Abstract:
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
Abstract:
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
Abstract:
Disclosed herein is a micromirror device having in-plane deformable hinge to which a deflectable and reflective mirror plate is attached. The mirror plate rotates to different angles in response to an electrostatic field established between the mirror plate and an addressing electrode associated with the mirror plate.
Abstract:
A method for processing microelectromechanical devices is disclosed herein. The method prevents the diffusion and interaction between sacrificial layers and structure layers of the microelectromechanical devices by providing selected barrier layers between consecutive sacrificial and structure layers.
Abstract:
To protect the structural layers from being eroded in the etching process, a protection layer is deposited on the exposed structural layers of the micromirror. The protection layer is deposited before etching and removed after etching.
Abstract:
A projection system is disclosed herein. The projection system employs a spatial light modulator comprising an array of individually addressable pixels for modulating the incident light based on image data. The modulated light is projected on a screen for viewing.
Abstract:
A microelectromechanical device having a movable element with low mass inertia is disclosed herein. The movable element is held on a substrate such that the element is capable of rotating relative to the substrate; and the element has a mass inertia of 1.2×10−24 kg·m2 or less.
Abstract:
A method and apparatus for operating spatial light modulator have been disclosed herein. The spatial light modulator comprises an array of micromirror devices, each of which further comprises a reflective deflectable mirror plate attached to a deformable hinge, and an addressing electrode for addressing and deflecting the mirror plate.
Abstract:
A microelectromechanical device having a movable element with low mass inertia is disclosed herein. The movable element is held on a substrate such that the element is capable of rotating relative to the substrate; and the element has a mass inertia of 1.2×10−24 kg.m2 or less.
Abstract:
The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.