摘要:
An improved bottom grain bin auger discharge construction includes a hopper centrally disposed in the bottom of a grain storage bin. A grain tube extends from the hopper to the outside of the bin and includes a discharge auger for moving the grain in the tube. A separate transfer or sweep auger is positioned within the bin extending outward from the hopper. The sweep auger is driven through a linkage including a drive shaft extending from outside the bin to a gear box positioned within the hopper. The discharge auger associated with the grain tube is driven by the same motor through a separate linkage. The linkages are arranged for separate and sequential control of the sweep auger and the discharge auger.
摘要:
The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.
摘要:
The sensor geometry for improved package stress isolation is disclosed. A counterbore on the backing plate improves stress isolation properties of the sensor. The counterbore thins the wall of the backing plate maintaining the contact area with the package. The depth and diameter of the counterbore can be adjusted to find geometry for allowing the backing plate to absorb more package stresses. Thinning the wall of the backing plate make it less rigid and allows the backing plate to absorb more of the stresses produced at the interface with the package. The counterbore also keeps a large surface area at the bottom of the backing plate creating a strong bond with the package.
摘要:
A humidity sensor apparatus and method of forming the same. A substrate can be provided upon which a plurality of humidity sensing components are disposed to form a humidity sensor thereof. Each humidity sensing component generally includes an associated particular parasitic capacitance. This parasitic capacitance is utilized to reduce and/or control a sensitivity and a total capacitance value associated with the humidity sensor without increasing a size of the humidity sensor and/or humidity sensor components (e.g., capacitors).
摘要:
An improved relative humidity sensor apparatus that provides a more accurate measurement of humidity in the presence of water condensation. A series capacitive sensor includes a thin porous platinum top plate, a humidity sensitive polyimide dielectric, and two metal bottom plates on a semiconductor substrate. The two capacitors can be wired in series such that the metal bottom plates form independent, electrically driven connections. The thin top layer can form a top plate. Changes in humidity affect the humidity sensitive dielectric thereby causing changes in the capacitive value. A P-well layer and a P-plus layer can be added at the perimeter of the substrate to create a path for a parasitic capacitance caused by water condensation to connect to one or more connection nodes, thereby preventing erroneous measurements of humidity in the presence of water condensation.
摘要:
A cooling system for a marine engine having a turbocharger provides for the flow of coolant through heat emitting objects prior to flowing through a coolant jacket of the turbocharger itself. This avoids the potentially disadvantageous circumstance of directing cold water directly from a body of water through the cooling jacket of the turbocharger. Both open loop and closed loop versions of the invention are illustrated and described.
摘要:
A gauge pressure sensor apparatus and a method of forming the same. A constraint wafer can be partially etched to set the diaphragm size, followed by bonding to a top wafer. The thickness of the top wafer is either the desired diaphragm thickness or is thinned to the desired thickness after bonding. The bonding of top wafer and constraint wafer enables electrochemical etch stopping. This allows the media conduit to be etched through the back of the constraint wafer and an electrical signal produced when the etching reaches the diaphragm. The process prevents the diaphragm from being over-etched. The invention allows the die size to be smaller than die where the diaphragm size is set by etching from the back side.
摘要:
An exhaust system for a marine propulsion device directs a flow of exhaust gas from an engine located within the marine vessel, and preferably within a bilge portion of the marine vessel, through a housing which is rotatable and supported below the marine vessel. The exhaust passageway extends through an interface between stationary and rotatable portions of the marine propulsion device, through a cavity formed in the housing, and outwardly through hubs of pusher propellers to conduct the exhaust gas away from the propellers without causing a deleterious condition referred to as ventilation.
摘要:
A humidity sensor apparatus and method of forming the same. A substrate can be provided upon which a plurality of humidity sensing components are disposed to form a humidity sensor thereof. Each humidity sensing component generally includes an associated particular parasitic capacitance. This parasitic capacitance is utilized to reduce and/or control a sensitivity and a total capacitance value associated with the humidity sensor without increasing a size of the humidity sensor and/or humidity sensor components (e.g., capacitors).
摘要:
A pressure sensor includes a sensing element fabricated on an N-type epitaxial layer grown on a P-type substrate, a P-type isolation region located around the edge of the sensing element die and in contact with the P-type substrate, and a conductive elastomeric seal engaging the P-type isolation region prevents shorting of the conductive elastomeric seal with the N-type epitaxial layer of the sensing element die. A method of making a pressure sensor comprises growing an n-type epitaxy layer on a p-type substrate wafer, resulting in a pressure sensor die and substrate having an edge, obtaining a mask adapted for fabricating an isolation diffusion layer around the edge using P-type material, and creating an isolation layer diffusion using P-type doping material around the edge using the mask. A conductive elastomeric seal can then be placed over the sensor die to make electrical contact to the package.