公开(公告)号：US08338271B2

公开(公告)日：2012-12-25

申请号：US13235936

申请日：2011-09-19

申请人： Ryuji Sugiura ,  Takeshi Sakamoto

发明人： Ryuji Sugiura ,  Takeshi Sakamoto

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  C03B33/0222

摘要： An object to be processed can be cut highly accurately along a line to cut.An object to be processed 1 is irradiated with laser light while locating a converging point within a silicon wafer 11, and the converging point is relatively moved along a line to cut 5, so as to form modified regions M1, M2 positioned within the object 1 along the line to cut 5, and then a modified region M3 positioned between the modified regions M1, M2 within the object 1.

摘要翻译： 可以沿着切割线高精度地切割待处理的物体。 在将硅晶片11内的会聚点定位的同时用激光照射被处理体1，并且会聚点沿切割线5相对移动，以形成位于物体1内的改质区域M1，M2 沿着切割线5，然后是位于对象1内的修改区域M1，M2之间的修改区域M3。

公开(公告)号：US20120237211A1

公开(公告)日：2012-09-20

申请号：US13411794

申请日：2012-03-05

申请人： Hiroshi IIZUKA ,  Takeshi Sakamoto

发明人： Hiroshi IIZUKA ,  Takeshi Sakamoto

IPC分类号： H04B10/08 ,  H04B10/06

CPC分类号： H04B10/611 ,  H04B10/61 ,  H04B10/6164

摘要： There is provided an optical receiving apparatus, including a receiver configured to perform coherent reception by mixing first light of a received optical signal and second light generated by a local oscillator, a monitor configured to monitor a first frequency of the first light, and a controller configured to control a second frequency of the second light, based on a difference between the first frequency and the second frequency so as to reduce the difference.

摘要翻译： 提供了一种光接收装置，包括：接收机，被配置为通过混合接收的光信号的第一光和由本地振荡器产生的第二光来执行相干接收;监视器，被配置为监视第一光的第一频率;以及控制器 被配置为基于第一频率和第二频率之间的差来控制第二光的第二频率，以便减小差异。

公开(公告)号：US08247311B2

公开(公告)日：2012-08-21

申请号：US12063560

申请日：2006-08-04

申请人： Takeshi Sakamoto ,  Kenichi Muramatsu

发明人： Takeshi Sakamoto ,  Kenichi Muramatsu

IPC分类号： H01L21/00

CPC分类号： B28D5/0011 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A laser processing method for preventing particles from occurring from cut sections of chips obtained by cutting a silicon wafer is provided. An irradiation condition of laser light L for forming modified regions 77 to 712 is made different from an irradiation condition of laser light L for forming the modified regions 713 to 719 such as to correct the spherical aberration of laser light L in areas where the depth from the front face 3 of a silicon wafer 11 is 335 μm to 525 μm. Therefore, even when the silicon wafer 11 and a functional device layer 16 are cut into semiconductor chips from modified regions 71 to 719 acting as a cutting start point, twist hackles do not appear remarkably in the areas where the depth is 335 μm to 525 μm, whereby particles are hard to occur.

摘要翻译： 提供了一种用于防止由切割硅晶片获得的切屑切割部分发生颗粒的激光加工方法。 使形成改质区域77〜712的激光L的照射条件与用于形成改质区域713〜719的激光L的照射条件不同，例如将激光L的球面像差校正为 硅晶片11的正面3为335μm〜525μm。 因此，即使将硅晶片11和功能元件层16从作为切割起点的改质区域71〜719切割成半导体芯片，在深度为335μm〜525μm的区域中也不会显着出现扭曲 ，由此难以发生颗粒。

公开(公告)号：US20110309060A1

公开(公告)日：2011-12-22

申请号：US13107056

申请日：2011-05-13

申请人： Hiroyuki Iwaki ,  Takafumi Ogiwara ,  Takeshi Sakamoto ,  Masaharu Hoshikawa ,  Kazuhiro Atsumi ,  Daisuke Kawaguchi

发明人： Hiroyuki Iwaki ,  Takafumi Ogiwara ,  Takeshi Sakamoto ,  Masaharu Hoshikawa ,  Kazuhiro Atsumi ,  Daisuke Kawaguchi

IPC分类号： B23K26/00

CPC分类号： B23K26/40 ,  B23K26/53 ,  B23K2103/50

摘要： A method of cutting an object to be processed comprises the steps of irradiating an object to be processed with a laser light which is an elliptically-polarized light having an ellipticity other than 1 such that a direction of polarization of the laser light intersects a line to cut the object and a thickness direction of the object, while locating a converging point of the laser light within the object, so as to form a modified region within the object along the line and generate a fracture from the modified region in the thickness direction of the object, and causing the fracture to reach front and rear faces of the object so as to cut the object along the line.

摘要翻译： 切割待处理物体的方法包括以下步骤：用激光照射被处理物体，所述激光是椭圆偏振光以外的椭圆偏振光以外的激光，使得激光的偏振方向与 切割物体和物体的厚度方向，同时将激光的会聚点定位在物体内，以沿着线形成在物体内的改质区域，并从该改质区域在厚度方向上产生断裂 并且使裂缝到达物体的前后面以沿着该线切割物体。

公开(公告)号：US08033350B2

公开(公告)日：2011-10-11

申请号：US11585840

申请日：2006-10-25

申请人： Yasuo Ono ,  Norio Tsuruta ,  Takeshi Sakamoto ,  Masaki Koike

发明人： Yasuo Ono ,  Norio Tsuruta ,  Takeshi Sakamoto ,  Masaki Koike

IPC分类号： B60W20/00

CPC分类号： B60W20/00 ,  B60W10/06 ,  F02N11/0807 ,  F02N11/0811 ,  F02N11/12 ,  Y10S903/93

摘要： A starting control apparatus that automatically discriminates configuration of a vehicle on which the starting control apparatus is mounted, executes an appropriate starting control, and be widely used is provided. The starting control apparatus prestores therein computer program codes for performing a starting control for normal vehicle and a starting control for hybrid vehicle, discriminates between normal vehicle and hybrid vehicle about the vehicle on which the starting control apparatus is mounted on, and executes one of the starting controls corresponding to a result of discrimination between normal vehicle and hybrid vehicle.

摘要翻译： 提供一种起动控制装置，其自动识别安装有起动控制装置的车辆的构造，执行适当的起动控制并被广泛使用。 启动控制装置在其中预先存储有用于执行正常车辆的起动控制的计算机程序代码和混合动力车辆的起动控制，在正常车辆和混合动力车辆之间识别安装有起动控制装置的车辆，并执行其中之一 对应于正常车辆和混合动力车辆之间的鉴别结果的起动控制。

公开(公告)号：US08026154B2

公开(公告)日：2011-09-27

申请号：US12305497

申请日：2007-06-06

申请人： Takeshi Sakamoto

发明人： Takeshi Sakamoto

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/50 ,  B28D5/0011 ,  C03B33/0222

摘要： An object to be processed is restrained from warping at the time of laser processing. A modified region M2 is formed within a wafer 11, and fractures a2, b2 extending in directions parallel to the thickness direction of the wafer 11 and tilted with respect to a plane including lines 5 are generated from the modified region M2. A modified region M3 is formed within the wafer 11, and a fracture a3 extending in a direction parallel to the thickness direction of the wafer 11 and tilted with respect to the plane including the lines 5 is generated from the modified region M3 so as to connect with the fracture b2. That is, the fractures a2, a3, b2 are generated so as to be connected together. Therefore, at the time of laser processing, the fractures cause both side parts holding the lines to cut 5 therebetween in the wafer 11 to mesh with each other, whereby internal stresses occurring in a direction parallel to the thickness direction of the wafer 11 and perpendicular to the surface including the lines 5 when the modified regions are formed can be reduced.

摘要翻译： 在激光加工时，抑制被处理物体发生翘曲。 在晶片11内形成有改质区域M2，并且从改质区域M2产生从平行于晶片11的厚度方向延伸的方向相对于包含线5的面倾斜的断裂的a2，b2。 在晶片11内形成改质区域M3，从修正区域M3产生沿与晶片11的厚度方向平行的方向延伸且相对于包含线5的平面倾斜的断面a3， 与骨折b2。 也就是说，产生断裂a2，a3，b2以便连接在一起。 因此，在激光加工时，由于在晶片11中使夹着切断线5的两个部分彼此啮合，因此在与晶片11的厚度方向平行的方向上产生内应力， 可以减少形成修饰区域时包括线5的表面。

公开(公告)号：US07939430B2

公开(公告)日：2011-05-10

申请号：US11667538

申请日：2005-11-10

申请人： Takeshi Sakamoto ,  Ryuji Sugiura

发明人： Takeshi Sakamoto ,  Ryuji Sugiura

IPC分类号： H01L31/00

CPC分类号： H01L21/78 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B28D5/0052 ,  C03B33/074 ,  C03B33/091

摘要： A laser processing method is provided, which, when cutting an object to be processed comprising a substrate and a multilayer part, formed on a front face of the substrate, including a functional device, can cut the multilayer part with a high precision in particular.In a state where a protective tape 22 is attached to the front face 16a of a multilayer part 16, a substrate 4 is irradiated with laser light L while using its rear face 4b as a laser light entrance surface, so as to form a modified region 7 within the substrate 4 along a line to cut, thereby generating a fracture 24 reaching the front face 4a of the substrate 4 from a front-side end part 7a of the modified region 7. Attaching an expandable tape to the rear face 4b of the substrate 4 and expanding it in the state where such a fracture 24 is generated can cut not only the substrate 4 but also the multilayer part 16 on the line to cut, i.e., interlayer insulating films 17a, 17b, with a favorable precision along the line to cut.

摘要翻译： 提供一种激光加工方法，其可以在包括功能元件的基板的正面上形成的包括基板和多层部的被加工物进行切割时，能够高精度地切割多层部。 在保护带22附着到多层部16的前表面16a的状态下，用激光L照射基板4，同时使用其背面4b作为激光入射面，从而形成改质区域 沿着切割线在衬底4内部，从而从修改区域7的前侧端部7a产生到达衬底4的前表面4a的断裂24.将可膨胀带附接到 在产生这种断裂的状态下使基板4膨胀的状态不仅可以切割基板4而且还可以切割线路上的多层部16即线间绝缘膜17a，17b， 切割。

公开(公告)号：US07831149B2

公开(公告)日：2010-11-09

申请号：US11892143

申请日：2007-08-20

申请人： Takeshi Sakamoto

发明人： Takeshi Sakamoto

IPC分类号： H04J14/02

CPC分类号： H04B10/0775 ,  H04B2210/258 ,  H04J14/0204 ,  H04J14/0205 ,  H04J14/0212 ,  H04J14/0219 ,  H04J14/0221 ,  H04J14/0279 ,  H04J14/0283 ,  H04J14/0291 ,  H04J14/0294

摘要： An optical transmission device capable of preventing deterioration in the transmission quality of a signal beam. A wavelength-multiplexed signal beam from a transmission path is split by a splitter, and the split signal beams are input to first and second optical paths, respectively. An add/drop unit for adding/dropping a wavelength-multiplexed signal beam is removably insertable in the second optical path. A switch outputs the wavelength-multiplexed signal beam, received from one of the first and second optical paths, to an optical amplifier. The optical amplifier amplifies the wavelength-multiplexed signal beam output from the switch and outputs the amplified signal beam to a subsequent circuit. A supervisory controller collects alarm information from the optical transmission device as well as from other optical transmission devices, and controls the switch in accordance with the collected alarm information such that the wavelength-multiplexed signal beam from the second optical path is input to the optical amplifier.

摘要翻译： 一种能够防止信号光束的传输质量恶化的光传输装置。 来自传输路径的波长多路复用信号光束被分离器分离，并且分离信号光束分别被输入到第一和第二光路。 用于添加/删除波分复用信号光束的分插单元可拆卸地插入到第二光路中。 开关将从第一和第二光路中的一个接收的波长复用信号光束输出到光放大器。 光放大器放大从开关输出的波长复用信号光束，并将放大的信号光束输出到后续电路。 监控控制器从光传输装置以及其他光传输装置收集警报信息，并根据收集到的报警信息控制开关，使得来自第二光路的波长多路复用信号光束被输入到光放大器 。

公开(公告)号：US07756422B2

公开(公告)日：2010-07-13

申请号：US11502535

申请日：2006-08-11

申请人： Takeshi Sakamoto ,  Kosuke Komaki ,  Yuji Shimada ,  Takuji Maeda

发明人： Takeshi Sakamoto ,  Kosuke Komaki ,  Yuji Shimada ,  Takuji Maeda

IPC分类号： H04B10/00

CPC分类号： H04B10/07

摘要： During initial start-up of an optical communication system, an ASE reference span loss is calculated based on transmitting power and received power of ASE light generated by an optical amplifier, and an OSC reference span loss is calculated based on the transmitting power and the received power of OSC light. During normal operation of the optical communication system, a span loss is calculated using the OSC light, and an amount of change in the span loss representing a difference between the span loss and the OSC reference span loss is calculated. A current span loss between a transmitting station and a receiving station is calculated by adding the amount of change in the span loss to the ASE reference span loss.

摘要翻译： 在光通信系统的初始启动期间，基于由光放大器产生的ASE光的发射功率和接收功率来计算ASE参考跨度损耗，并且基于发射功率和接收到的功率来计算OSC参考跨度损耗 OSC灯的功率。 在光通信系统的正常工作期间，使用OSC灯计算跨度损耗，并且计算表示跨度损耗与OSC参考跨度损耗之间的差异的跨度损耗的变化量。 通过将跨度损耗的变化量与ASE参考跨度损耗相加来计算发送站和接收站之间的电流跨度损耗。

公开(公告)号：US20100079856A1

公开(公告)日：2010-04-01

申请号：US12461255

申请日：2009-08-05

申请人： Takeshi Sakamoto

发明人： Takeshi Sakamoto

IPC分类号： H01S3/00

CPC分类号： H04B10/2942

摘要： In an optical transmission system, a controller acquires a noise light loss value, which indicates a loss that noise light output from an upstream-side optical amplifier undergoes during propagation to a downstream-side optical amplifier through an optical loss medium, and a signal beam loss value, which indicates a loss that a signal beam output from the upstream-side optical amplifier undergoes during propagation to the downstream-side optical amplifier through the optical loss medium, obtains, as a loss difference, a difference between the noise light loss value and the signal beam loss value and, when setting up the downstream-side optical amplifier, determines the gain of the downstream-side optical amplifier by compensating the loss difference.

摘要翻译： 在光传输系统中，控制器获取噪声光损失值，其表示通过光损耗介质向下游侧光放大器传播期间从上游侧光放大器输出的噪声光的损耗，以及信号光束 表示从上游侧光放大器输出的信号光束在通过光损耗介质向下游侧光放大器传播期间经历的损耗值，作为损耗差，获得噪声光损失值 和信号光束损耗值，并且当设置下游侧光放大器时，通过补偿损耗差来确定下游侧光放大器的增益。