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公开(公告)号:US11084210B2
公开(公告)日:2021-08-10
申请号:US16072169
申请日:2016-05-17
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Ning Ge , Paul J. Benning , Lihua Zhao , Steven J. Simske , Chandrakant Patel
IPC: B29C64/10 , B29C64/165 , B29C64/393 , B29C64/245 , B29C64/295 , B29C64/336 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y50/02
Abstract: According to an example, a three-dimensional (3D) printer may include a first delivery device to selectively deposit a fusing agent onto a layer of build materials and a second delivery device to deposit coolant droplets at tuned drop weights onto the layer of build materials. The 3D printer may also include a controller to control the second delivery device to selectively deposit the coolant droplets at the tuned drop weights onto selected areas of the build material layer, in which the drop weights of the selectively deposited coolant droplets are tuned to provide a thermal balance between multiple areas of the build material layer during application of fusing radiation onto the build material layer.
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公开(公告)号:US11038033B2
公开(公告)日:2021-06-15
申请号:US15306740
申请日:2014-04-30
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Reynaldo V Villavelez , Ning Ge , Mun Hooi Yaow , Erik D Ness , David B Novak
IPC: H01L29/43 , H01L29/423 , H01L21/28 , H01L49/02
Abstract: The present subject matter relates to an integrated circuit. The integrated circuit includes a first metal layer and a second metal layer capacitively coupled to the first metal layer through a dielectric layer. Further, the second metal layer includes an electron leakage path to provide for leakage of charge from the second metal layer in a predetermined leak time period.
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公开(公告)号:US10978327B2
公开(公告)日:2021-04-13
申请号:US16332147
申请日:2016-10-10
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Ning Ge , Ya-Ling Chang , Helen A. Holder
IPC: H01L21/677 , G03F7/16 , H01L21/67
Abstract: A micro-structure transfer system may include a printhead and a pressure control device to control a pressure of fluid coupled with the printhead. The pressure control device forms a meniscus of fluid at a number of nozzles defined within the printhead to pick up a number of micro-structures. A printhead for transferring micro-structures includes a number of fluid chambers, a number of nozzles defined in an orifice plate through which fluid may exit the chambers, and a pressure control device to control a pressure of fluid within each of the chambers. The pressure control device forms a meniscus of the fluid at a number of nozzles defined within the printhead to pick up a number of micro-structures.
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公开(公告)号:US10946584B2
公开(公告)日:2021-03-16
申请号:US16071018
申请日:2016-04-11
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Ning Ge , James Elmer Abbott, Jr. , Steven J Simske , Paul J Benning , Lihua Zhao
IPC: B29C64/165 , B22F3/105 , B28B1/00 , B22F1/02 , B33Y30/00 , B33Y70/00 , B29C67/00 , B29C64/153 , B22F10/00 , B22F10/10 , B22F9/04
Abstract: The present disclosure is drawn to a particulate build material for three-dimensional printing. The particulate build material can include a plurality of particulates, wherein individual particulates include a particulate core having a photosensitive coating applied to a surface of the particulate core. The particulate core includes a metal, a ceramic, or both a metal and a ceramic. The photosensitive coating includes a polymer having a photosensitive agent suspended or attached therein.
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公开(公告)号:US10714179B2
公开(公告)日:2020-07-14
申请号:US16323072
申请日:2016-10-07
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Ning Ge , Steven J Simske , David George
IPC: G11C13/00 , G11C14/00 , H01L27/108 , H01L27/24 , H01L45/00
Abstract: In some examples, a hybrid memory device includes multiple memory cells, where a given memory cell of the multiple memory cells includes a volatile memory element having a plurality of layers including electrically conductive layers and a dielectric layer between the electrically conductive layers, and a non-volatile resistive memory element to store different data states represented by respective different resistances of the non-volatile resistive memory element, the non-volatile resistive memory element having a plurality of layers including electrically conductive layers and a resistive switching layer between the electrically conductive layers of the non-volatile resistive memory element.
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公开(公告)号:US10656093B2
公开(公告)日:2020-05-19
申请号:US15569767
申请日:2015-07-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Steven Barcelo , Ning Ge , Zhiyong Li
Abstract: In one example, a structure for surface enhanced Raman spectroscopy includes a cluster of metal nanoparticles in a hole.
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公开(公告)号:US10571399B2
公开(公告)日:2020-02-25
申请号:US15570363
申请日:2015-07-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Steven Barcelo , Ning Ge , Kevin Dooley , Zhiyong Li
Abstract: In one example, an analyte detection package includes a substrate, surface-enhanced luminescence (SEL) structures extending from the substrate and a low wettability housing. The SEL structures have a first wettability for a given liquid. The low wettability housing extends from the substrate to form a chamber between the housing of the substrate about the SEL structures to receive an analyte containing solution. The housing has an inner surface adjacent the chamber, wherein the inner surface has a second wettability for the given liquid less than the first wettability.
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公开(公告)号:US20200043902A1
公开(公告)日:2020-02-06
申请号:US16472925
申请日:2017-04-24
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Ning Ge , Ya Ling Chang , Helen A. Holder
IPC: H01L25/075 , H01L33/50
Abstract: A micro light-emitting diode (LED) display assembly includes a backplane, a passivation layer on the backplane, a micro LED on the passivation layer, and a non-transparent metal housing on the passivation layer, wherein the housing includes a base portion on the passivation layer, a sidewall portion upwardly extending from the base portion, a cap portion connected at a top of the sidewall portion, an orifice in the cap portion, and a notch in the cap portion and adjacent to the orifice. The assembly also includes a translucent filter positioned in the notch and covering the orifice, and a pocket defined by an enclosed area in between the sidewall portion, the cap portion, the filter, and the passivation layer, wherein the micro LED is encased within the pocket such that light transmitted from the micro LED directly hits and passes through the filter.
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公开(公告)号:US20200043761A1
公开(公告)日:2020-02-06
申请号:US16340229
申请日:2016-10-10
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Ning Ge , Ya-Ling Chang , Helen A. Holder
IPC: H01L21/67 , H01L25/075 , H01L21/68
Abstract: A stamp for picking and placing multiple components in fixed separations to each other includes: a silicon substrate with a plurality of etched pits, wherein the etched pits correspond to a size and geometry of the components and a metal layer covering an inner surface of the plurality of etched pits.
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公开(公告)号:US20200001306A1
公开(公告)日:2020-01-02
申请号:US16486134
申请日:2017-02-14
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Ning Ge , Paul Howard Mazurkiewicz , Helen A. Holder , Peter A. Seiler , Raphael Gay , Tom J. Searby
Abstract: In an example, an air filter assembly includes an air filter to remove particulates from air flowing through the air filter, sense electrodes coupled to the air filter, the sense electrodes spaced apart in a direction that is transverse to a direction of a flow of the air, a sense interconnects to couple the sense electrodes to a first power source to drive a sense electrode of the sense electrodes to a sense power, charge electrodes coupled to the air filter, where the charge electrodes are spaced apart from and adjacent to the sense electrodes, and charge interconnects to couple the charge electrodes to a second power source to drive a charge electrode of the charge electrodes to a charge power different from the sense power.
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