Dynamic power budget allocation in multi-processor system

    公开(公告)号:US11493974B2

    公开(公告)日:2022-11-08

    申请号:US16994073

    申请日:2020-08-14

    申请人: Intel Corporation

    IPC分类号: G06F1/00 G06F1/28

    摘要: Dynamic power budget allocation in a multi-processor system is described. In an example, an apparatus includes a plurality of processor units; and a power control component, the power control component to monitor power utilization of each of the plurality of processor units, wherein power consumed by the plurality of processor units is limited by a global power budget. The apparatus is to assign a workload to each of the processor units and is to establish an initial power budget for operation of each of the processor units, and, upon the apparatus determining that one or more processor units require an increased power budget based on one or more criteria, the apparatus is to dynamically reallocate an amount of the global power budget to the one or more processor units.

    Enabling product SKUS based on chiplet configurations

    公开(公告)号:US11386521B2

    公开(公告)日:2022-07-12

    申请号:US17161941

    申请日:2021-01-29

    申请人: Intel Corporation

    IPC分类号: G06T1/20 G06F13/40

    摘要: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.