESS DATA CONNECTION IN A MOBILE NETWORK

    公开(公告)号:US20230247704A1

    公开(公告)日:2023-08-03

    申请号:US18297881

    申请日:2023-04-10

    摘要: Apparatuses, methods, and systems are disclosed for establishing a multi-access data connection. One apparatus includes a processor coupled to a memory storing instructions executable by the processor to cause the apparatus to transmit, over a first access network, a first request to establish a data connection, the first request including a first indication requesting a single-access data connection and a second indication that an upgrade from the single-access data connection to a multi-access data connection is allowed. The instructions are executable by the processor to cause the apparatus to receive a third indication that the single-access data connection is to be upgraded to the multi-access data connection for transporting user-plane traffic over the first access network and a second access network and to establish the multi-access data connection over the first access network and the second access network based on the third indication.

    Processor heat dissipation in a stacked PCB configuration

    公开(公告)号:US11716806B1

    公开(公告)日:2023-08-01

    申请号:US17529645

    申请日:2021-11-18

    摘要: In aspects of processor heat dissipation in a stacked PCB configuration, a computing device includes a processor for executable instructions processing during which the processor generates heat. The computing device also includes a main printed circuit board (PCB) in a stacked PCB configuration, and the processor is affixed to the main printed circuit board. The stacked PCB configuration forms an enclosed cavity through which heat dissipation is restricted. The computing device includes a heat spreader having a first end connected to the processor via the main printed circuit board by a conductive material, and a second end connected to a heat sink located external to the stacked PCB configuration. The heat spreader exits the enclosed cavity via an opening in the enclosed cavity between the stacked PCB configuration, and the heat spreader transfers the heat away from the processor to the heat sink.