Abstract:
Both lateral side portions of a laser diode chip separated by the central portions of a p-type capping layer and a p-type clad layer and parallel to the horizontal edges of the cleavage planes of the chip are cut away by etching, so that the p-type capping layer and the p-type clad layer take the shape of a mountain in cleavage planes which are the end faces of an active layer. The cut portions are provided with current restricting layers of oxide film made by baking a liquid oxide film. The thicknesses of the current restricting layers are increased with distance from the central portion of the laser diode chip.
Abstract:
Provided are a nitride semiconductor light-emitting device comprising a polycrystalline or amorphous substrate made of AlN; a plurality of dielectric patterns formed on the AlN substrate and having a stripe or lattice structure; a lateral epitaxially overgrown-nitride semiconductor layer formed on the AlN substrate having the dielectric patterns by Lateral Epitaxial Overgrowth; a first conductive nitride semiconductor layer formed on the nitride semiconductor layer; an active layer formed on the first conductive nitride semiconductor layer; and a second conductive nitride semiconductor layer formed on the active layer; and a process for producing the same.
Abstract:
A multicast distribution system of packet comprises routers connected with each other by a cable. Nodes are connected to each of the routers. The routers or the nodes is provided with a unit for relaying a packet having a list of the plurality of destination addresses and its undistributed bit map to the packet header to be transferred, according to the unicast route.
Abstract:
A management server managing a fixed address of a mobile terminal, at least two dynamic addresses dynamically allotted to the mobile terminal when it exists in two service areas at one time. A host transmits a packet with the fixed address of the mobile terminal used as a header. If the mobile terminal exist in at least the two service areas (apart from other areas), it notifies a management server of the dynamic addresses of the two service areas in real time. If the packet is transmitted from the host and the two dynamic addresses are allotted to the mobile terminal, the management server transfers a packet with these two dynamic addresses used as a header.
Abstract:
An exposure apparatus and method for a photolithographic process uses a projection optical system that transfers an image of a reticle pattern onto a first shot area on a wafer, the first shot area being made coincident with an image plane within an exposure field of the system. When moving a second shot area into the exposure field, variations in the vertical position of the wafer are compensated by a Z/levelling-stage. Focusing and exposure are performed for the second shot area after an AF sensor system measures and stores a defocus amount of the second shot area relative to the image plane. Repeating this procedure for shot areas on the wafer yields a plurality of defocus amounts, from which any foreign matter existing on the bottom of the wafer is detected. Alternatively, for exposing the first shot area, the vertical position and tilt angle of the wafer are made coincident with those of the image plane. When positioning the second shot area into the exposure field, the tilt angle is kept unchanged, and is measured and stored. Before exposing the second shot area, the vertical position and tilt angle of the wafer is made coincident with those of the image plane. Foreign matter on the wafer is detected from a distribution of the tilt angles on the surface of the wafer.
Abstract:
An exposure method for a photolithographic process uses a projection exposure apparatus including a projection optical system. The surface of a first shot area on a wafer is caused to be coincident with an image plane of the projection optical system within an exposure field thereof so as to achieve focused condition, and an image of a reticle pattern is transferred onto the first shot area. Then, a second shot area is moved into the exposure field, during which the vertical position of the wafer is corrected by means of a Z/levelling-stage so as to compensate for the variation in the vertical position of the wafer W which could otherwise occur depending on the angle formed between the running plane of the wafer stage and the image plane. Then, an AF sensor system is used to measure and store a defocus amount of the second shot area relative to the image plane. Then, focusing and exposure are performed for the second shot area. This procedure is repeated for the shot areas on the wafer so as to obtain a plurality of defocus amounts, from which any foreign matter existing on the bottom of the wafer are detected. In another embodiment, the vertical position and tilt angle of the wafer are caused to be coincident with those of the image plane, and the first shot area is exposed. Then, the wafer is moved so as to position the second shot area into the exposure field, during which the tilt angle of the surface of the wafer is kept unchanged. Then, the tilt angle of the wafer is measured and stored. Thereafter, the vertical position and tilt angle of the wafer are caused to be coincident with those of the image plane, and the second shot area is exposed. Foreign matter are detected from a distribution of the tilt angles on the surface of the wafer.
Abstract:
A lens protecting cover-attached camera includes a moving mechanism. Thus, a simple mechanism is used to turn on or off a main power switch and for opening or closing a lens protecting cover responsively to manipulations performed on a single manipulating member. A supporting shaft for supporting the lens protecting cover is placed so as to be parallel to a plane substantially perpendicular to the optical axis of a photographic lens. When the supporting shaft is moved along the optical axis of the photographic lens, the moving mechanism causes the lens protecting cover to rotate around the supporting shaft at the center from a closed position to an open position. At the closed position, the lens protecting cover shields the face of the photographic lens. At the open position, the lens protecting cover exposes the face of the lens. Moreover, the moving mechanism turns on or off the power switch in response to a movement made along the optical axis of the photographic lens.
Abstract:
A projection exposure apparatus detects positions at the measurement points (P1-P5) in the Z-direction on the shot area of the wafer W, and obtains the distribution of the irregularity of the shot area based on the detected result and the pre-known process structure data. For example, when the pattern having the narrowest line width is exposed in the pattern area (40B), the pattern area (40B) is made as a focusing reference plane and the difference in level (ZA-ZB) of another area of which reference is pattern area (40B) is added to the level of the best image plane (42) as an offset value. The pattern area (40B) is focused to the best image plane (42) by fitting image plane (42A) to the exposure surface.
Abstract:
A camera of this invention detects the presence or absence of magnetic data and prevents at least occurrence of a frame of double exposure or unexposed frame even under the influence of an electromagnetic noise. The position of a perforation of a film is detected by a position detecting section and whether a magnetic head is set in contact with a recording area adjacent to an exposed frame or a recording inhibition area adjacent to a portion between the adjacent exposed frames is determined. A threshold value used for determining the presence or absence of magnetic data is set in a threshold setting circuit based on an output generated when the position detecting circuit determines that the magnetic head is set in contact with the recording inhibition area. An output of the magnetic head is compared with the threshold value by a determination circuit and the presence or absence of magnetic data in the recording area is determined when the position detecting circuit determines that the magnetic head is set in contact with the recording area. Whether the operation of the magnetic head is permitted or inhibited is determined based on an output of the determination circuit.
Abstract:
A lens cover mounted camera with a lens cover movable to selectively assume at least a closing condition that covers a front surface of a photographing lens and an opening condition that exposes the front surface of the photographing lens, and further having a lens cover operating member for conducting the opening and closing operations of the lens cover and further for shifting the lens cover in directions of the optical axis of the photographing lens. When the camera is switched to a using condition or a non-using condition, the lens cover is respectively shifted to an opening position or a closing position through the lens cover operating member. This design minimizes the protruding quantity of the lens cover from a camera body and prevents the lens cover from being easily broken even if a careless external force or shock works on the lens cover during the use of the camera.