Multilayer chip capacitor
    62.
    发明授权
    Multilayer chip capacitor 有权
    多层片式电容器

    公开(公告)号:US07688568B1

    公开(公告)日:2010-03-30

    申请号:US12407298

    申请日:2009-03-19

    IPC分类号: H01G4/228

    摘要: A multilayer chip capacitor includes: a capacitor body having a plurality of dielectric layers laminated therein and comprising first and second capacitor units; and first to fourth external electrodes formed on an outer surface of the capacitor body, wherein the first capacitor unit comprises first and second internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the first and second external electrodes, and having different polarities, each pair of first and second internal electrodes being laminated one or more times to discriminate a plurality of capacitors with a certain capacitance, the second capacitor unit comprises third and fourth internal electrodes facing each other with the dielectric layer interposed therebetween, connected to the third and fourth external electrodes, and having the same polarities as those of the first and second internal electrodes, each pair of third and fourth internal electrodes being laminated one or more times to discriminate one or more capacitors each with a certain capacitance, and at least three capacitors included in the first and second capacitor units have different capacitances or resonance frequencies.

    摘要翻译: 一种多层片状电容器包括:电容器主体,其具有层叠在其中的多个电介质层,并且包括第一和第二电容器单元; 以及形成在所述电容器主体的外表面上的第一至第四外部电极,其中所述第一电容器单元包括彼此面对的第一和第二内部电极,所述电介质层插入在所述第一和第二内部电极之间,连接到所述第一和第二外部电极,并具有不同的极性 每一对第一和第二内部电极层叠一次或多次以区分具有一定电容的多个电容器,第二电容器单元包括彼此面对的第三和第四内部电极,介电层插入其间,连接到第三个 和第四外部电极,并且具有与第一和第二内部电极相同的极性,每对第三和第四内部电极被层叠一次或多次以区分一个或多个具有一定电容的电容器,并且至少三个 电容器包括在第一和第二电容器单元ha中 不同的电容或谐振频率。

    Multilayer chip capacitor
    63.
    发明授权
    Multilayer chip capacitor 有权
    多层片式电容器

    公开(公告)号:US07567425B1

    公开(公告)日:2009-07-28

    申请号:US12339839

    申请日:2008-12-19

    IPC分类号: H01G4/228

    摘要: There is provided a multilayer chip capacitor including: a capacitor body including first and second capacitor units; and first to fourth outer electrodes, wherein the first capacitor unit includes at least one pair of first and second inner electrodes, the second capacitor unit includes at least one pair of third and fourth inner electrodes, an alternate laminated portion is formed in one area within the capacitor body, the alternate laminated portion having the first to fourth inner electrodes sequentially laminated therein, and a capacitance adjusting portion is formed in another area within the capacitor body, the capacitance adjusting portion having at least one of the one pair of first and second inner electrodes and the one pair of third and fourth inner electrodes laminated repeatedly.

    摘要翻译: 提供了一种多层片状电容器,包括:电容器主体,包括第一和第二电容器单元; 和第一至第四外部电极,其中所述第一电容器单元包括至少一对第一和第二内部电极,所述第二电容器单元包括至少一对第三和第四内部电极,在一个区域内形成交替的层叠部分 电容器主体,具有依次层叠的第一至第四内部电极的交替层叠部分和电容器体内的另一区域中形成电容调整部,电容调整部具有一对第一和第二电极中的至少一个 内电极和一对第三和第四内电极重复层叠。

    Mounting structure of circuit board having multi-layered ceramic capacitor thereon
    64.
    发明授权
    Mounting structure of circuit board having multi-layered ceramic capacitor thereon 有权
    具有多层陶瓷电容器的电路板的安装结构

    公开(公告)号:US09148955B2

    公开(公告)日:2015-09-29

    申请号:US13481348

    申请日:2012-05-25

    IPC分类号: H05K1/18 H05K1/11 H05K3/34

    摘要: Disclosed herein is a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon. The mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, in which a dielectric layer on which inner electrodes are disposed is stacked and external electrode terminals connecting the inner electrodes in parallel are disposed on both ends thereof, wherein the inner electrodes of the multi-layered ceramic capacitor and the circuit board are disposed so as to be a horizontal direction to connect the external electrode terminals with a land on the circuit board by a conductive material and a ratio of a bonding area ASOLEDER of the conductive material to the area AMLCC of the external electrode terminals AMLCC is set to be less than 1.4, thereby remarkably reducing the vibration noise.

    摘要翻译: 这里公开了一种其上具有多层陶瓷电容器的电路板的安装结构。 其上设置有多层陶瓷电容器的电路板的安装结构,其中布置有内部电极的电介质层,并且将其内部电极并联连接的外部电极端子设置在其两端,其中内部电极 将多层陶瓷电容器和电路板设置成水平方向,以通过导电材料将导电材料的外部电极端子与电路板上的焊盘接合,并且将导电材料的接合面积ASOLEDER与 外部电极端子AMLCC的面积AMLCC被设定为小于1.4,从而显着地降低了振动噪声。

    Multi-layered capacitor and manufacturing method thereof
    65.
    发明授权
    Multi-layered capacitor and manufacturing method thereof 有权
    多层电容器及其制造方法

    公开(公告)号:US08630083B2

    公开(公告)日:2014-01-14

    申请号:US13447692

    申请日:2012-04-16

    IPC分类号: H01G4/228 H01G4/06

    摘要: A multi-layered capacitor includes a capacitor element in which a plurality of dielectric layers are multi-layered, and which comprises a first inner electrode and a second inner electrode that are alternately formed on neighboring dielectric layers of the plurality of dielectric layers, a first external electrode and a second external electrode which are formed on an outside surface of the capacitor element to be electrically connected to the first inner electrode and the second inner electrode, respectively, and a deformation suppressing electrode which is formed on the outside surface of the capacitor element and separated from the first external electrode and the second external electrode to be electrically isolated from the first inner electrode and the second inner electrode.

    摘要翻译: 多层电容器包括电容器元件,其中多个电介质层是多层的,并且包括交替地形成在多个电介质层的相邻电介质层上的第一内电极和第二内电极,第一 外部电极和第二外部电极,分别形成在电容器元件的外表面上以与第一内部电极和第二内部电极电连接;变形抑制电极,形成在电容器的外表面上 并且与第一外部电极和第二外部电极分离以与第一内部电极和第二内部电极电隔离。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    66.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 审中-公开
    多层陶瓷电子元件

    公开(公告)号:US20130155574A1

    公开(公告)日:2013-06-20

    申请号:US13541494

    申请日:2012-07-03

    IPC分类号: H01G4/012

    CPC分类号: H01G4/232 H01G4/012 H01G4/30

    摘要: A multilayer ceramic electronic component having high reliability by reducing equivalent series resistance (ESR) dispersion is provided. Connectivity between internal electrodes and external electrodes is secured by introducing dummy electrodes connected to first and second terminal electrodes, to third and fourth internal electrode layers. ESR dispersion of the multilayer ceramic electronic component is reduced to obtain high reliability.

    摘要翻译: 提供了通过降低等效串联电阻(ESR)色散而具有高可靠性的多层陶瓷电子元件。 通过将连接到第一和第二端子电极的虚设电极引入第三和第四内部电极层来确保内部电极和外部电极之间的连通性。 降低多层陶瓷电子部件的ESR分散,获得高可靠性。

    MULTI-LAYERED CAPACITOR AND MANUFACTURING METHOD THEREOF
    67.
    发明申请
    MULTI-LAYERED CAPACITOR AND MANUFACTURING METHOD THEREOF 有权
    多层电容器及其制造方法

    公开(公告)号:US20120275081A1

    公开(公告)日:2012-11-01

    申请号:US13447692

    申请日:2012-04-16

    IPC分类号: H01G4/30

    摘要: A multi-layered capacitor includes a capacitor element in which a plurality of dielectric layers are multi-layered, and which comprises a first inner electrode and a second inner electrode that are alternately formed on neighboring dielectric layers of the plurality of dielectric layers, a first external electrode and a second external electrode which are formed on an outside surface of the capacitor element to be electrically connected to the first inner electrode and the second inner electrode, respectively, and a deformation suppressing electrode which is formed on the outside surface of the capacitor element and separated from the first external electrode and the second external electrode to be electrically isolated from the first inner electrode and the second inner electrode.

    摘要翻译: 多层电容器包括电容器元件,其中多个电介质层是多层的,并且包括交替地形成在多个电介质层的相邻电介质层上的第一内电极和第二内电极,第一 外部电极和第二外部电极,分别形成在电容器元件的外表面上以与第一内部电极和第二内部电极电连接;变形抑制电极,形成在电容器的外表面上 并且与第一外部电极和第二外部电极分离以与第一内部电极和第二内部电极电隔离。

    Circuit board device and integrated circuit device
    68.
    发明授权
    Circuit board device and integrated circuit device 有权
    电路板装置和集成电路装置

    公开(公告)号:US08149565B2

    公开(公告)日:2012-04-03

    申请号:US12421953

    申请日:2009-04-10

    IPC分类号: H01G15/00

    摘要: A circuit board device includes a circuit board comprising a mounting area, and first and second power lines and a ground pad formed on the mounting area, and a vertical multilayer chip capacitor (MLCC) comprising a capacitor body, a plurality of first and second polarity inner electrodes, first and second outer electrodes, and a third outer electrode, wherein the first and second power lines are separately disposed on the mounting area, connected to the first and second outer electrodes, and electrically connected to each other only by the vertical MLCC, and the ground pad is disposed between the first and second power lines and connected to the third outer electrode.

    摘要翻译: 一种电路板装置,包括:电路板,包括安装区域;以及第一和第二电力线以及形成在所述安装区域上的接地焊盘;以及垂直多层片状电容器(MLCC),其包括电容器本体,多个第一和第二极性 内部电极,第一外部电极和第二外部电极以及第三外部电极,其中第一和第二电力线分别设置在安装区域上,连接到第一和第二外部电极,并且仅通过垂直MLCC 并且接地焊盘设置在第一和第二电源线之间并且连接到第三外部电极。

    MULTILAYER CHIP CAPACITOR
    69.
    发明申请
    MULTILAYER CHIP CAPACITOR 审中-公开
    多层芯片电容器

    公开(公告)号:US20110085277A1

    公开(公告)日:2011-04-14

    申请号:US12694926

    申请日:2010-01-27

    IPC分类号: H01G4/005 H01G4/002

    CPC分类号: H01G4/005

    摘要: A multilayer chip capacitor includes a capacitor body, a plurality of internal electrodes, and a plurality of external electrodes. The capacitor body is formed of a ceramic sintered product and has first and second side surfaces facing each other. The plurality of internal electrodes each of which has two leads extending to the first and second side surfaces of the capacitor body, respectively, are arranged such that the internal electrodes with one polarity and the internal electrodes with the other polarity are alternately stacked inside the capacitor body. The plurality of external electrodes are formed on the first and second side surfaces of the capacitor body along a stacked direction of the internal electrodes such that the external electrodes with one polarity and the external electrodes with the other polarity are alternately arranged on each of the first and second side surfaces, and are connected to the leads.

    摘要翻译: 多层片状电容器包括电容器本体,多个内部电极和多个外部电极。 电容器体由陶瓷烧结体形成,并且具有彼此面对的第一和第二侧面。 分别具有分别延伸到电容器本体的第一和第二侧面的两个引线的多个内部电极被布置成使得具有一个极性的内部电极和具有另一个极性的内部电极交替堆叠在电容器内部 身体。 多个外部电极沿着内部电极的堆叠方向形成在电容器主体的第一和第二侧表面上,使得具有一个极性的外部电极和具有另一个极性的外部电极交替地布置在第一 和第二侧表面,并且连接到引线。

    MULTILAYER CHIP CAPACITOR AND CIRCUIT BOARD DEVICE
    70.
    发明申请
    MULTILAYER CHIP CAPACITOR AND CIRCUIT BOARD DEVICE 有权
    多层芯片电容器和电路板设备

    公开(公告)号:US20110056735A1

    公开(公告)日:2011-03-10

    申请号:US12649071

    申请日:2009-12-29

    IPC分类号: H01G4/30 H05K1/18

    CPC分类号: H01G4/30 H01G4/005

    摘要: There are provided a multilayer chip capacitor and a circuit board device. The multilayer chip capacitor includes a capacitor body including a plurality of dielectric layers that are stacked, first and second outer electrodes formed on an outer surface of the capacitor body and having opposite polarity, first and second inner electrodes opposing each other, interleaved with the dielectric layers in the capacitor body, and each including an electrode plate forming capacitance and a lead extending from the electrode plate, the lead of the first inner electrode and the lead of the second electrode being respectively connected to the first and second outer electrodes, and third inner electrodes interposed between the first and second inner electrodes. At least one of the third inner electrodes adjacent to the first inner electrode includes a conductive pattern having the same shape as the lead of the first inner electrode and is connected to the first outer electrode. At least one of the third inner electrodes adjacent to the second inner electrode includes a conductive pattern having the same shape as the lead of the second inner electrode and is connected to the second outer electrode.

    摘要翻译: 提供了多层片状电容器和电路板装置。 多层片状电容器包括电容器本体,其包括层叠的多个电介质层,形成在电容器本体的外表面上并具有相反极性的第一和第二外部电极,彼此相对的第一和第二内部电极,与电介质 层,并且每个包括电极板形成电容和从电极板延伸的引线,第一内部电极的引线和第二电极的引线分别连接到第一和第二外部电极,第三 介于第一和第二内部电极之间的内部电极。 与第一内部电极相邻的第三内部电极中的至少一个包括具有与第一内部电极的引线相同形状并且连接到第一外部电极的导电图案。 与第二内部电极相邻的第三内部电极中的至少一个包括具有与第二内部电极的引线相同形状并且连接到第二外部电极的导电图案。