摘要:
The invention provides a process for making a gradient index optical element having a precisely parabolic configuration of refractive index profile. After a concentration profile is imparted across a gel prepared by a sol-gel technique, the concentration profile is fixed. In this case, the treatment with a concentration profile-fixing solution is carried out at a temperature higher than that at which the treatment with a concentration profile-imparting solution is carried out, whereby the rate of fixing the concentration profile is so higher than that of imparting the concentration profile, so that any possible deformation of the concentration profile formed at the concentration profile-imparting step is reduced or inhibited.
摘要:
An information processing apparatus includes a change point detection unit for obtaining dot change point positions and the number of change points in units of scanning lines by scanning a dot pattern in a predetermined direction, a discrimination unit for discriminating start and end positions of a dot set by scanning the dot pattern in the predetermined direction so as to detect appearance of a noncontinuous dot pattern in a direction substantially perpendicular to a direction of the scanning line, and a generation unit for generating information representing, as a relative value with respect to the immediately preceding scanning line, the change point positions and the number of change points detected by the change point detection unit and the start and end positions of the dot set discriminated by the discrimination unit in accordance with an external instruction.
摘要:
A carrier for transferring a semiconductor wafer one by one includes a tray portion to load the wafer thereon the wafer submitted for processing, the tray portion having a groove which is formed therein for unloading the wafer therefrom, and mechanism for positioning the tray portion relative to a predetermined location of the drawer. A handling apparatus for the carrier includes a sampling case mounted to the frame of a wafer probing machine and having formed therein a first opening communicating with the outside of the machine and a second opening communicating with the interior of the machine, a drawer adapted to go into and come out of the case through the first opening and plural pairs of guide-rollers to guide the drawer between the first and second openings of the case. To take a sample from among the wafers in the machine, the carrier is loaded on the drawer, the carrier held on the drawer is pushed through the second opening into the case, wafer is picked out by a full-automatic transferring apparatus from a wafer storage, the wafer is inserted through the second opening into the case, the wafer is placed on the carrier by guiding it through the groove of the carrier and the drawer is pulled out.
摘要:
The transfer of a duplicate electronic document between image forming devices is done with an electronic document that is formed of only resolution-independent vector data and the like, and a normal printing of the duplicate electronic document or printing of different resolution is performed by developing the vector data. In high-quality printing of the duplicate electronic document, a Fill Map included in the original document the information indicating the location of an electronic document of copy source that is embedded in a metadata specifies is obtained, and this printing is made using the Fill Map.
摘要:
A control method of an image reading apparatus for transferring image information obtained by reading an original to a server apparatus has: a reading step of reading the original; a forming step of forming electronic data corresponding to the original read in the reading step; a designation step of designating an attribute of the original; a decision step of deciding a page whose electronic data is to be formed in the forming step in accordance with the designated original attribute; and a transmission step of transmitting the electronic data formed in the forming step to the server apparatus.
摘要:
A method of refilling an ink bag that is used in an ink jet recorder, the ink bag is initially filled with ink through an opening in the bag, and is sealed after the ink bag is initially filled. The method comprises the steps of removing the ink bag from the ink jet recorder, positioning the ink bag, inserting an ink needle into a separate opening in the ink bag that is different than the first opening through which the ink bag is initially filled with ink, discharging ink from the ink bag through the second opening, and charging the ink bag through the second opening with a specified quantity of ink.
摘要:
A method of refilling an ink bag of an ink cartridge for use in an ink-jet recorder. The method includes first removing the ink cartridge and ink bag from the ink-jet recorder. The ink bag may then be refilled by positioning the ink bag on a surface, inserting an ink needle into a port of the ink bag, and by discharging ink from the ink bag and charging the ink bag with a specified quantity of ink.
摘要:
An electric probing test machine including a test stage unit which is constructed as an independent component of at least one system and used to test the electrical characteristics of a wafer by having the wafer on the stage contacted by a multitude of probes and a loading/unloading unit which is constructed as an independent component of at least one system and used to bring a wafer from a wafer cassette to the stage of the test stage unit or from the stage of the test stage unit to the wafer cassette. The loading/unloading unit is combined with the test stage unit in such a way that the loading/unloading unit can be separated and moved away from the test stage unit.
摘要:
A transfer apparatus for carrying a semiconductor wafer into a wafer cassette comprising an arm to load a semiconductor wafer thereon, a moving mechanism to move the arm to a wafer cassette, a chucking device to have a wafer attracted to the arm, and an auxiliary mechanism to push a wafer and adjust the position of the wafer to the inlet of a wafer cassette when the wafer comes into contact with the side wall of the wafer cassette.