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公开(公告)号：US20170141193A1
公开(公告)日：2017-05-18
申请号：US15303231
申请日：2015-10-09
Inventor： Guangcai YUAN , Liangchen YAN , Xiaoguang XU , Lei WANG , Junbiao PENG , Linfeng LAN
IPC: H01L29/24 , H01L27/12 , H01L29/786 , H01L29/66 , H01L21/02
CPC classification number: H01L29/24 , H01L21/02565 , H01L21/02631 , H01L27/1225 , H01L27/127 , H01L27/1288 , H01L29/66 , H01L29/66742 , H01L29/66969 , H01L29/78603 , H01L29/78681 , H01L29/7869 , H01L29/78696
Abstract: The present disclosure provides a TFT, an array substrate, their manufacturing method, and a display device. The method for manufacturing the TFT includes a step of forming a pattern of a semiconductor active layer on a transparent substrate through a patterning process, and the pattern of the semiconductor active layer includes a lanthanum boride pattern.
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62.发明申请公开(公告)号：US20160013220A1
公开(公告)日：2016-01-14
申请号：US14429247
申请日：2014-07-18
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Li ZHANG , Liangchen YAN , Fengjuan LIU
IPC: H01L27/12 , H01L29/66 , H01L29/417 , H01L29/423 , H01L21/768 , H01L21/283
CPC classification number: H01L27/1262 , H01L21/283 , H01L21/76802 , H01L21/76885 , H01L27/1288 , H01L29/41733 , H01L29/42384 , H01L29/66742
Abstract: A method for manufacturing an array substrate and a method for forming a through hole are provided. The method for manufacturing the array substrate comprise: coating photoresist in an insulating layer through-hole region on a substrate; depositing an insulating layer on the substrate provided with the photoresist in the insulating layer through-hole region; and stripping off the photoresist in the insulating layer through-hole region to form an insulating layer through hole. The manufacturing method simplifies the process of forming the insulating layer through hole.
Abstract translation: 提供一种阵列基板的制造方法及形成通孔的方法。 制造阵列基板的方法包括：在基板上的绝缘层通孔区域中涂覆光致抗蚀剂; 在设置有所述光致抗蚀剂的所述基板上的所述绝缘层通孔区域内淀积绝缘层; 并剥离绝缘层通孔区域中的光致抗蚀剂以形成绝缘层通孔。 该制造方法简化了形成绝缘层通孔的工艺。
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