公开(公告)号：US20100270564A1

公开(公告)日：2010-10-28

申请号：US12832469

申请日：2010-07-08

申请人： Dae Yeon Kim ,  Young Sam Park

发明人： Dae Yeon Kim ,  Young Sam Park

IPC分类号： H01L33/48

CPC分类号： H01L33/58 ,  H01L33/46

摘要： The invention relates to an LED package having a large beam angle of light emitted from an LED, simplifying a shape of a lens and an assembly process, and to a backlight unit using the same. The LED package includes a housing with a seating recess formed therein and at least one LED seated in the seating recess. The LED package also includes a lens having a predetermined sag on an upper side thereof, covering an upper part of the LED. The LED package and the backlight unit using the same can emit light uniformly without bright spots formed in an output screen, uses a simpler shaped lens with an increased beam angle, and minimizes a color mixing region to achieve miniaturization.

摘要翻译： 本发明涉及一种LED封装，其具有从LED发射的大的光束角度，简化透镜的形状和组装过程，以及使用该LED封装的背光单元。 LED封装包括壳体，其具有形成在其中的座部凹部和位于座部凹部中的至少一个LED。 LED封装还包括在其上侧具有预定凹陷的透镜，覆盖LED的上部。 LED封装和使用该LED封装的背光单元可以均匀地发光而不会在输出屏幕中形成亮点，使用具有增大的光束角的更简单形状的透镜，并且使混色区域最小化以实现小型化。

公开(公告)号：US07771081B2

公开(公告)日：2010-08-10

申请号：US12497009

申请日：2009-07-02

申请人： Dae Yeon Kim ,  Young Sam Park

发明人： Dae Yeon Kim ,  Young Sam Park

IPC分类号： F21V8/00

CPC分类号： H01L33/58 ,  H01L33/46

摘要： The invention relates to an LED package having a large beam angle of light emitted from an LED, simplifying a shape of a lens and an assembly process, and to a backlight unit using the same. The LED package includes a housing with a seating recess formed therein and at least one LED seated in the seating recess. The LED package also includes a lens having a predetermined sag on an upper side thereof, covering an upper part of the LED. The LED package and the backlight unit using the same can emit light uniformly without bright spots formed in an output screen, uses a simpler shaped lens with an increased beam angle, and minimizes a color mixing region to achieve miniaturization.

摘要翻译： 本发明涉及一种LED封装，其具有从LED发射的大的光束角度，简化透镜的形状和组装过程，以及使用该LED封装的背光单元。 LED封装包括壳体，其具有形成在其中的座部凹部和位于座部凹部中的至少一个LED。 LED封装还包括在其上侧具有预定凹陷的透镜，覆盖LED的上部。 LED封装和使用该LED封装的背光单元可以均匀地发光而不会在输出屏幕中形成亮点，使用具有增大的光束角的更简单形状的透镜，并且使混色区域最小化以实现小型化。

公开(公告)号：US08197090B2

公开(公告)日：2012-06-12

申请号：US12832469

申请日：2010-07-08

申请人： Dae Yeon Kim ,  Young Sam Park

发明人： Dae Yeon Kim ,  Young Sam Park

IPC分类号： F21V5/04

CPC分类号： H01L33/58 ,  H01L33/46

摘要： The invention relates to an LED package having a large beam angle of light emitted from an LED, simplifying a shape of a lens and an assembly process, and to a backlight unit using the same. The LED package includes a housing with a seating recess formed therein and at least one LED seated in the seating recess. The LED package also includes a lens having a predetermined sag on an upper side thereof, covering an upper part of the LED. The LED package and the backlight unit using the same can emit light uniformly without bright spots formed in an output screen, uses a simpler shaped lens with an increased beam angle, and minimizes a color mixing region to achieve miniaturization.

摘要翻译： 本发明涉及一种LED封装，其具有从LED发射的大的光束角度，简化透镜的形状和组装过程，以及使用该LED封装的背光单元。 LED封装包括壳体，其具有形成在其中的座部凹部和位于座部凹部中的至少一个LED。 LED封装还包括在其上侧具有预定凹陷的透镜，覆盖LED的上部。 LED封装和使用该LED封装的背光单元可以均匀地发光而不会在输出屏幕中形成亮点，使用具有增大的光束角的更简单形状的透镜，并且使混色区域最小化以实现小型化。

公开(公告)号：US07581853B2

公开(公告)日：2009-09-01

申请号：US11594756

申请日：2006-11-09

申请人： Dae Yeon Kim ,  Young Sam Park

发明人： Dae Yeon Kim ,  Young Sam Park

IPC分类号： F21V5/04

CPC分类号： H01L33/58 ,  H01L33/46

摘要： The invention relates to an LED package having a large beam angle of light emitted from an LED, simplifying a shape of a lens and an assembly process, and to a backlight unit using the same. The LED package includes a housing with a seating recess formed therein and at least one LED seated in the seating recess. The LED package also includes a lens having a predetermined sag on an upper side thereof, covering an upper part of the LED. The LED package and the backlight unit using the same can emit light uniformly without bright spots formed in an output screen, uses a simpler shaped lens with an increased beam angle, and minimizes a color mixing region to achieve miniaturization.

摘要翻译： 本发明涉及一种LED封装，其具有从LED发射的大的光束角度，简化透镜的形状和组装过程，以及使用该LED封装的背光单元。 LED封装包括壳体，其具有形成在其中的座部凹部和位于座部凹部中的至少一个LED。 LED封装还包括在其上侧具有预定凹陷的透镜，覆盖LED的上部。 LED封装和使用该LED封装的背光单元可以均匀地发光而不会在输出屏幕中形成亮点，使用具有增大的光束角的更简单形状的透镜，并且使混色区域最小化以实现小型化。

公开(公告)号：US08926114B2

公开(公告)日：2015-01-06

申请号：US13098698

申请日：2011-05-02

申请人： Jung Kyu Park ,  Young Sam Park ,  Sung A Choi ,  Jeong Eun Lim ,  Jin Mo Kim ,  Man Ki Hong ,  Tae Heon Han ,  Churl Wung Shin ,  Young Taek Kim ,  Dae Woon Hong ,  Young Geun Jun ,  Jung Kyu Kook

发明人： Jung Kyu Park ,  Young Sam Park ,  Sung A Choi ,  Jeong Eun Lim ,  Jin Mo Kim ,  Man Ki Hong ,  Tae Heon Han ,  Churl Wung Shin ,  Young Taek Kim ,  Dae Woon Hong ,  Young Geun Jun ,  Jung Kyu Kook

IPC分类号： G09F13/04 ,  G09F13/08 ,  G02B19/00 ,  G02F1/1335 ,  H01L33/58

CPC分类号： F21V11/00 ,  F21K9/60 ,  F21Y2115/10 ,  G02B19/0014 ,  G02B19/0061 ,  G02B19/0071 ,  G02F1/133603 ,  G02F1/133606 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light source module, a backlight unit, a display apparatus, a television set, and an illumination apparatus are provided. The light source module includes: one or more light source units including a light emitting element emitting light when electricity is applied thereto; and an optical sheet disposed above the light source units and exhibiting bidirectional transmittance distribution function characteristics having first and second peaks at radiation angles less than 0° and greater than 0°.

摘要翻译： 提供了光源模块，背光单元，显示装置，电视机和照明装置。 光源模块包括：一个或多个光源单元，包括当向其施加电力时发光的发光元件; 以及设置在光源单元上方并且在小于0°且大于0°的辐射角处具有第一和第二峰的双向透射分布函数特性的光学片。

公开(公告)号：US07115979B2

公开(公告)日：2006-10-03

申请号：US10954144

申请日：2004-09-30

申请人： Jung Kyu Park ,  Young Sam Park

发明人： Jung Kyu Park ,  Young Sam Park

IPC分类号： H01L23/495

CPC分类号： H01L33/58 ,  H01L33/483 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED package in which an LED chip a body has a cup part housing an LED chip. The cup part has a step formed in the outer circumference of the top thereof. A lens is mounted on the cup part, and has a flange extended downward from the outer circumference of the lens along the outside wall of the cup part to form a gap between the flange and the downward step of the cup part and to seal the gap from the outside. Resin material fills a space formed between the underside of the lens and the cup part and at least partially the gap formed between the step of the cup part and the lens flange. The resin material is prevented from leaking out of the LED package. The LED package of the invention prevents the creation of voids in the resin material surrounding the LED chip or the leakage of the resin material to the outside.

摘要翻译： 一种LED封装，其中LED芯片的主体具有容纳LED芯片的杯部分。 杯部具有在其顶部的外周形成的台阶。 透镜安装在杯部上，并且具有从透镜的外周沿杯部的外壁向下延伸的凸缘，以在凸缘与杯部的向下台阶之间形成间隙，并且密封间隙 从外部。 树脂材料填充在透镜的下侧和杯部之间形成的空间，并且至少部分地填充形成在杯部和台阶之间的间隙。 防止树脂材料泄漏出LED封装。 本发明的LED封装防止在LED芯片周围的树脂材料中产生空隙或树脂材料泄漏到外部。

公开(公告)号：US20050243576A1

公开(公告)日：2005-11-03

申请号：US10890201

申请日：2004-07-14

申请人： Jung Kyu Park ,  Chang Wook Kim ,  Young Sam Park

发明人： Jung Kyu Park ,  Chang Wook Kim ,  Young Sam Park

IPC分类号： F21S2/00 ,  F21V5/00 ,  F21V5/04 ,  F21V7/04 ,  F21Y101/02 ,  G02F1/1335 ,  G02F1/13357 ,  H01L33/00 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60

CPC分类号： G02F1/133603 ,  F21K9/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  Y10S362/80

摘要： The present invention provides a Light Emitting Diode (LED) array module for providing backlight, which can be used as an independent device with a plurality of LEDs being integrally packaged, and which can be universally used regardless of a screen size, and a backlight unit having the same. The LED array module used as a light source of backlight includes a bar-shaped Printed Circuit Board (PCB) on which conductive patterns for transmitting power are formed, a base formed on the PCB and made of a heat conductive material, a plurality of LED chips mounted on the base in a line and electrically connected to the conductive patterns of the PCB, a reflector formed to surround the plurality of the LED chips and adapted to reflect light radiated from the plurality of LED chips upward, and a lens formed above the plurality of LED chips and reflector to have a bar shape and adapted to diffuse the light radiated from the plurality of LED chips and reflector in a horizontal direction.

摘要翻译： 本发明提供了一种用于提供背光的发光二极管（LED）阵列模块，其可以用作具有整体封装的多个LED的独立装置，并且可以普遍使用，而不管屏幕尺寸如何，以及背光单元 有同样的 用作背光源的LED阵列模块包括形成有用于发射功率的导电图案的条形印刷电路板（PCB），形成在PCB上的由导热材料制成的基底，多个LED 芯片安装在基座上并与PCB的导电图形电连接，形成为围绕多个LED芯片的反射镜，并且适于反射从多个LED芯片向上辐射的光，以及形成在 多个LED芯片和反射器具有条形并且适于在水平方向上扩散从多个LED芯片和反射器辐射的光。

公开(公告)号：US20090166664A1

公开(公告)日：2009-07-02

申请号：US12327552

申请日：2008-12-03

申请人： Jung Kyu Park ,  Kun Yoo Ko ,  Young Sam Park ,  Seung Hwan Chol ,  Il Ku Kim

发明人： Jung Kyu Park ,  Kun Yoo Ko ,  Young Sam Park ,  Seung Hwan Chol ,  Il Ku Kim

IPC分类号： H01L33/00 ,  H01L21/24

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L33/44 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： There is provided a high power LED package and a method of manufacturing the same. The method includes: forming at least one chip mounting part and at least one through hole in a metal plate; forming an insulating layer of a predetermined thickness on an entire outer surface of the metal plate; forming an electrode part to be electrically connected to a light emitting chip mounted on the chip mounting part; and cutting the metal plate along a trimming line to separate the package. The LED package is free from thermal impact resulting from different thermal coefficients among components, thus ensuring stable heat radiation characteristics in a high temperature atmosphere. Also, the LED package is minimized in optical loss to improve optical characteristics. In addition, the LED package is simplified in a manufacturing and assembly process and thus can be manufactured in mass production at a lower cost.

摘要翻译： 提供了一种大功率LED封装及其制造方法。 该方法包括：在金属板中形成至少一个芯片安装部分和至少一个通孔; 在金属板的整个外表面上形成预定厚度的绝缘层; 形成电连接到安装在芯片安装部上的发光芯片的电极部; 并沿着修剪线切割金属板以分离包装。 LED封装不受组件之间不同热系数的热冲击，从而确保高温环境中的稳定的散热特性。 此外，LED封装在光损耗方面被最小化以改善光学特性。 此外，LED封装在制造和组装过程中被简化，因此可以以较低的成本批量生产。

公开(公告)号：US07217004B2

公开(公告)日：2007-05-15

申请号：US10890201

申请日：2004-07-14

申请人： Jung Kyu Park ,  Chang Wook Kim ,  Young Sam Park

发明人： Jung Kyu Park ,  Chang Wook Kim ,  Young Sam Park

IPC分类号： F21V1/00

CPC分类号： G02F1/133603 ,  F21K9/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  Y10S362/80

摘要： A Light Emitting Diode (LED) array module, which can be used as backlight, includes a bar-shaped Printed Circuit Board (PCB) on which conductive patterns for transmitting power are formed, a base formed on the PCB and made of a heat conductive material, a plurality of LED chips mounted on the base in a line and electrically connected to the conductive patterns of the PCB, a reflector formed to surround the plurality of the LED chips and adapted to reflect light radiated from the plurality of LED chips upward, and a lens formed above the plurality of LED chips and reflector to have a bar shape and adapted to diffuse the light radiated from the plurality of LED chips and reflector in a horizontal direction.

摘要翻译： 可用作背光的发光二极管（LED）阵列模块包括形成有用于传输功率的导电图案的条形印刷电路板（PCB），形成在PCB上并由导热 材料，多个安装在基座上的LED芯片并电连接到PCB的导电图案;反射器，形成为围绕多个LED芯片并适于反射从多个LED芯片辐射的光向上， 以及透镜，形成在所述多个LED芯片和所述反射器之上，以具有条形并且适于在从水平方向扩散从所述多个LED芯片和反射器辐射的光。

公开(公告)号：USD499075S1

公开(公告)日：2004-11-30

申请号：US29199049

申请日：2004-02-09

申请人： Joon Ho Yoon ,  Jung Kyu Park ,  Young Sam Park

设计人： Joon Ho Yoon ,  Jung Kyu Park ,  Young Sam Park