Bottom grain unloader
    61.
    发明授权
    Bottom grain unloader 失效
    底部卸料机

    公开(公告)号:US4029219A

    公开(公告)日:1977-06-14

    申请号:US641509

    申请日:1975-12-17

    IPC分类号: B65G65/46

    CPC分类号: B65G65/466

    摘要: An improved bottom grain bin auger discharge construction includes a hopper centrally disposed in the bottom of a grain storage bin. A grain tube extends from the hopper to the outside of the bin and includes a discharge auger for moving the grain in the tube. A separate transfer or sweep auger is positioned within the bin extending outward from the hopper. The sweep auger is driven through a linkage including a drive shaft extending from outside the bin to a gear box positioned within the hopper. The discharge auger associated with the grain tube is driven by the same motor through a separate linkage. The linkages are arranged for separate and sequential control of the sweep auger and the discharge auger.

    摘要翻译: 改进的底部谷仓料斗排料结构包括一个集中设置在粮仓仓底部的料斗。 谷物管从料斗延伸到箱的外部,并且包括用于使管中的谷物移动的排出螺旋推运器。 单独的转移或吹扫螺旋钻定位在从料斗向外延伸的箱中。 吹扫螺旋推动器通过联动装置驱动,该联动装置包括从箱的外部延伸到位于料斗内的齿轮箱的驱动轴。 与颗粒管相关联的排放螺旋推运器由相同的电动机通过单独的连杆驱动。 连杆被布置成用于单独和顺序地控制吹扫螺旋推运器和排放螺旋推运器。

    Sensor geometry for improved package stress isolation
    62.
    发明授权
    Sensor geometry for improved package stress isolation 有权
    传感器几何形状,用于改进封装应力隔离

    公开(公告)号:US08082798B2

    公开(公告)日:2011-12-27

    申请号:US12857380

    申请日:2010-08-16

    IPC分类号: G01L1/00

    摘要: The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.

    摘要翻译: 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上,保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性,并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积,从而与包装形成牢固的结合。

    SENSOR GEOMETRY FOR IMPROVED PACKAGE STRESS ISOLATION
    63.
    发明申请
    SENSOR GEOMETRY FOR IMPROVED PACKAGE STRESS ISOLATION 有权
    传感器几何改进包装应力隔离

    公开(公告)号:US20100301435A1

    公开(公告)日:2010-12-02

    申请号:US12857380

    申请日:2010-08-16

    IPC分类号: H01L29/84 H01L21/02 H01L23/12

    摘要: The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.

    摘要翻译: 公开了用于改进封装应力隔离的传感器几何形状。 背板上的沉孔提高了传感器的应力隔离性能。 沉头孔沉浸在背板的壁上,保持与包装件的接触面积。 可以调节沉孔的深度和直径以找到允许背板吸收更多包装应力的几何形状。 使背板的壁变薄使其较不刚性,并且允许背板吸收在与封装的界面处产生的更多的应力。 沉孔还在背板的底部保持较大的表面积,从而与包装形成牢固的结合。

    Method and apparatus for controlling the sensitivity and value of a capacitive humidity sensor
    64.
    发明授权
    Method and apparatus for controlling the sensitivity and value of a capacitive humidity sensor 有权
    用于控制电容式湿度传感器的灵敏度和值的方法和装置

    公开(公告)号:US07710128B2

    公开(公告)日:2010-05-04

    申请号:US11518649

    申请日:2006-09-09

    IPC分类号: G01R27/26

    CPC分类号: G01N27/225

    摘要: A humidity sensor apparatus and method of forming the same. A substrate can be provided upon which a plurality of humidity sensing components are disposed to form a humidity sensor thereof. Each humidity sensing component generally includes an associated particular parasitic capacitance. This parasitic capacitance is utilized to reduce and/or control a sensitivity and a total capacitance value associated with the humidity sensor without increasing a size of the humidity sensor and/or humidity sensor components (e.g., capacitors).

    摘要翻译: 一种湿度传感器装置及其形成方法。 可以设置基板,在基板上设置多个湿度感测部件以形成其湿度传感器。 每个湿度感测组件通常包括相关联的特定寄生电容。 这种寄生电容用于在不增加湿度传感器和/或湿度传感器部件(例如电容器)的尺寸的情况下减少和/或控制与湿度传感器相关联的灵敏度和总电容值。

    Structure for capacitive balancing of integrated relative humidity sensor
    65.
    发明授权
    Structure for capacitive balancing of integrated relative humidity sensor 有权
    集成式相对湿度传感器的电容平衡结构

    公开(公告)号:US07683636B2

    公开(公告)日:2010-03-23

    申请号:US11977799

    申请日:2007-10-26

    IPC分类号: G01R27/26 H01G5/012

    CPC分类号: G01N27/223

    摘要: An improved relative humidity sensor apparatus that provides a more accurate measurement of humidity in the presence of water condensation. A series capacitive sensor includes a thin porous platinum top plate, a humidity sensitive polyimide dielectric, and two metal bottom plates on a semiconductor substrate. The two capacitors can be wired in series such that the metal bottom plates form independent, electrically driven connections. The thin top layer can form a top plate. Changes in humidity affect the humidity sensitive dielectric thereby causing changes in the capacitive value. A P-well layer and a P-plus layer can be added at the perimeter of the substrate to create a path for a parasitic capacitance caused by water condensation to connect to one or more connection nodes, thereby preventing erroneous measurements of humidity in the presence of water condensation.

    摘要翻译: 一种改进的相对湿度传感器装置,其在水凝结的存在下提供更准确的湿度测量。 串联电容传感器包括薄的多孔铂顶板,湿度敏感的聚酰亚胺电介质和半导体衬底上的两个金属底板。 两个电容器可以串联布线,使得金属底板形成独立的电驱动连接。 薄顶层可以形成顶板。 湿度变化会影响湿度敏感的电介质,从而引起电容值的变化。 可以在衬底的周边添加P阱层和P加层以产生由水冷凝引起的寄生电容的路径以连接到一个或多个连接节点,从而防止存在的湿度的错误测量 的水凝结。

    SMALL GAUGE PRESSURE SENSOR USING WAFER BONDING AND ELECTROCHEMICAL ETCH STOPPING
    67.
    发明申请
    SMALL GAUGE PRESSURE SENSOR USING WAFER BONDING AND ELECTROCHEMICAL ETCH STOPPING 有权
    小型压力传感器采用波峰焊和电化学灭弧

    公开(公告)号:US20090007681A1

    公开(公告)日:2009-01-08

    申请号:US11825237

    申请日:2007-07-05

    IPC分类号: G01L9/06 H01B13/00

    CPC分类号: G01L9/0042 G01L9/0054

    摘要: A gauge pressure sensor apparatus and a method of forming the same. A constraint wafer can be partially etched to set the diaphragm size, followed by bonding to a top wafer. The thickness of the top wafer is either the desired diaphragm thickness or is thinned to the desired thickness after bonding. The bonding of top wafer and constraint wafer enables electrochemical etch stopping. This allows the media conduit to be etched through the back of the constraint wafer and an electrical signal produced when the etching reaches the diaphragm. The process prevents the diaphragm from being over-etched. The invention allows the die size to be smaller than die where the diaphragm size is set by etching from the back side.

    摘要翻译: 表压传感器装置及其形成方法。 可以部分地蚀刻约束晶片以设置膜片尺寸,然后粘结到顶部晶片。 顶部晶片的厚度是所需的隔膜厚度,或者在粘结后被减薄到所需的厚度。 顶部晶片和约束晶片的结合使得电化学蚀刻停止。 这允许介质管道被蚀刻通过约束晶片的背面和当蚀刻到达隔膜时产生的电信号。 该过程防止隔膜过度蚀刻。 本发明允许模具尺寸小于通过从背面蚀刻设置膜片尺寸的模具。

    Exhaust system for a marine propulsion device having a driveshaft extending vertically through a bottom portion of a boat hull
    68.
    发明授权
    Exhaust system for a marine propulsion device having a driveshaft extending vertically through a bottom portion of a boat hull 有权
    用于具有垂直延伸穿过船体底部的驱动轴的船用推进装置的排气系统

    公开(公告)号:US07387556B1

    公开(公告)日:2008-06-17

    申请号:US11364957

    申请日:2006-03-01

    申请人: Richard A. Davis

    发明人: Richard A. Davis

    IPC分类号: B63H20/00 B63H23/36

    CPC分类号: B63H21/32 B63H20/26

    摘要: An exhaust system for a marine propulsion device directs a flow of exhaust gas from an engine located within the marine vessel, and preferably within a bilge portion of the marine vessel, through a housing which is rotatable and supported below the marine vessel. The exhaust passageway extends through an interface between stationary and rotatable portions of the marine propulsion device, through a cavity formed in the housing, and outwardly through hubs of pusher propellers to conduct the exhaust gas away from the propellers without causing a deleterious condition referred to as ventilation.

    摘要翻译: 用于船舶推进装置的排气系统通过可旋转和支撑在船舶下方的壳体引导来自位于海洋船舶内的发动机,优选在船舶的舱底部分内的发动机的排气流。 排气通道延伸穿过船舶推进装置的固定和可旋转部分之间的界面,通过形成在壳体中的空腔,并且通过推进器螺旋桨的毂向外延伸,以使排气远离螺旋桨而不引起有害的状况,称为 通风。

    Method and apparatus for controlling the sensitivity and value of a capacitive humidity sensor
    69.
    发明申请
    Method and apparatus for controlling the sensitivity and value of a capacitive humidity sensor 有权
    用于控制电容式湿度传感器的灵敏度和值的方法和装置

    公开(公告)号:US20080061802A1

    公开(公告)日:2008-03-13

    申请号:US11518649

    申请日:2006-09-09

    IPC分类号: G01R27/26

    CPC分类号: G01N27/225

    摘要: A humidity sensor apparatus and method of forming the same. A substrate can be provided upon which a plurality of humidity sensing components are disposed to form a humidity sensor thereof. Each humidity sensing component generally includes an associated particular parasitic capacitance. This parasitic capacitance is utilized to reduce and/or control a sensitivity and a total capacitance value associated with the humidity sensor without increasing a size of the humidity sensor and/or humidity sensor components (e.g., capacitors).

    摘要翻译: 一种湿度传感器装置及其形成方法。 可以设置基板,在基板上设置多个湿度感测部件以形成其湿度传感器。 每个湿度感测组件通常包括相关联的特定寄生电容。 这种寄生电容用于在不增加湿度传感器和/或湿度传感器部件(例如电容器)的尺寸的情况下减少和/或控制与湿度传感器相关联的灵敏度和总电容值。

    Method to reduce die edge shorting on pressure sensors using conductive elastomeric seals
    70.
    发明申请
    Method to reduce die edge shorting on pressure sensors using conductive elastomeric seals 有权
    使用导电弹性体密封件减少压力传感器上的模头边缘短路的方法

    公开(公告)号:US20070289387A1

    公开(公告)日:2007-12-20

    申请号:US11453509

    申请日:2006-06-15

    IPC分类号: G01L9/00

    摘要: A pressure sensor includes a sensing element fabricated on an N-type epitaxial layer grown on a P-type substrate, a P-type isolation region located around the edge of the sensing element die and in contact with the P-type substrate, and a conductive elastomeric seal engaging the P-type isolation region prevents shorting of the conductive elastomeric seal with the N-type epitaxial layer of the sensing element die. A method of making a pressure sensor comprises growing an n-type epitaxy layer on a p-type substrate wafer, resulting in a pressure sensor die and substrate having an edge, obtaining a mask adapted for fabricating an isolation diffusion layer around the edge using P-type material, and creating an isolation layer diffusion using P-type doping material around the edge using the mask. A conductive elastomeric seal can then be placed over the sensor die to make electrical contact to the package.

    摘要翻译: 压力传感器包括制造在P型衬底上生长的N型外延层上的感测元件,位于感测元件裸片的边缘周围并与P型衬底接触的P型隔离区,以及 接合P型隔离区域的导电弹性体密封件防止导电弹性体密封件与感测元件裸片的N型外延层短路。 一种制造压力传感器的方法包括在p型衬底晶片上生长n型外延层,从而产生具有边缘的压力传感器管芯和衬底,获得适于使用P制造围绕边缘的隔离扩散层的掩模 并使用掩模在边缘周围使用P型掺杂材料产生隔离层扩散。 然后可以将导电弹性体密封件放置在传感器管芯上方以与封装件电接触。