公开(公告)号：US4051672A

公开(公告)日：1977-10-04

申请号：US598075

申请日：1975-07-22

申请人： Kenji Masaki ,  Kenji Okamura

发明人： Kenji Masaki ,  Kenji Okamura

IPC分类号： F02B75/10 ,  F02B1/06 ,  F02B15/00 ,  F02D41/14 ,  F02M7/12 ,  F02M7/133 ,  F01N3/10

CPC分类号： F02B1/06 ,  F02D41/1475 ,  F02M7/133

摘要： At relatively low afterburner temperatures cylinders of an engine are separately fed with rich and lean mixtures, while at high speeds and excessive high afterburner temperatures the cylinders are fed with only the lean mixture.

公开(公告)号：US08524422B2

公开(公告)日：2013-09-03

申请号：US13163338

申请日：2011-06-17

申请人： Kenji Okamura ,  Masabumi Ito ,  Hiroshi Kojima

发明人： Kenji Okamura ,  Masabumi Ito ,  Hiroshi Kojima

IPC分类号： G03F1/24 ,  G03F1/22

CPC分类号： G03F1/24 ,  B82Y10/00 ,  B82Y40/00 ,  Y10T428/24

摘要： The present invention relates to a low expansion glass substrate which serves as a substrate of a reflective mask used in a lithography step of semiconductor production steps, wherein two side surfaces positioned to face each other among side surfaces formed along a periphery of the low expansion glass substrate, each have a flatness of 25 μm or less.

摘要翻译： 本发明涉及用作半导体制造步骤的光刻步骤中使用的反射掩模的基板的低膨胀玻璃基板，其中两个侧表面沿着低膨胀玻璃的周边形成的侧表面彼此相对定位 基材，平均度为25μm以下。

公开(公告)号：US08337262B2

公开(公告)日：2012-12-25

申请号：US13121555

申请日：2010-04-22

申请人： Junichi Ono ,  Hiroki Hirai ,  Tetsuji Tanaka ,  Hiroki Shimoda ,  Takuji Otsuka ,  Masaaki Tabata ,  Kenji Okamura ,  Kazuhiro Aoki ,  Hiroshi Kobayashi ,  Takahito Nakashima

发明人： Junichi Ono ,  Hiroki Hirai ,  Tetsuji Tanaka ,  Hiroki Shimoda ,  Takuji Otsuka ,  Masaaki Tabata ,  Kenji Okamura ,  Kazuhiro Aoki ,  Hiroshi Kobayashi ,  Takahito Nakashima

IPC分类号： H01R4/18

CPC分类号： H01R4/185 ,  H01R4/188 ,  H01R4/62

摘要： An electric wire with a terminal connector includes an electric wire and a female terminal connector crimped onto a core wire exposed at the electric wire. A female terminal connector has a wire barrel having a surface to be applied to the core wire. The surface has a plurality of recesses formed therein. Each recess has a parallelogram-shaped opening edge. The opening edge of the recess includes a pair of first opening edges that are parallel to each other and a pair of second opening edges that are parallel to each other and different from the first opening edges. The recesses are spaced in the extending direction of the first opening edges and are spaced in the extending direction of the second opening edges.

摘要翻译： 具有端子连接器的电线包括电线和压接在暴露于电线的芯线上的母端子连接器。 母端子连接器具有具有要施加到芯线的表面的线筒。 表面上形成有多个凹部。 每个凹槽具有平行四边形形状的开口边缘。 凹部的开口边缘包括彼此平行的一对第一开口边缘和彼此平行且不同于第一开口边缘的一对第二开口边缘。 所述凹部在所述第一开口边缘的延伸方向上间隔开，并且在所述第二开口边缘的延伸方向上间隔开。

公开(公告)号：US20120228024A1

公开(公告)日：2012-09-13

申请号：US13499437

申请日：2010-02-17

申请人： Yasuo Omori ,  Hiroki Hirai ,  Tetsuji Tanaka ,  Tatsuo Tamagawa ,  Motohiro Yokoi ,  Kenji Okamura ,  Takeshi Tsuji ,  Toshifumi Ichio ,  Toshio Shimizu ,  Takayuki Suzuki

发明人： Yasuo Omori ,  Hiroki Hirai ,  Tetsuji Tanaka ,  Tatsuo Tamagawa ,  Motohiro Yokoi ,  Kenji Okamura ,  Takeshi Tsuji ,  Toshifumi Ichio ,  Toshio Shimizu ,  Takayuki Suzuki

IPC分类号： H02G3/02 ,  H01R43/00

CPC分类号： H01R31/08 ,  B60R16/0207 ,  H01B13/012 ,  H01B13/01263 ,  H01R43/28 ,  Y10T29/49174 ,  Y10T29/49194

摘要： A wire harness capable of forming a short circuit by use of a plurality of electric wires and a joint connector while being slenderized and reduced in weight. The wire harness includes a plurality of circuit modules each forming a short circuit. Each of the circuit modules, includes a plurality of electric wires, and a plurality of external-connection connectors, connected to respective first ends of the electric wires, and a joint connector, connected to respective second ends of the electric wires to short-circuit the electric wires. The electric wires constituting the circuit modules are bundled together so that the joint connector of each of the circuit modules is discretely disposed so as to be located in a vicinity of at least one of the external-connection connectors included in the circuit module, around which electric wires a binding tape is wound.

摘要翻译： 一种线束，其能够通过使用多根电线和接头连接器而形成短路，同时细长化并且减轻重量。 线束包括各自形成短路的多个电路模块。 每个电路模块包括多根电线，以及连接到电线的相应第一端的多个外部连接连接器，以及连接到电线的各个第二端的接头连接器以短路 电线。 构成电路模块的电线被捆扎在一起，使得每个电路模块的接头连接器离散地设置成位于包括在电路模块中的至少一个外部连接连接器的附近，在该附近 电线缠绕绑带。

公开(公告)号：US20120004816A1

公开(公告)日：2012-01-05

申请号：US13254935

申请日：2010-03-05

申请人： Kenji Okamura ,  Masashi Ichihara

发明人： Kenji Okamura ,  Masashi Ichihara

IPC分类号： E02F9/20 ,  E02F9/22 ,  G06F19/00

CPC分类号： E02F9/2207 ,  E02F9/2235 ,  E02F9/26 ,  F02D29/04

摘要： A controller of a construction machine includes a target command value computing unit generating a speed target command value for normal motion of a working equipment based on a manipulating signal, a target command value correcting unit correcting the command value, and a command signal output unit outputting a command signal to a driving device based on the corrected speed target command value. The target command value correcting unit includes a vibration suppressing unit generating a speed target command value for vibration suppression to suppress generation of vibrations in the working equipment based on the command value, a peak value recognizing unit recognizing a peak value of the command value based on the command value sequentially generated by the target command value computing unit, and a target command value compositing unit compositing the command values according to the peak value to correct the command value.

摘要翻译： 施工机械的控制器包括：目标指令值计算单元，其基于操作信号生成用于工作设备的正常运动的速度目标指令值;校正指令值的目标指令值校正单元;以及命令信号输出单元 基于校正后的速度目标指令值向驱动装置发出指令信号。 目标指令值校正单元包括振动抑制单元，该振动抑制单元基于指令值产生用于振动抑制的速度目标指令值，以抑制工作设备中的振动产生;峰值识别单元，基于命令值识别该命令值的峰值 由目标指令值计算单元依次产生的指令值，以及目标指令值合成单元，根据峰值合成指令值，以校正指令值。

公开(公告)号：USD647483S1

公开(公告)日：2011-10-25

申请号：US29370404

申请日：2010-07-13

申请人： Yuichi Goto ,  Kenji Okamura

设计人： Yuichi Goto ,  Kenji Okamura

公开(公告)号：US07998645B2

公开(公告)日：2011-08-16

申请号：US12815091

申请日：2010-06-14

申请人： Koji Otsuka ,  Kenji Okamura

发明人： Koji Otsuka ,  Kenji Okamura

IPC分类号： G03F1/00 ,  C03C27/00

CPC分类号： G01B9/02065 ,  C03C15/02 ,  C03C19/00 ,  C03C23/006 ,  C03C2204/08 ,  G01B9/02057 ,  G01B9/0209 ,  G01B11/30 ,  G03F1/60 ,  H01J2237/0812 ,  Y10T428/24355

摘要： A glass substrate obtained by a method including measuring flatness of a glass substrate surface and measuring concentration distribution of dopant in the substrate. Processing conditions of the surface are set up for each site of the substrate based on results from the measuring the flatness and the measuring the distribution, and the finishing is carried out while keeping an angle formed by normal line of the substrate and incident beam onto the surface at from 30 to 89°. The surface is subjected to second finishing for improving an RMS in a high spatial frequency region. The surface after the second finishing satisfies the requirements: an RMS slope in the region that 5 μm

摘要翻译： 一种玻璃基板，其通过包括测量玻璃基板表面的平坦度和测量基板中掺杂剂的浓度分布的方法获得。 基于测量平面度和测量分布的结果，为基板的每个部位设置表面的加工条件，并且在将基板和入射光束的法线形成的角度保持在 表面为30〜89°。 对表面进行第二次精加工以改善高空间频率区域中的均方根。 第二次修整后的表面满足以下要求：在5μm（λ）（空间波长）<1mm的区域内的RMS斜率不大于0.5mRad，并且在250nm <λ（空间波长）的区域中的RMS斜率， <5μm不大于0.6mRad。

公开(公告)号：US20110009014A1

公开(公告)日：2011-01-13

申请号：US12867965

申请日：2009-06-10

申请人： Junichi Ono ,  Hiroki Hirai ,  Tetsuji Tanaka ,  Hiroki Shimoda ,  Takuji Otsuka ,  Kenji Okamura ,  Masaaki Tabata

发明人： Junichi Ono ,  Hiroki Hirai ,  Tetsuji Tanaka ,  Hiroki Shimoda ,  Takuji Otsuka ,  Kenji Okamura ,  Masaaki Tabata

IPC分类号： H01R4/18

CPC分类号： H01R4/185 ,  H01R4/188 ,  H01R4/62 ,  H01R13/11

摘要： A plurality of recesses are formed on a surface of a wire barrel where an electric wire is provided. In a state before the electric wire is crimped onto the wire barrel, at least one of sides comprising rims of an opening of each recess of a quadrangular shape is a crossing side crossing at an angle of from 85 degrees to 95 degrees to an extending direction. In a state before the electric wire is crimped onto the wire barrel 16, the crossing sides of a plurality of recesses positioned adjacent to each other in the extending direction are so arranged as to overlap with each other in the extending direction.

摘要翻译： 在设置有电线的线筒的表面上形成有多个凹部。 在电线被压接到线筒之前的状态下，包括四边形凹槽的开口的边缘的至少一个侧面是与延伸方向成85度至95度的角度的交叉侧 。 在电线被压接到线筒16上之前的状态下，沿着延伸方向彼此相邻设置的多个凹部的交叉侧被布置成在延伸方向上彼此重叠。

公开(公告)号：US07803280B2

公开(公告)日：2010-09-28

申请号：US12475878

申请日：2009-06-01

申请人： Koji Otsuka ,  Kenji Okamura

发明人： Koji Otsuka ,  Kenji Okamura

IPC分类号： B44C1/22 ,  C03C15/00

CPC分类号： G01B9/02065 ,  C03C15/02 ,  C03C19/00 ,  C03C23/006 ,  C03C2204/08 ,  G01B9/02057 ,  G01B9/0209 ,  G01B11/30 ,  G03F1/60 ,  H01J2237/0812 ,  Y10T428/24355

摘要： The invention provides a method in which waviness generated on a glass substrate surface during pre-polishing is removed, thereby finishing the glass substrate to have a surface excellent in flatness. The method for finishing a pre-polished glass substrate uses ion beam etching, gas cluster ion beam etching or plasma etching, the method including: a step of measuring flatness of the glass substrate surface using a shape measurement unit, and a step of measuring a concentration distribution of the dopant contained in the glass substrate. Processing conditions of the glass substrate surface are set up for each site of the glass substrate based on the results obtained from the step of measuring flatness and the step of measuring a concentration distribution of the dopant. Finishing includes keeping an angle formed by a normal line of the glass substrate and an incident beam onto the glass substrate at from 30° to 89°.

摘要翻译： 本发明提供了一种在预抛光期间在玻璃基板表面上产生的波纹被去除的方法，从而使玻璃基板整理成具有优异的平坦度的表面。 用于精加工预抛光玻璃基板的方法使用离子束蚀刻，气体簇离子束蚀刻或等离子体蚀刻，该方法包括：使用形状测量单元测量玻璃基板表面的平坦度的步骤，以及测量 包含在玻璃基板中的掺杂剂的浓度分布。 基于从测量平坦度的步骤和测量掺杂剂的浓度分布的步骤获得的结果，为玻璃基板的每个部位设置玻璃基板表面的加工条件。 整理包括将玻璃基板的法线和入射光束形成的角度保持在玻璃基板上30°至89°。

公开(公告)号：US07695290B2

公开(公告)日：2010-04-13

申请号：US11887790

申请日：2006-04-21

申请人： Hiroshi Nakano ,  Masahide Hio ,  Kenji Okamura ,  Hiroki Hirai ,  Hiroomi Hiramitsu ,  Osamu Hirabayashi

发明人： Hiroshi Nakano ,  Masahide Hio ,  Kenji Okamura ,  Hiroki Hirai ,  Hiroomi Hiramitsu ,  Osamu Hirabayashi

IPC分类号： H01R12/00

CPC分类号： H01R12/707 ,  H01R12/712 ,  H01R43/0256

摘要： A board connector (1) has a housing (10) and terminal fittings (20) penetrate through the back wall (11) of the housing (10). A board connecting portion (21) of each terminal fitting (20) penetrates through the back wall (11) and is solder-connected to a board (2). The housing (10) has a heat transfer inhibiting portion for inhibiting heat transfer to the back wall (11). The heat transfer inhibiting portion has a through-hole (13) or heat-insulating grooves (17) in the back wall (11). As a result, heat transfer to the back wall (11) is inhibited and deformation of the back wall (11) due to thermal expansion also is inhibited. Consequently, it is possible to prevent the terminal fittings (20) from separating from the board (2) and going into a state of being not solder-connected thereto.

摘要翻译： 板连接器（1）具有壳体（10），并且端子接头（20）穿过壳体（10）的后壁（11）。 每个端子接头（20）的板连接部分（21）穿过后壁（11）并焊接到板（2）上。 壳体（10）具有用于抑制向后壁（11）传热的传热阻止部。 传热抑制部分在后壁（11）中具有通孔（13）或绝热槽（17）。 结果，抑制了向后壁（11）的热传递，并且抑制了由于热膨胀导致的后壁（11）的变形。 因此，可以防止端子配件（20）与板（2）分离并进入不与其焊接连接的状态。