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公开(公告)号:US20230253021A1
公开(公告)日:2023-08-10
申请号:US18135697
申请日:2023-04-17
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Scott A. Linn , James Michael Gardner , Michael W. Cumbie
CPC classification number: G11C7/24 , B41J2/04541 , B41J2/04543 , B41J2/04551 , B41J2/0458 , G11C7/10 , G11C13/004
Abstract: An integrated circuit to drive a number of fluid actuation devices, comprising a circuit configured to have a memory access state which can be set to one of an enabled state and disabled state. The integrated circuit to include a fluid actuation circuit to transmit selection information for a fluid actuation device, the selection information comprising a data state bit. The integrated circuit to include a memory cell array, configured so that each memory cell is accessible by the memory access state being enabled, and the data state bit being set.
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公开(公告)号:US11701880B2
公开(公告)日:2023-07-18
申请号:US16766519
申请日:2019-02-06
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Scott A. Linn , James Michael Gardner , Michael W. Cumbie
CPC classification number: B41J2/04551 , B41J2/0458 , B41J2/04541 , B41J2/04543 , B41J2/04581 , B41J2/1433 , B41J2/14072 , B41J2/14201 , G11C7/1072 , B41J2002/14491
Abstract: A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays. A data block is associated with each of the plurality of fluidic actuator arrays. The die includes an interface comprising a data pad and a clock pad, wherein a data bit value present at the data pad is loaded into a first data block corresponding to a first fluidic actuator array on a rising clock edge and loaded into a second data block corresponding to a second fluidic actuator array on a falling clock edge.
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公开(公告)号:US11666908B2
公开(公告)日:2023-06-06
申请号:US16608408
申请日:2017-09-14
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie
CPC classification number: B01L3/502715 , B01L3/502707 , B29C70/68 , B01L2200/12 , B01L2300/06 , B01L2300/0627 , B01L2300/0816 , B29K2063/00 , B29L2031/752
Abstract: A microfluidic package may include a fluid passage, a substrate having a substrate surface adjacent an interior of the fluid passage and components inset in the substrate, the components having component surfaces adjacent the fluid passage and substantially flush with the substrate surface.
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公开(公告)号:US11639055B2
公开(公告)日:2023-05-02
申请号:US17859432
申请日:2022-07-07
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: James Michael Gardner , Scott A. Linn , Michael W. Cumbie , Anthony M. Fuller
Abstract: A device includes a first column of contact pads. The device also includes a column of fluid actuation devices disposed longitudinally to the first column of contact pads.
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公开(公告)号:US11559985B2
公开(公告)日:2023-01-24
申请号:US16768023
申请日:2019-02-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Scott A. Linn , James Michael Gardner , Michael W. Cumbie
Abstract: An integrated circuit for a fluidic die including an address bus to communicate a set of addresses, a first group of die configuration functions including a first address driver to drive a first portion of an address of the set of addresses on the address bus, a second group of die configuration functions including a second address driver to drive a second portion of the address of the set of addresses on the address bus, and an array of fluid actuating devices addressable by the set of addresses communicated via the address bus.
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公开(公告)号:US11479036B2
公开(公告)日:2022-10-25
申请号:US16956353
申请日:2019-02-06
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Michael W. Cumbie , James Michael Gardner , Scott A. Linn , George H. Corrigan, III
Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.
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公开(公告)号:US11453222B2
公开(公告)日:2022-09-27
申请号:US16959375
申请日:2019-10-25
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: James Michael Gardner , Sirena Lu , Frank D. Derryberry , Michael W. Cumbie
IPC: B41J2/175
Abstract: A liquid level sensor package for a replaceable print liquid reservoir, the package including a number of heater circuits, each heater circuit including a heater element to dissipate heat and a number of control devices, each control device individually controllable to be electrically connected to the heater element, the heater element to dissipate a different amount of heat when electrically connected to different ones of the control devices.
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公开(公告)号:US11413865B2
公开(公告)日:2022-08-16
申请号:US16768041
申请日:2019-02-06
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: James Michael Gardner , Scott A. Linn , Michael W. Cumbie , Anthony M. Fuller
Abstract: A device includes a first column of contact pads. The device also includes a column of fluid actuation devices disposed longitudinally to the first column of contact pads.
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公开(公告)号:US20220219452A1
公开(公告)日:2022-07-14
申请号:US17706529
申请日:2022-03-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: James Michael Gardner , Scott A. Linn , Michael W. Cumbie
IPC: B41J2/045
Abstract: A print component includes a plurality of data pads, a clock pad to receive an intermittent clock signal, and a plurality of actuator groups each corresponding to a different liquid type and to a different one of the data pads. Each actuator group includes a plurality of configuration functions, an array of fluid actuators, and an array of memory elements including a first portion corresponding to the plurality of configuration functions and a second portion corresponding to the array of fluid actuators. Each time the intermittent clock signal is present on the clock pad, the array of memory elements to serially load a segment of data bits from the corresponding data pad, including loading a first portion of data bits into the first portion of memory elements, and loading a second portion of data bits into the second portion of memory elements.
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公开(公告)号:US11364496B2
公开(公告)日:2022-06-21
申请号:US16494160
申请日:2017-04-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie , Viktor Shkolnikov
IPC: B01L3/00
Abstract: An apparatus includes a polymer base layer having a surface. A die has a surface that is substantially coplanar with the surface of the polymer base layer. The die includes a fluidic actuator to control fluid flow across the surface of the die. A fluidic channel is coupled to the polymer base layer to provide a fluidic interconnect between the die and a fluidic input/output port.
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