Method for manufacturing an energy storage device and structure therefor
    63.
    发明授权
    Method for manufacturing an energy storage device and structure therefor 有权
    储能装置的制造方法及其结构

    公开(公告)号:US08629488B2

    公开(公告)日:2014-01-14

    申请号:US12108361

    申请日:2008-04-23

    IPC分类号: G11C11/00

    CPC分类号: H01L28/75

    摘要: An energy storage device such as a metal-insulator-metal capacitor and a method for manufacturing the energy storage device. The metal-insulator-metal capacitor includes an insulating material positioned between a bottom electrode or bottom plate and a top electrode or top plate. The surface area of the bottom electrode is greater than the surface area of the insulating material and the surface area of the insulating material is greater than the surface area of the top electrode. The top electrode and the insulating layer have edges that are laterally within and spaced apart from edges of the bottom electrode. A protective layer covers the top electrode, the edges of the top electrode, and the portions of the insulating layer that are uncovered by the top electrode. The protective layer serves as an etch mask during the formation of the bottom electrode.

    摘要翻译: 诸如金属 - 绝缘体 - 金属电容器的能量存储装置和用于制造储能装置的方法。 金属 - 绝缘体 - 金属电容器包括位于底部电极或底板与顶部电极或顶板之间的绝缘材料。 底部电极的表面积大于绝缘材料的表面积,并且绝缘材料的表面积大于顶部电极的表面积。 顶部电极和绝缘层具有横向在底部电极的边缘内并与其间隔开的边缘。 保护层覆盖顶部电极,顶部电极的边缘和绝缘层的未被顶部电极覆盖的部分。 在形成底部电极期间,保护层用作蚀刻掩模。

    Non-tensioned carbon nanotube switch design and process for making same
    65.
    发明授权
    Non-tensioned carbon nanotube switch design and process for making same 有权
    非张力碳纳米管开关的设计与制造过程

    公开(公告)号:US07928521B1

    公开(公告)日:2011-04-19

    申请号:US11142725

    申请日:2005-05-31

    IPC分类号: H01L29/82

    摘要: The invention comprises a carbon nanotube switch suitable for use in an integrated circuit structure and capable of being moved from a first position in a first plane in the switch to a second position in a second plane in the switch using approximately the same energy as required to move the switch from the second position back to the first position. The switch comprises a flexible carbon nanotube strip secured clamped at one end in a first plane in a switching chamber, and secured or clamped, at the opposite end of the carbon nanotube, in a second plane in the switching chamber, which is parallel to the first plane but spaced therefrom, to permit the central portion of the carbon nanotube strip to move in the chamber between a first position in the first plane and in electrical contact with one or more first electrodes and a second position in the second plane and in electrical contact with one or more second electrodes.

    摘要翻译: 本发明包括一种适用于集成电路结构的碳纳米管开关,其能够使用开关中的第一平面中的第一位置移动到开关中的第二平面中的第二位置,使用大约相同的能量 将开关从第二个位置移回到第一个位置。 开关包括柔性碳纳米管条,其固定在切换室中的第一平面中的一端处夹持,并且在碳纳米管的相对端处固定或夹紧在开关室中的平行于第二平面的第二平面中 第一平面但与其间隔开,以允许碳纳米管条的中心部分在室中在第一平面中的第一位置和与一个或多个第一电极电连接并且在第二平面中的第二位置和电气 与一个或多个第二电极接触。

    Self-aligned cell integration scheme
    66.
    发明授权
    Self-aligned cell integration scheme 失效
    自对准单元集成方案

    公开(公告)号:US07915122B2

    公开(公告)日:2011-03-29

    申请号:US11312849

    申请日:2005-12-20

    IPC分类号: H01L21/336

    摘要: A method of forming a self-aligned logic cell. A nanotube layer is formed over the bottom electrode. A clamp layer is formed over the nanotube layer. The clamp layer covers the nanotube layer, thereby protecting the nanotube layer. A dielectric layer is formed over the clamp layer. The dielectric layer is etched. The clamp layer provides an etch stop and protects the nanotube layer. The clamp layer is etched with an isotropic etchant that etches the clamp layer underneath the dielectric layer, creating an overlap of the dielectric layer, and causing a self-alignment between the clamp layer and the dielectric layer. A spacer layer is formed over the nanotube layer. The spacer layer is etched except for a ring portion around the edge of the dielectric layer. The nanotube layer is etched except for portions that are underlying at least one of the clamp layer, the dielectric layer, and the spacer layer, thereby causing a self-alignment between the clamp layer, the overlap to the dielectric layer, the spacer layer, and the nanotube layer.

    摘要翻译: 一种形成自对准逻辑单元的方法。 在底部电极上形成纳米管层。 在纳米管层上形成夹层。 夹层覆盖纳米管层,从而保护纳米管层。 在钳位层上形成电介质层。 蚀刻介电层。 钳位层提供蚀刻停止并保护纳米管层。 用各向同性蚀刻剂蚀刻钳夹层,蚀刻介质层下方的夹层,产生电介质层的重叠,并引起钳位层和电介质层之间的自对准。 在纳米管层上形成间隔层。 除了围绕电介质层的边缘的环形部分之外,蚀刻间隔层。 除了夹持层,电介质层和间隔层中的至少一个的部分以外,蚀刻纳米管层,从而导致夹紧层之间的自对准,与电介质层的重叠,间隔层, 和纳米管层。

    Apparatus for removal of vaporized hydrogen peroxide from a region
    68.
    发明授权
    Apparatus for removal of vaporized hydrogen peroxide from a region 有权
    用于从区域去除蒸发的过氧化氢的装置

    公开(公告)号:US07850925B2

    公开(公告)日:2010-12-14

    申请号:US11763574

    申请日:2007-06-15

    IPC分类号: A62B7/08 A61L9/00

    摘要: A method and apparatus for aerating a region exposed to a gaseous/vaporous sterilant. A catalytic destroyer and a reactive chemical unit are used to reduce the concentration of the gaseous/vaporous sterilant within the region. The reactive chemical unit includes a chemistry that is chemically reactive with the gaseous/vaporous sterilant. In one embodiment, the gaseous/vaporous sterilant is vaporized hydrogen peroxide and the chemistry of the reactive chemical unit includes thiosulfate and iodide.

    摘要翻译: 用于对暴露于气体/蒸气灭菌剂的区域进行曝气的方法和装置。 催化破坏剂和反应性化学单元用于降低该区域内气态/蒸气灭菌剂的浓度。 反应性化学单元包括与气态/蒸气灭菌剂化学反应的化学物质。 在一个实施方案中,气态/蒸气灭菌剂是蒸发的过氧化氢,并且反应性化学单元的化学性质包括硫代硫酸盐和碘化物。

    Methods and structure for forming copper barrier layers integral with semiconductor substrates structures
    69.
    发明授权
    Methods and structure for forming copper barrier layers integral with semiconductor substrates structures 有权
    用于形成与半导体衬底结构成一体的铜阻挡层的方法和结构

    公开(公告)号:US07646077B2

    公开(公告)日:2010-01-12

    申请号:US12191171

    申请日:2008-08-13

    IPC分类号: H01L23/58 H01L21/4763

    摘要: The present invention is directed to improved dielectric copper barrier layer and related interconnect structures. One structure includes a semiconductor substrate having a copper line. An insulating layer formed of at least one of silicon and carbon is formed on the underlying copper line. An opening is formed in the insulating layer to expose a portion of the copper line. The inner surface of the opening in the insulating layer has a dielectric barrier layer formed thereon to prevent the diffusion of copper into the insulating layer. A copper plug is formed to fill the opening and make electrical contact with the underlying copper interconnect structure. Aspects of the invention also include methods for forming the dielectric copper barrier layers and associate copper interconnects to the underlying copper lines.

    摘要翻译: 本发明涉及改进的介电铜阻挡层和相关互连结构。 一种结构包括具有铜线的半导体衬底。 在下面的铜线上形成由硅和碳中的至少一种形成的绝缘层。 在绝缘层中形成开口以露出铜线的一部分。 绝缘层中的开口的内表面具有形成在其上的电介质阻挡层,以防止铜扩散到绝缘层中。 形成铜塞以填充开口并与下面的铜互连结构电接触。 本发明的方面还包括用于形成电介质铜阻挡层和将铜互连连接到下面的铜线的方法。