公开(公告)号：US20080012358A1

公开(公告)日：2008-01-17

申请号：US11810139

申请日：2007-06-04

Applicant: Luke Liang ,  David Cheng ,  Toni Liang

Inventor： Luke Liang ,  David Cheng ,  Toni Liang

IPC: E05C3/04

CPC classification number: E05C3/043 ,  E05B15/0086 ,  Y10T292/1041

Abstract: There is a sweep lock having a housing with a sweep connected to the bottom surface of the housing. The sweep has a handle portion and a tongue portion, and is adapted to move from a first position to a second position, whereby said tongue is in an extended position in one of said first and second positions. The housing has a spring means having first and second ends. The first end is secured to the housing, and the second end is secured to the sweep.

Abstract translation: 具有扫掠锁，其具有连接到壳体的底表面的扫掠的壳体。 扫掠具有把手部分和舌部，并且适于从第一位置移动到第二位置，由此所述舌片处于所述第一和第二位置之一中的延伸位置。 外壳具有一个具有第一和第二端的弹簧装置。 第一端固定在壳体上，第二端被固定在扫描头上。

公开(公告)号：US20070198278A1

公开(公告)日：2007-08-23

申请号：US11347024

申请日：2006-02-03

Applicant: David Cheng ,  Stan Humphries ,  Kyusik Chung ,  Dong Xiang ,  Jonathan Burstein

Inventor： David Cheng ,  Stan Humphries ,  Kyusik Chung ,  Dong Xiang ,  Jonathan Burstein

IPC: G06Q10/00 ,  G06Q30/00

CPC classification number: G06Q30/02 ,  G06Q10/10 ,  G06Q30/0278 ,  G06Q40/00 ,  G06Q50/16

Abstract: A facility procuring information about a distinguished property from its owner that is usable to refine an automatic valuation of the distinguished property is described. The facility displays information about the distinguished property used in the automatic valuation of the distinguished property. The facility obtains user input from the owner adjusting at least one aspect of information about the distinguished property used in the automatic valuation of the distinguished property. The facility then displays to the owner a refined valuation of the distinguished property that is based on the adjustment of the obtained user input.

Abstract translation: 描述了从可用于改进不同属性的自动估价的用户处获得与其所有者有关的区别属性的信息的设施。 该设施显示有关区分属性自动估价中使用的区别属性的信息。 该设施从所有者获得用户输入，调整关于在不同属性的自动估价中使用的区别属性的信息的至少一个方面。 然后，该设施向所有者显示基于所获得的用户输入的调整的区别属性的精细估价。

公开(公告)号：US20060162685A1

公开(公告)日：2006-07-27

申请号：US11042905

申请日：2005-01-26

Applicant: David Cheng

Inventor： David Cheng

IPC: H01T13/04

CPC classification number: H01T13/04

Abstract: A spark plug capable of removing the remaining electric charges is proposed. The spark plug can be installed in a vehicle and has an insulating body, a center electrode, a conductive housing and a conductive wire. The center electrode is passed through the insulating body. The conductive housing is disposed outside the insulating body. One end of the conductive wire is connected to the conductive housing and the other end of the conductive wire is fixed on a negative electrode of a battery of the vehicle. Since the electric charges remaining in the spark plug can be removed by the conductive wire after the high-voltage current sent from the ignition system induces the sparks, the present invention can avoid the damage of the spark plug to keep the spark plug in good status, maintain the efficiency of the engine, and make the car safer in usage.

Abstract translation: 提出了能够去除剩余电荷的火花塞。 火花塞可以安装在车辆中，并具有绝缘体，中心电极，导电壳体和导线。 中心电极通过绝缘体。 导电壳体设置在绝缘体的外侧。 导电线的一端连接到导电壳体，导电线的另一端固定在车辆电池的负极上。 由于在从点火系统发出的高压电流引起火花之后，通过导线可以去除火花塞中的电荷，所以本发明可以避免火花塞的损坏以保持火花塞处于良好状态 ，保持发动机的效率，并使汽车更安全使用。

公开(公告)号：US06917358B2

公开(公告)日：2005-07-12

申请号：US10385806

申请日：2003-03-11

Applicant: David Cheng

Inventor： David Cheng

IPC: G06F3/033 ,  G06F3/045 ,  G06K11/00 ,  G09G3/36 ,  G09G5/00

CPC classification number: G06F3/045 ,  G06F2203/04113

Abstract: A resistance induction wire layout on a touch panel includes a substrate, a first resistance induction wire, a second resistance induction wire, a third resistance induction wire, a fourth resistance induction wire and a fifth resistance induction wire. The substrate has a first surface being coated with a conductive material. The first, the second, the third, the fourth and the fifth resistance induction wires are laid on the conductive material in a way of being arranged discontinuosly. When a voltage signal entering the touch panel from one of the four nodal points can be reached to each sector of the fifth resistance inducting wire via the first, the second, the third and the fourth resistance inducting wires such that each of the sectors can acquire a consistent voltage value.

Abstract translation: 触摸面板上的电阻感应线布局包括基板，第一电阻感应线，第二电阻感应线，第三电阻感应线，第四电阻感应线和第五电阻感应线。 衬底具有被导电材料涂覆的第一表面。 第一，第二，第三，第四和第五电阻感应线以不连续的方式布置在导电材料上。 当从四个节点之一进入触摸面板的电压信号可以经由第一，第二，第三和第四电阻感应线到达第五电阻感应线的每个扇区，使得每个扇区可以获取 一致的电压值。

公开(公告)号：US06788079B1

公开(公告)日：2004-09-07

申请号：US10066394

申请日：2002-02-01

Applicant: David Cheng

Inventor： David Cheng

IPC: G10R1073

CPC classification number: G01R31/2887

Abstract: A multiple test probe system is disclosed. The multiple test probe system includes a support and a mount pivotally coupled to the support. The mount is capable of pivoting to a number of testing positions. A number of probe assemblies are coupled to the mount and associated with a corresponding number of testing positions. The probe assemblies include a number of electrical contacts coupled to a number of wires in a probe bus regardless of a testing position of the mount. The multiple test probe system further includes an indexing device coupled to the mount to cause the mount to move between the testing positions, whereby the indexing device is a Geneva Mechanism.

Abstract translation: 公开了一种多重测试探针系统。 多个测试探针系统包括支撑件和枢转地联接到支撑件的安装件。 该安装座能够枢转到多个测试位置。 多个探针组件耦合到安装件并与相应数量的测试位置相关联。 探针组件包括耦合到探针总线中的多个电线的多个电触头，而与安装座的测试位置无关。 多个测试探针系统还包括联接到安装件的分度装置，以使安装件在测试位置之间移动，由此分度装置是日内瓦机构。

公开(公告)号：US06280581B1

公开(公告)日：2001-08-28

申请号：US09222545

申请日：1998-12-29

Applicant: David Cheng

Inventor： David Cheng

IPC: C25D1700

CPC classification number: C25D17/001 ,  C25D5/022 ,  C25D5/08 ,  C25D7/123

Abstract: An electroplating apparatus includes a cathode structure, an anode structure, a power supply, and a pressurized electrolyte source. The cathode structure is configured to engage a perimeter portion of a workpiece such as a semiconductor wafer, and the anode structure includes an outlet. The power supply is coupled between the cathode structure and the anode structure. The pressurized electrolyte source is coupled to the anode structure to provide an electrically continuous fluid jet of an electrolyte from the outlet to be directed to a surface of the workpiece that is to be electroplated. A method for electroplating a workpiece includes electrically engaging a perimeter portion of the workpiece with a cathode structure, and directing an electrically continuous fluid jet of electrolyte having positively charged ions towards a surface of the workpiece that is to be electroplated. Preferably, there is a mechanism for providing relative motion between the workpiece and the jet of electrolytes, such as a mechanism for moving the electrically continuous fluid jet of electrolyte to a number of radial positions as the workpiece is rotated around an axis of rotation.

Abstract translation: 电镀设备包括阴极结构，阳极结构，电源和加压电解质源。 阴极结构构造成接合诸如半导体晶片的工件的周边部分，并且阳极结构包括出口。 电源耦合在阴极结构和阳极结构之间。 加压电解质源耦合到阳极结构以从出口提供电连续的电解质流体射流，以引导到要被电镀的工件的表面。 用于电镀工件的方法包括将工件的周边部分与阴极结构电接合，以及将具有带正电荷的离子的电连续流体射流引向待被电镀的工件的表面。 优选地，存在用于在工件和电解质射流之间提供相对运动的机构，例如当工件围绕旋转轴线旋转时将电连续的电解质流体射流移动到多个径向位置的机构。

公开(公告)号：US06249342B1

公开(公告)日：2001-06-19

申请号：US09347956

申请日：1999-07-06

Applicant: David Cheng

Inventor： David Cheng

IPC: G01N2100

CPC classification number: H01L21/67766 ,  G01R31/2831 ,  G01R31/2887

Abstract: Disclosed is a wafer handling and testing apparatus. The wafer handling and testing apparatus includes a support assembly, a wafer handling assembly, and a probe assembly. The support assembly is capable of supporting a wafer to be tested and is also capable of rotating the wafer for testing. The wafer handling assembly is arranged to move the wafer to and from the support assembly. The wafer handling assembly is capable of moving the along a first axis and a second axis. The first axis is preferably orthogonal to the second axis. The wafer probe is arranged to test the wafer when the wafer is placed on the support assembly.

Abstract translation: 公开了一种晶片处理和测试装置。 晶片处理和测试设备包括支撑组件，晶片处理组件和探针组件。 支撑组件能够支撑待测试的晶片，并且还能够使晶片旋转以进行测试。 晶片处理组件被布置成将晶片移动到支撑组件和从支撑组件移动。 晶片处理组件能够沿第一轴线和第二轴线移动。 第一轴优选地与第二轴正交。 晶片探针被布置成当晶片放置在支撑组件上时测试晶片。

公开(公告)号：US5882165A

公开(公告)日：1999-03-16

申请号：US926568

申请日：1997-09-10

Applicant: Dan Maydan ,  Sasson Somekh ,  David Nin-Kou Wang ,  David Cheng ,  Masato Toshima ,  Isaac Harari ,  Peter D. Hoppe

Inventor： Dan Maydan ,  Sasson Somekh ,  David Nin-Kou Wang ,  David Cheng ,  Masato Toshima ,  Isaac Harari ,  Peter D. Hoppe

IPC: H01L21/00 ,  H01L21/677 ,  C23C16/00

CPC classification number: H01L21/67161 ,  H01L21/67184 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748

Abstract: An integrated modular multiple chamber vacuum processing system is disclosed. The system includes a load lock, may include an external cassette elevator, and an internal load lock wafer elevator, and also includes stations about the periphery of the load lock for connecting one, two or several vacuum process chambers to the load lock chamber. A robot is mounted within the load lock and utilizes a concentric shaft drive system connected to an end effector via a dual four-bar link mechanism for imparting selected R--.THETA. movement to the blade to load and unload wafers at the external elevator, internal elevator and individual process chambers. The system is uniquely adapted for enabling various types of IC processing including etch, deposition, sputtering and rapid thermal annealing chambers, thereby providing the opportunity for multiple step, sequential processing using different processes.

Abstract translation: 公开了一种集成的模块化多室真空处理系统。 该系统包括一个加载锁定，可以包括一个外部盒式电梯和一个内部装载锁定晶片升降机，并且还包括围绕负载锁的周边的站，用于将一个，两个或几个真空处理室连接到负载锁定室。 机器人被安装在装载锁中，并利用同轴的驱动系统，该系统通过双重四杆连杆机构连接到末端执行器，用于将选定的R-THETA运动传递给叶片，以在外部升降机，内部升降机 和各个处理室。 该系统独特地适用于实现各种类型的IC处理，包括蚀刻，沉积，溅射和快速热退火室，从而为使用不同工艺的多步骤顺序处理提供了机会。

公开(公告)号：US5691648A

公开(公告)日：1997-11-25

申请号：US558434

申请日：1995-11-16

Applicant: David Cheng

Inventor： David Cheng

IPC: G01B7/06 ,  G01R27/02 ,  G01R31/26 ,  G01R31/02

CPC classification number: G01R27/02 ,  G01B7/06 ,  G01R31/2648

Abstract: A method and apparatus for measuring sheet resistance and thickness of thin films and substrates. A four-point probe assembly engages the surface of a film on a substrate, and the thickness of the substrate is determined from the point of contact between the probes and film. A measuring apparatus then outputs a voltage waveform which applies a voltage to probes of the probe assembly. An inverter inverts the voltage and provides the inverted voltage on another probe of the probe assembly, thus inducing a current in these probes of the four point probe and through the surface of the film. Two other probes measure a voltage in the film created by the current. The voltages on the current probes provide a voltage close to zero at the other probes, thus allowing these other probes to measure voltages with greater precision. The current created by the voltage waveform and the voltage created across the inner probes are measured for each voltage level of the waveform. A sheet resistance of the film is determined by calculating the slope of a least square fit line of the measured current and voltage. The sheet resistance is proportional to the slope of the least square line. The thickness of the film is calculated by dividing the film resistivity by the calculated sheet resistance.

Abstract translation: 一种用于测量薄膜和薄膜的薄层电阻和厚度的方法和装置。 四点探头组件接合衬底上的膜的表面，并且从探针和膜之间的接触点确定衬底的厚度。 然后，测量装置输出对探针组件的探头施加电压的电压波形。 逆变器反转电压并在探针组件的另一个探针上提供反相电压，从而在四点探针的这些探针中并通过膜的表面引起电流。 另外两个探头测量由电流产生的电影中的电压。 电流探头上的电压在其他探头上提供接近零的电压，从而允许其他探头以更高的精度测量电压。 针对波形的每个电压电平测量由电压波形产生的电流和内部探针产生的电压。 通过计算测量的电流和电压的最小二乘拟合线的斜率来确定膜的薄层电阻。 薄层电阻与最小二乘线的斜率成比例。 通过将膜电阻率除以计算的薄层电阻来计算膜的厚度。

公开(公告)号：US5532499A

公开(公告)日：1996-07-02

申请号：US317115

申请日：1994-10-03

Applicant: David Cheng

Inventor： David Cheng

IPC: G01B11/16 ,  G01B11/255 ,  G01B11/30 ,  H01L21/00 ,  G01N21/86

CPC classification number: H01L21/67288 ,  G01B11/16 ,  G01B11/255 ,  G01B11/306

Abstract: A method for measuring surface topography characterized by making multiple scans of the surface with a laser scanning unit and utilizing the multiple scans to create representations of the surface's topography. The surface topography data can also be used to calculate the compressive or tensile stress caused by a thin film applied to the surface of a semiconductor wafer. The apparatus of the present invention scans a laser beam across a surface in an x direction, and detects displacements of a reflected portion of the laser beam in a z direction. A pair of photodetectors are used to translate z direction displacements of the reflected beam into analog signals which are digitized and input into a microcomputer for analysis. The multiple scans of the surface are preferably accomplished by placing the workpiece on a pedestal which can be rotated to various angular positions.

Abstract translation: 一种用于测量表面形貌的方法，其特征在于用激光扫描单元对表面进行多次扫描，并利用多次扫描来创建表面的地形图。 表面形貌数据也可用于计算由施加到半导体晶片表面的薄膜引起的压缩或拉伸应力。 本发明的装置沿x方向扫描激光束的表面，并且检测激光束在z方向上的反射部分的位移。 一对光电探测器用于将反射光束的z方向位移转换为模拟信号，并将其数字化并输入微型计算机进行分析。 表面的多次扫描优选通过将工件放置在可旋转到各种角度位置的基座上来实现。