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公开(公告)号:US20250062573A1
公开(公告)日:2025-02-20
申请号:US18933097
申请日:2024-10-31
Applicant: SAMTEC, INC.
Inventor: Jonathan E. Buck , John Mongold
IPC: H01R13/6461 , H01R12/71 , H01R12/73 , H01R13/04 , H01R13/11 , H01R24/20 , H01R24/28 , H01R107/00
Abstract: An orthogonal electrical connector system includes vertical electrical connectors that are configured to e mated to each other so as to place respective pluralities of first and second substrates that are oriented orthogonal to each other in data communication with each other through the mated electrical connectors. Other connector systems are also disclosed.
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公开(公告)号:US20250014983A1
公开(公告)日:2025-01-09
申请号:US18886066
申请日:2024-09-16
Applicant: SAMTEC, INC.
Inventor: Alan D. Nolet , Andrew Haynes Liotta , Troy Benton Holland , Thomas Jacob Hammann , Heidi Bates , Daniel Goia , Vishwas Vinayak Hardikar , Ajeet Kumar , Daniel Long , Nicole McGraw , Lauren Savawn Moen , Adam Owens
IPC: H01L23/498 , H01L21/48 , H01L23/15 , H05K1/03 , H05K1/11
Abstract: An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a pressure differential force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.
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公开(公告)号:US20240421460A1
公开(公告)日:2024-12-19
申请号:US18816315
申请日:2024-08-27
Applicant: SAMTEC, INC.
Inventor: Marc Epitaux , Shashi Chuganey , Kelly Garrison , Thomas Albert Hall, III , Cindy Lee Diegel , James Alexander Moss , Francisco Noyola , Yasuo Sasaki , Scott McMorrow
Abstract: Radio frequency (RF) waveguides and related interconnect members are disclosed. The interconnect members can have a smaller footprint than WR15 flanges. Further, the interconnect members can be configured to mate with complementary interconnects without undergoing substantial relative rotation.
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公开(公告)号:US12149029B2
公开(公告)日:2024-11-19
申请号:US18304775
申请日:2023-04-21
Applicant: SAMTEC, INC.
Inventor: Jonathan E. Buck , John Mongold
IPC: H01R13/6461 , H01R12/71 , H01R12/73 , H01R13/04 , H01R13/11 , H01R24/20 , H01R24/28 , H01R107/00
Abstract: An orthogonal electrical connector system includes vertical electrical connectors that are configured to e mated to each other so as to place respective pluralities of first and second substrates that are oriented orthogonal to each other in data communication with each other through the mated electrical connectors. Other connector systems are also disclosed.
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公开(公告)号:US12140808B2
公开(公告)日:2024-11-12
申请号:US17777857
申请日:2020-11-18
Applicant: SAMTEC, INC.
Inventor: Jignesh H. Shah
Abstract: An electrical communication system includes a plurality of cable connectors that are configured to mate with the same electrical connector or electrical connectors having substantially identical mating interfaces. The cable connectors can be configured as an electrical cable connector, an optical cable connector, and a hybrid cable connector that includes both optical and electrical communication.
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公开(公告)号:US20240266706A1
公开(公告)日:2024-08-08
申请号:US18566363
申请日:2022-06-03
Applicant: SAMTEC, INC.
Inventor: Marc EPITAUX , Thomas Albert HALL, III
IPC: H01P3/16
CPC classification number: H01P3/16
Abstract: A data communication connector can include a dielectric waveguide that extends along a central axis, and a recess that is configured to receive an antenna. The data communication connector can include an electrically conductive body that receives the dielectric waveguide. The electrically conductive body can define the recess. The dielectric waveguide can include a dielectric core, a ground shield, and a jacket.
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公开(公告)号:US12009225B2
公开(公告)日:2024-06-11
申请号:US17043998
申请日:2019-03-29
Applicant: SAMTEC, INC.
Inventor: Alan Nolet , Daniel Goia , Vishwas Hardikar , Ajeet Kumar , Daniel Long , Andrew Liotta
IPC: H01L21/48 , H01L23/498 , H01L23/15
CPC classification number: H01L21/486 , H01L23/49827 , H01L23/15
Abstract: An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a vacuum force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.
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公开(公告)号:US20240063585A1
公开(公告)日:2024-02-22
申请号:US18260024
申请日:2021-12-30
Applicant: SAMTEC, INC.
Inventor: Jignesh H. SHAH , Gustavo BLANDO , Jean Karlo WILLIAMS BARNETT
IPC: H01R13/6591 , H01R12/71 , H01R13/6463 , H01R13/6471
CPC classification number: H01R13/65912 , H01R12/716 , H01R13/6463 , H01R13/6471
Abstract: An electrical connector includes a connector housing and a plurality of electrical contacts supported by the connector housing. The electrical contacts are oriented oblique to a mounting interface of the connector housing that mounts to an underlying substrate. The electrical connector can further include a plurality of electrical cables mounted to the electrical contacts. The electrical cables can extend from the electrical contacts along a direction oblique to the mounting interface.
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公开(公告)号:US20240014607A1
公开(公告)日:2024-01-11
申请号:US18345756
申请日:2023-06-30
Applicant: Samtec, Inc.
Inventor: Thomas A. Hall, III
IPC: H01R13/6592 , H01R12/75 , B33Y80/00
CPC classification number: H01R13/6592 , H01R12/75 , B33Y80/00
Abstract: An electrical connector apparatus and method. The electrical connector may include one or more electrically conductive materials. The electrical connector may include one or more receptacles. The one or more electrically conductive materials may include one or more teeth. The electrical connector, or portions thereof, may be made by additive manufacturing.
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公开(公告)号:US20230387631A1
公开(公告)日:2023-11-30
申请号:US18248930
申请日:2021-10-13
Applicant: SAMTEC, INC.
Inventor: Eric ZBINDEN
IPC: H01R13/639 , H01R43/26 , G02B6/42
CPC classification number: H01R13/639 , H01R43/26 , G02B6/4284
Abstract: A vertical interconnect module and mating receptacle are described. The vertical interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The vertical interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates.
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